Whisker Test Report No 20050771 final - Maxim Integrated · Whisker Test Report # : 20050771 Rev.00...

Whisker Test Report # : 20050771Rev.00

WHISKER TEST REPORT(FINAL REPORT)

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General InformationFactory Amkor Technology Philippines – P2Plating Finish Matte Sn

Package Type PLCC HDLFPlating Chemistry ST380Plating Line T4BPost Plating Bake 150°C for 1 hour

Report Date : March 31, 2006Whisker Test Report # : 20050771

Prepared by : Sonny M. CoponReliability Engineer

Checked by : Roque BaliwanSection Manager, Rel/FA

Approved by : Bernard BaylonDepartment Manager, Rel/FA

Distribution List :

Danny Javelosa, Henry Carteciano, Greg Gabriel, Sandra Gonzales, Emy Pelaez-Arcillas, Charlie dela Cruz Jr., Rey Florogo, Leonida Dapula, Rodrigo Amor, AveletteMamparo, Marilou Tendido, P3RELLAB – ATPKwangBok Yang – WW Corp. PICRon Ellenberger, Keith Edwards – ATI



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DISCLAIMER. The whisker test procedures identified in this report are used for determiningthe presence of tin whiskers and are performed by Amkor, pursuant to current industry-accepted JEDEC standards. The whisker test procedures used herein are unproven andmay produce inconclusive results. Amkor makes no representation, warranty or guaranteeof any kind with respect to the field performance, quality or freedom from whisker-relatedfailures, of any package tested by Amkor using these procedures.



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1. Purpose

1.1. Whisker Test on PLCC HDLF 32lds (C151 Base Metal) ST380 Chemistry.

2. Scope: Mark (ü) the scope on the following

Process MaterialNew plating process ü New plating material

Modified plating process Modified plating material

Alternate source of materialAlternate manufacturing site ofmaterial

3. Conclusion

3.1. Total # of lots tested : ( 3 ) lot(s)3.2. Comment :

3.2.1. Whisker length measurement method applied for all the whiskers observed was theRadial measurement method. Eighteen (18) terminations per lot per readpoint wereSEM inspected and minimum of 2 longest whiskers per lot per readpoint werereported. Identified whiskers vary from one readpoint to another since the testobjective was to track the longest whisker growth among the samples.

3.2.2. Post 500cyc, 1000cyc, & 1500cyc exposure at –55°C/+85°C TC conditions showedwhisker growth in all 3 lots. Longest whiskers observed post 1500cyc were:− TC without precon: comp#2, term#9 with 23.48µm;− TC with 215°C simulated reflow: comp#1, term#8 with 29.05µm; and− TC with 255°C simulated reflow: comp#5, term#6 with 31.23µm.

3.2.3. No whisker was observed in all 3 lots after 4000hrs exposure both at 30°C/60%RHand 60°C/87%RH TH conditions.



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4. Package / Material Description

4.1. PackageType PLCC HDLFBody size 0.451 x 0.551 inchLead Count 32LLead Pitch 0.05 inchLead to Lead Gap 0.004 inch min

4.2. MaterialLead frame

Base metal alloy C151Temper (1/2 hard, etc.) ½ hardStamped/Etched L/F StampedL/F thickness 12 milsBarrier layer type N/ABarrier layer thickness N/A

4.3. Process DatesLot #1 Lot #2 Lot #3

Plating date/time 5/07/05 / 1400H 5/12/05 / 1000H 5/18/05 / 1100HPost bake date/time 5/07/05 / 1430H 5/12/05 / 1030H 5/18/05 / 1115HSimulated reflow date 7/27/05 7/27/05 7/27/05Board assembly date N/A N/A N/A30°C/60%RH start date 7/28/05 7/28/05 7/28/0560°C/87%RH start date 7/28/05 7/28/05 7/28/05-55°C/85°C start date 7/28/05 7/28/05 7/28/05

5. Attachments

5.1. Process Summary5.2. Workmanship Summary5.3. Whisker Test Summary and Photos5.4. Appendix



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5.1. Process Summary

Lot# : LOT-1

PROCESS MACHINE/EQUIPMENT

PARAMETERS MATERIALS

Plating Technic Descale Temperature 35°C Descale Solution Actronal 988Belt Speed 75 mm/sCurrent Density 145 ASF[Sn metal] 54.70 g/l[Bi metal] (if applicable) N/ABath Temperature 28°CBath Impurities• Pb 5.02 ppm• Cu 0.32 ppm• Fe 13.37 ppm• Ni 1.87 ppm• Zn 0.29 ppm• Ag 0.76 ppm

