THEMIS Instrument CDR 1 UCB, April 19-20, 2004 Integration and Test Critical Design Review Rick...

THEMIS Instrument CDR 1 UCB, April 19-20, 2004

Integration and Test

Critical Design ReviewRick Sterling

University of California – Berkeley

Thm_CDR_IT_Revc


Agenda

Agenda• Requirements and Responsibilities

• Facilities (Integration and Environmental)

• Instrument I&T Requirements

• Instrument I&T Set-up (MGSE, EGSE)

• Instrument I&T Flows

• Instrument-Spacecraft Integration

• Issues


Responsibilities

Responsibilities• Provide Clean Room Facility (Room 125)• Access Control & Clean Room Training• Develop MGSE

– Instrument Harness Mockups & Test Platforms

• Fabricate Instrument Harnessing• Support Instrument-Provided GSE

– Mu-Metal Enclosures for FGM & SCM

– N2 Purge Systems for ESA, SST

– Sphere Sensor Boxes for EFI

• Integrate & Functional Test of EM, F1-F6• Provide EMC, MAG, Vibration & TV Testing • Daily Logistic Planning & “Standup” meetings• Deliver & Support to Swales for Spacecraft I&T


Facilities – Integration Lab

Instrument Integration Lab• Secure Key-Coded Lock• Class 100K Clean room• Air Quality Monitored Weekly by Assurance• Positive Air Flow• Feed Thru’s to Adjacent Lab• Gowning Area• Storage Shelving for Component Storage• Separate Flight and non-Flight Storage• Oxygen Sensor (when Nitrogen Purge used)• Used for HESSI, CHIPSAT, Stereo Impact


Thermal Chambers• Space Sciences Lab • New Chamber for EFI Booms• Cal Chamber Upgrade for SST

Test Chamber Requirements• Pre-Test Clean• Pre-Test Bakeout• TQCM Monitoring• Cryo-Pump• Final Bakeout• GN2 Backfill

Vibration Facilities• Wyle• AMES

EMI/EMC• EMCE Engineering – Fremont

Facilities - Environmental

Available Chambers Type HiBay L1 TV AXB Booms HiBay L2 TV STEREO320 T10 TV STEREO320 Cal Vac ESA Cal320 “Mini” TV SCM, Bake-outsB20-TV “Bayside” TV EFIB20-Large TV TV Payload TV B20-Cal VAC2 Vac SST Cal B20-TV “Snout” TV

Comment

339-TV CalSST, IDPU, EFI ESA MCPs


“Large Chamber(“Bertha”)

• Developed for EUVE

• 8’ diam x 16’ depth

• Adding thermal capability

• Can do two Themis units at a time if desired.


Other Chambers

• Basement SSL

• Being refurbished


Chamber for Boom Deploy

•“Jeffrey”

• EFI AXB scheduled for 5/04

• Developed for Stereo

• Sharing with Stereo

• There is another chamber with “snout” extension for boom deploy testing.


Chamber Schedule


Thermal TestingTV Plan • 2 Component-Level TV Cycles Prior to Instrument-Level I&T• 6 Instrument Level TV Cycles at Instrument-Level• Survival, Cold Start, Cycles (Functional at extremes), Bake-out

Deployments in Vacuum• SPB: Full Deploy w Takeup reel• AXB: Deploy Hot & Cold• MAG: First Motion Hot & Cold

Typical TV Profile:

Instrument Profile (6cy)

-60

-40

-20

0

20

40

60

80

0 12 24 36 48 60 72 84 96 108

Hours

Temp

CPT

CPT

LPT LPT LPT LPT LPT

LPT LPTLPTLPT LPT

BAKEOUT


Instrument Cleanliness/Contamination Requirements• ESA and SST require continual nitrogen gas purge• Regulate and use viewcam to monitor remotely• Oxygen meter following instruments and gas purge equipment• Normal ESD concerns• Magnetometer sensor to be boxed except when under test and before flight

Instrument-Provided GSE Accommodation• Mu-Metal Enclosures for FGM & SCM• N2 Purge Systems for ESA, SST• Sphere Sensor Boxes for EFI

Instrument Red/Green Tag Items Tracking• IDPU - Arming plug enables actuators causing boom deployment• EFI - Electrical: 4 SPB Test/enable plugs plus one AXB test/enable plug• EFI - Mechanical: 4 SPB Snout Covers plus 2 AXB Tube Covers• SST - Covers to be removed before flight• ESA - Cover; Arming plug; purge fitting;cocking pin nut

