Tin Whisker Growth Test Report Report #: WG-07-007...Tin whisker growth for package 8MSOP after 1000...

Report #: WG-07-007 of 12

MAXIM 8MSOP(Sn), 16TSLP(3*3) & SOT23-5-Cu (Sn)

Tin Whisker Growth Test Report Report #: WG-07-007

DISCLAIMER: PRODUCT RELIABILITY REPORT IS CONSIDERED PROPRIETARY TO UNISEM AND IS FURNISHED BY UNISEM ON THE SOLE CONDITION THAT THE USER AGREES NOT TO DISCLOSE ANY CONTENTS OF THE PRODUCT RELIABILITY REPORT TO A THIRD PARTY AND MAY NOT BE REPRODUCED WITHOUT PERMISSION. INFORMATION CONVEYED IN THIS REPORT IN NO WAY CHANGES OR ALTERS UNISEM’S ASSEMBLY WARRANTY POLICY AND UNDER NO CIRCUMSTANCES COULD THIS REPORT BE USED AS AN AUTHORIZATION TO RETURN PRODUCT TO UNISEM.

Date of Release: 20-May-2008

PRODUCT RELIABILITY LABUnisem (M) Berhad No.1 Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, 31300 Ipoh, Perak, Malaysia

Type test (With Preconditioning At 215ºC/260ºC Reflow for 3 cycles):

1500 cycles Temperature Cycling (TC) 4000 hours High Temperature Humidity Storage (HTHS)

4000 hours Ambient Temperature Humidity Storage Test (ATHS)


PRODUCT RELIABILITY LAB Unisem (M) Berhad No.1 Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, 31300 Ipoh, Perak, Malaysia

Lot Information:

# Package Lot# Serial # Device# Lead Frame Part#

1 8MSOP(Sn) MAXST*T8VAHA158B MS73221 MAX1790EUA+ 401114 2 16TSLP(3*3) MAXSP*SIY1IA212A TL28496 MAX9722BETE+TG104 421938 3 SOT-23-5-Cu(Sn) MAXPP*SPB0CA015D ST03880 MAX7377AXRD+T 401948

Requestor NC Wong Date Received 18-Sep-07 Prepared by Hazaham Date Completed 20-May-08 Approved by Peggy Cheah Date Approved 20-May-08

Test Plan:

Serialize Samples (Minimum 3lots-2 samples/lot)

Initial Pre-Test Inspection (Min. Mag. 300X)

Whisker Found?

1500 cycles TC 0/500/1000/1500

cyc

4000 hours ATHS [167 days]

0/1000/1500/2000/3000 /4000 hours

4000 hours HTHS [167days]

0/1000/1500/2000/3000 /4000 hours

Full scan for max 96 lead for 6 longest whisker measurement. Reject?

Fail &Report

Screening / Detailed Inspection (MinMag. 300X)

Whisker Found?

Full scan for max 96 lead for 6 longest whisker

Reject?

Fail & Report

Yes

No

Pass &Report

No

No No

Yes

Yes

Yes

Preconditioning Test- Reflow at 215ºC/260ºC

For 3 cycles



Test Condition:

Stress Test Test Conditions

Temperature Cycling Test Temperature = -55°C (+0/-10°C) to 85°C (+10/-0°C),

air to air; 10 minute soak; ~ 3 cycles / hour

High Temperature Humidity Storage Test

Temperature = 55°C (±3°C) Relative Humidity = 85% (±3°C)

Ambient Temperature Humidity Storage Test

Temperature = 30°C (±2°C) Relative Humidity = 60% (±3%)

Test Interval And Duration (Technology):

Durations Stress Type Inspection

Intervals Class 1 and 2 Products Class 1 A Products

Temp. Cycling Test 500 cycles 1500 cycles 1000 cycles High Temp. Humidity Storage Test 1000 hours 4000 hours 1000 hours

Ambient Temp. Humidity Storage Test 1000 hours 4000 hours 1000 hours Maximum Allowable Whisker Length:

Maximum Allowable Whisker Length (micron) Consideration Stress

Type [Class 2] Telecommunication Product

[Class 1] Industrial Product

[Class 1A] Consumer Product

TC 45 µm 50 µm HTHS 20 µm 50 µm

Components with a lead to lead gap ≤ 320µm

ATHS 20 µm TC 45 µm 50 µm

HTHS Components with a lead to lead gap > 320µm

ATHS 20 µm 40 µm 75 µm

Note: Unisem standard is Class 2 and Maximum Allowable Whisker Length is 45µm for TC and 20µm for storage tests based on manufacturing Process Change Acceptance Criteria Reference:

- Unisem Internal Specification UMRT-00-11/Rev H [Tin Whisker Growth Test] - JESD201-Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin

and Tin Alloy Surface Finishes - JESD22A121- Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes



Temperature Cycling Test: (A) Test Type : Temperature Cycling ( Reflow at 215ºC)

Test Condition : -55ºC (+0/-10ºC) to 85ºC (+10/-0ºC) Test Duration : 1500 cycles Inspection Interval : 500 cycles

TC Point (Cycles) /Maximum Whisker Length (µm) # Package Type 0 500 1000 1500

1 8MSOP(Sn) 0/6 - 0/6 - *0/6 16.9 *0/6 19.7 2 16TSLP(3*3) 0/6 - 0/6 - 0/6 - 0/6 - 3 SOT-23-5-Cu(Sn) 0/6 - 0/6 - 0/6 - *0/6 16.2

(B) Test Type : Temperature Cycling ( Reflow at 260ºC)

Test Condition : -55ºC (+0/-10ºC) to 85ºC (+10/-0ºC) Test Duration : 1500 cycles Inspection Interval : 500 cycles

TC Point (Cycles) /Maximum Whisker Length (µm) # Package Type

0 500 1000 1500 1 8MSOP(Sn) 0/6 - 0/6 - 0/6 - 0/6 - 2 16TSLP(3*3) 0/6 - 0/6 - 0/6 - 0/6 - 3 SOT-23-5-Cu(Sn) 0/6 - 0/6 - 0/6 - *0/6 14.2

Conclusion: Tin whisker growth for package 8MSOP after 1000 cyc and SOT-23-5-Cu after 1500 cyc. However, all packages have passed Maximum Allowable Whisker Length Criteria after TC 1500 cycles as refer to Unisem Internal Specification UMRT00-11.



High Temp. Humidity Storage Test: (A) Test Type : High Temp. Humidity Storage Test (Reflow 215ºC)

Test Condition : 55ºC (±3ºC) ,RH 85% (±3%) Test Duration : 4000 hours Inspection Interval : 1000 hours

HTHS Point (hours)/ Maximum Whisker Length (µm) #

Package Type 0 42

(1000hours) 84

(2000hours) 125

(3000hours) 167

(4000hours)1 8MSOP(Sn) 0/6 - 0/6 - 0/6 - 0/6 - 0/6 - 2 16TSLP(3*3) 0/6 - 0/6 - 0/6 - 0/6 - 0/6 - 3 SOT-23-5-Cu(Sn) 0/6 - 0/6 - 0/6 - 0/6 - 0/6 -

(B) Test Type : High Temp. Humidity Storage Test (Reflow 260ºC)


HTHS Point (hours)/ Maximum Whisker Length (µm)

#

Package Type 0 42

(1000hours) 84

(2000hours) 125

(3000hours) 167


Conclusion: No whisker growth observed after 4000 hours HTHS .



Ambient Temp. Humidity Storage Test (A) Test Type : Ambient Temp. Humidity Storage Test (Reflow 215ºC)


AHTHS Point (hours)/ Maximum Whisker Length (µm)

#

Package Type 0 42

(1000hours) 84

(2000hours) 125

(3000hours) 167


(B) Test Type : Ambient Temp. Humidity Storage Test (Reflow 260ºC)


AHTHS Point (hours)/ Maximum Whisker Length (µm) #

Package Type 0 42

(1000hours) 84

(2000hours) 125

(3000hours) 167


Conclusion: No whisker growth observed after 4000 hours ATHS.



Appendix A1: SEM Image For Tin Whisker Growth Test – TC Reflow At 215ºC :

Package Inspection Interval/Hours 8MSOP(Sn) 16TSLP(3*3) SOT-23-5-Cu (Sn)

0

500

1000

1500

16.9um

19.7um 16.2um



Appendix A2: SEM Image For Tin Whisker Growth Test – TC Reflow At 260ºC :


0

500

1000

1500

14 2 um



Appendix B1: SEM Image For Tin Whisker Growth Test – HTHS Reflow At 215ºC :


0

1000

2000

3000

4000



Appendix B2: SEM Image For Tin Whisker Growth Test – HTHS Reflow At 260ºC :


0

1000

2000

3000

4000



Appendix C1: SEM Image For Tin Whisker Growth Test – ATHS Reflow At 215ºC:


0

1000

2000

3000

4000



Appendix C2: SEM Image For Tin Whisker Growth Test – ATHS Reflow At 260ºC:


0

1000

2000

3000

4000

Tin Whisker Growth Test Report Report #: WG-07-007...Tin whisker growth for package 8MSOP after 1000...

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