Post Plating Bake Yamato Hold Temperature 150°CDwell Time 60 minutesTotal Cycle Time 120 minutesN2 Gas Flow Rate 200 SCFH

Simulated Reflow Vitronics Peak Temperature 218°C@ 215°C Dwell Time > 183°C 84 seconds




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Lot# : LOT-2



Plating Technic Descale Temperature 35°C Descale Solution Actronal 988Belt Speed 75 mm/sCurrent Density 145 ASF[Sn metal] 48.70 g/l[Bi metal] (if applicable) N/ABath Temperature 28°CBath Impurities• Pb 5.02 ppm

• Cu 0.32 ppm• Fe 13.37 ppm• Ni 1.87 ppm• Zn 0.29 ppm• Ag 0.76 ppm

Post Plating Bake Yamato Hold Temperature 150°CDwell Time 60 minutesTotal Cycle Time 120 minutesN2 Gas Flow Rate 200 SCFH





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Lot# : LOT-3



Plating Technic Descale Temperature 35°C Descale Solution Actronal 988Belt Speed 75 mm/sCurrent Density 145 ASF[Sn metal] 49.90 g/l[Bi metal] (if applicable) N/ABath Temperature 28°CBath Impurities• Pb 5.02 ppm

• Cu 0.32 ppm• Fe 13.37 ppm• Ni 1.87 ppm• Zn 0.29 ppm• Ag 0.76 ppm

Post Plating Bake Yamato Hold Temperature 150 °CDwell Time 60 minutesTotal Cycle Time 120 minutesN2 Gas Flow Rate 200 SCFH





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5.2. Plating Workmanship Summary

Lot# : LOT-1Test DataProcess

/ SPEC No.Test Item SPEC # or

Criteria# Failure /

S. Size MAX MIN AVGResult

001-0530-2011 Visual 001-0322-2595 0/116 units N/A N/A N/A PASSED001-0522-2571 Plating thickness 400 – 700µ”

(10.0 – 17.5µm)

0/5 strips 529.4 453.9 497.3 PASSED

001-0522-2571 Deposit composition 100% Sn 5 rdgs N/A N/A N/A 100% Sn001-0234-2057 Carbon content 0.05% max. N/A N/A N/A N/A 0.01452% wt

Deposit impurities - Pb 0.1% max. N/A N/A N/A N/A 0.009%Stripping method Grain size range 1-5 µm N/A N/A N/A N/A



Criteria# Failure /



(10.0 – 17.5µm)

0/5 strips 589.2 428.6 461.5 PASSED





Criteria# Failure /



(10.0 – 17.5µm)

0/5 strips 519.4 439.3 481.5 PASSED





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5.3. Whisker Test Summary

5.3.1. Ambient Temperature/Humidity (30°C/60%RH)

ReadpointsLotNo.

Component # /Termination # 0 hr 1000 hr 2184 hr 3000 hr 4000 hr

Lot-1 Comp # 4 / Term # 21. none none none none noneLot-2 Comp # 2 / Term # 16. none none none none noneLot-3 Comp # 2 / Term # 14. none none none none none

SEM Photo @ Post 4000 hr

Lot-1: No whisker observed Lot-2: No whisker observed


Lot-3: No whisker observed



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5.3.2. High Temperature/Humidity (60°C/87%RH)

ReadpointsLotNo.


Lot-1 Comp # 2 / Term # 32 none none none none noneLot-2 Comp # 1 / Term # 1 . none none none none noneLot-3 Comp # 4 / Term # 30. none none none none none







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5.3.3. Thermal Cycling (-55/85°C)

ReadpointsLotNo.