Instrument Requirements


Integration Set-up

- Instruments at SSL integrated on platform same form factor as probe - 80/20 framing supports platform and sets comfortable work height - Metal rack alongside holds electrical GSE (power supply, UPS, scope) - GSE communicates with BAU Simulator via hardwire or ethernet

INSTRUMENT PAYLOAD ASSEMBLY PLATE


Instrument Payload I&T Flow

FGMFunctional(Level 2)

SCMFunctional(Level 2)

SSTFunctional(Level 2)

HarnessBake-out

IDPU-HarnessSafe-to-Mate

PayloadEMC/EMI/MAGl

PayloadT-V

ESAFunctional(Level 2)

• Test Review

InstrumentPER

MAG INTEGRATION

EFI INTEGRATION

ESA/SST INTEGRATION

PAYLOAD ENVIRONMENTALPayloadPayloadVibrationVibration

PayloadAcceptance

• ONLY if req’d (workmanship)

MagAlignment

EFI AXBDeploy

EFI SPBDeploy

Mag BoomDeploy

EFIFunctional(Level 1)

EFIFunctional(Level 2)

EFI/SCM/FGMPhasing

ESA/SSTTiming

PayloadCPT


FGM I&T Flow

FGSVibration

FGSThermal

IDPUSafe-to-Mate

IDPU/ESA/SCM Pre-Amp

Vibration

FGSAcceptance


• Inspection• Mass Properties• DC Magnetics

• 2 cycles T-V• Bake-out +60C

• Sensor in TCU

FGEAcceptance


• Without FGS• Inspection

IDPUThermal

• 2 cycles T-V• Bake-out +60C• FGS Functional (Level 1)

FGBVibration

FGB/SCBThermal

• 1 cycle T-V• Hot/Cold Deploy

FGBAcceptance


• Backplane

Alignment EFI/SCM/FGM

Phasing Mag Boom

Deploy Payload

Safe-to-Mate

• Harness

PayloadEMI/EMC/MAGl

PayloadT-V

• 6 cycles T-V• FGM Functional Lev1)

IDPUAcceptance


• Test Review

• Boom Levels

InstrumentPER

FGM BOOM (FGB)

FGM SENSOR (FGS)

FGM ELECTRONICS (FGE)

FGM / PAYLOAD INTEGRATION

PAYLOAD ENVIRONMENTALPayloadVibration

PayloadAcceptance



FGM Level 0 – Without Sensor (Aliveness)• B-field about zero if FGM in Cal Mode (preferred mode)

• B-field saturated if feedback is closed

• Interface full functional

• Power consumption reduced by about 200mW

FGM Level 1 – Sensor in Mu-metal cap (Limited Performance Test)• B-field about 10,000nT, Noise about 1nT

• Full functionality,

but B-field not representative

FGM Level 2 – Sensor in TCU (Comprehensive Performance Test) • B-field < 10nT, Noise <10pT/sqrt (Hz)

• B-field has to be available in full quality

• Delta in calibration coefficients known

FGM Test Configurations


SCM I&T Flow

SCM SensorVibration

SCM SensorThermal

SCM Pre-AmpBake-out


Vibration

SCM SensorBake-out

Functional(Level 3)

• Bake-out +60C• 3 cycles (air)

• SCM Sensor in Mu Metal

SCM Pre-AmpThermal

SCM Pre-AmpAcceptance

IDPUThermal

• 2 cycles T-V• Bake-out +60C• SCM Functional (Level 1)

SCBVibration

• 14.1g RMS

FGB/SCBThermal


SCBAcceptance


• Bake-out +60C

Alignment EFI/SCM/FGM

Phasing Mag Boom

Deploy Payload

Safe-to-Mate

• Harness

PayloadEMI/EMC/MAGl

PayloadTV

• 6 cycles T-V• SCM Functional (Lev 2)

IDPUAcceptance


• Test Review

• Boom Levels

InstrumentPER

SCM BOOM (SCB)

SCM SENSOR (SCM)

SCM PRE-AMP

SCM / PAYLOAD INTEGRATION

PAYLOAD ENVIRONMENTALPayloadVibration

PayloadAcceptance


SCM SensorAcceptance


• 3 cycles (air) • Inspection• Mass Properties• DC Magnetics


SCM Test ConfigurationsSCM Safety – Feedback Plug

• Required when SCM Pre-Amp is powered and sensor is not connected

SCM Level 0 – With SCM EGSE I/F Box (Aliveness)• Same Power, Command, Analog output interfaces