Component # /Termination # 0 cyc 500 cyc 1000 cyc 1500 cyc

Lot-1 Comp # 2 / Term # 6 . none 14.69µm 17.47µm 15.23µmComp # 3 / Term # 2 . none 11.07µm - -Comp # 4 / Term # 3 . none - 15.41µm -Comp # 4 / Term # 9 . none - - 21.32µm

Lot-2 Comp # 2 / Term # 9 . none 20.51µm 20.59µm 23.48µmComp # 4 / Term # 4 . none 13.64µm - -Comp # 6 / Term # 3 . none - 17.51µm -Comp # 5 / Term # 3 . none - - 16.10µm

Lot-3 Comp # 3 / Term # 2 . none 11.37µm - -Comp # 6 / Term # 1 . none 15.70µm - 21.75µmComp # 2 / Term # 2 . none - 16.08µm -Comp # 4 / Term # 1 . none - 14.34µm 23.42µm

SEM Photo @ Post 500 cyc SEM Photo @ Post 1000 cyc

Longest whisker growth of 20.51µm Longest whisker growth of 20.59µm



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SEM Photo @ Post 1500 cyc

Longest whisker growth of 23.48µm



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5.3.4. Ambient Temperature/Humidity (30°C/60%RH) post 215°C simulated reflow

ReadpointsLotNo.


Lot-1 Comp # 6 / Term # 9 . none none none none noneLot-2 Comp # 4 / Term # 23. none none none none noneLot-3 Comp # 4 / Term # 28. none none none none none







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5.3.5. Ambient Temperature/Humidity (30°C/60%RH) post 255°C simulated reflow

ReadpointsLotNo.


Lot-1 Comp # 2 / Term # 2 . none none none none noneLot-2 Comp # 4 / Term # 7 . none none none none noneLot-3 Comp # 5 / Term # 4 . none none none none none







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5.3.6. High Temperature/Humidity (60°C/87%RH) post 215°C simulated reflow

ReadpointsLotNo.


Lot-1 Comp # 5 / Term # 6 . none none none none noneLot-2 Comp # 4 / Term # 13. none none none none noneLot-3 Comp # 2 / Term # 1 . none none none none none







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5.3.7. High Temperature/Humidity (60°C/87%RH) post 255°C simulated reflow

ReadpointsLotNo.


Lot-1 Comp # 2 / Term # 5 . none none none none noneLot-2 Comp # 3 / Term # 2 . none none none none noneLot-3 Comp # 4 / Term # 5 . none none none none none







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5.3.8. Thermal Cycling (-55/85°C) post 215°C simulated reflow

ReadpointsLotNo.


Lot-1 Comp # 4 / Term # 5 . none 14.90µm - -Comp # 5 / Term # 5 . none 16.67µm - -Comp # 1 / Term # 8 . none - 28.54µm 29.05µmComp # 3 / Term # 5 . none - 27.76µm 26.70µmComp # 6 / Term # 8 . none - - -

Lot-2 Comp # 1 / Term # 4 . none 12.81µm - -Comp # 3 / Term # 6 . none 14.71µm - -Comp # 4 / Term # 6 . none - 26.71µm 25.52µmComp # 5 / Term # 6 . none - 21.09µm 23.53µm

Lot-3 Comp # 1 / Term # 8 . none 12.42µm - 19.99µmComp # 3 / Term # 6 . none 17.82µm 18.53µm -Comp # 5 / Term # 8 . none - 16.77µm 19.93µm


Longest whisker growth of 17.82µm Longest whisker growth of 28.54m



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5.3.9. Thermal Cycling (-55/85°C) post 255°C simulated reflow

ReadpointsLotNo.


Lot-1 Comp # 1 / Term # 11 none 19.09µm - -Comp # 6 / Term # 19 none 18.13µm - 19.18µmComp # 2 / Term # 9 . none - 22.0µm 24.45µmComp # 5 / Term # 7 . none - 19.34µm -

Lot-2 Comp # 1 / Term # 10 none 18.83µm - -Comp # 5 / Term # 6 . none 26.53µm 31.03µm 31.23µmComp # 6 / Term # 15 none - 20.37µm -Comp # 3 / Term # 5 . none - - 20.62µm

Lot-3 Comp # 4 / Term # 1 . none 10.94µm - 16.11µmComp # 2 / Term # 3 . none 17.27µm 16.91µm 17.16µmComp # 6 / Term # 1 . none - 22.87µm -


Longest whisker growth of 26.53µm Longest whisker growth of 31.03µm



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5.4. Appendix

5.4.1. Inspection Equipment

5.4.1.1. Optical MicroscopeInstrument maker : OlympusModel number : SZ40Magnification : 40-60x

5.4.1.2. SEMInstrument maker : HitachiModel number : S3000NMagnification : 500kx

5.4.2. Reflow Profiles

5.4.2.1. Simulated 215°C Reflow



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5.4.2.2. Simulated 255°C Reflow

Whisker Test Report No 20050771 final - Maxim Integrated · Whisker Test Report # : 20050771 Rev.00...

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