• Power and Cal Mode identification by LED

• Cal Signal re-injected to the input

• Signal generator connected to input

• Validation by analysis of data

SCM Level 1, 2 – Sensor in Mu Metal Box (Comprehensive Performance Test) • Sensor kept in mu metal box during integration

• Axis identification

• Re-verification of end-to-end calibration

• Phase relation

• Check of conducted noise

• SCM/EField timing reference


ESA I&T Flow


• Instrument Functional• Cover Simulator Test

ESAThermal

ESAAcceptance


ESA/SSTTiming

PayloadSafe-to-Mate

• Harness

PayloadEMI/EMC/MAG

PayloadT-V

• 6 cycles T-V• ESA Functional (Lev 1)

• Test Review

InstrumentPER

ESA SENSOR

ESA ELECTRONICS (ETC)

ESA / PAYLOAD INTEGRATION

PAYLOAD ENVIRONMENTAL PayloadVibration

PayloadAcceptance



IDPUSafe-to-Mate


Vibration


IDPUThermal


• Backplane

IDPUAcceptance


ETCAcceptance

• Inspection


SST I&T Flow


• SST w/ Radiation Source• Attenuator Test

SST Vibration

SSTThermal

SSTAcceptance


ESA/SSTTiming

PayloadSafe-to-Mate

• Harness

PayloadEMI/EMC/MAGl

PayloadT-V

• 6 cycles T-V• SST Functional (Level 1)

• Test Review

InstrumentPER

SST SENSOR

SST ELECTRONICS(DAP and ETC)

SST / PAYLOAD INTEGRATION


PayloadAcceptance



IDPUSafe-to-Mate


Vibration

DAPAcceptance


• Without SST

• InspectionIDPU

Thermal


• Backplane

IDPUAcceptance


ETCAcceptance

• Inspection


EFI I&T Flow

EFI Pre-AmpBake-out

EFI AXBDeploy

• Sensor in Mu Metal

EFI Pre-AmpThermal

EFI Pre-AmpAcceptance

AXBVibration

AXBThermal


AXBAcceptance


• Bake-out +60C

EFI Functional(Level 2)

EFI/SCM/FGMPhasing

EFI SPBDeploy

PayloadSafe-to-Mate

• Harness

PayloadEMI/EMC/MAGl

PayloadT-V

• 6 cycles T-V• EFI Functional (Lev 1)

• Test Review

InstrumentPER

EFI AXIAL BOOM (AXB)

EFI RADIAL BOOM (SPB)

EFI PRE-AMP

EFI / PAYLOAD INTEGRATION


PayloadAcceptance


• 3 cycles (air) • Inspection• Mass Properties• DC Magnetics

EFI ELECTRONICS(BEB and DFB)

SPBVibration

SPBThermal


SPBAcceptance


EFI Pre-AmpVibration

IDPUSafe-to-Mate


Vibration

BEBAcceptance EFI

Functional(Level 0)

• Without sensors

• Inspection

IDPUThermal


• Backplane

IDPUAcceptance


DFBAcceptance

• Inspection


Instrument I&T with SC

Berkeley to Provide:

• GSE Equipment for independent verification instrument operation.

• Purge monitoring support

• Safety control support (securing of deployable items etc)


Schedule – Overview of Key Dates• ETU: I & T 7/04 – 8/04• Integrating and Testing Flight Units Fall 2004 – Spring 2005.• Delivery P1: 2/10/05• Delivery P2: 4/6/05• Delivery P3: 5/4/05• Delivery P4: 6/6/05• Delivery P5: 7/1/05

With each instrument suite we deliver harnesses, GSE computer, booms, sensors in protection boxes.

Instrument Delivery to SC


Issues

Transportation/Shipping Berkeley to Swales

• Ground or commercial air? Under consideration.

Access for Red/Green Tag Instrument Items when all probes on PCA

• Logistics and timing of removal/addition of red and green tag items still to be detailed.

Detailed I & T Plans, Functional Procedures, etc.

• In development.

THEMIS Instrument CDR 1 UCB, April 19-20, 2004 Integration and Test Critical Design Review Rick...

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Transcript of THEMIS Instrument CDR 1 UCB, April 19-20, 2004 Integration and Test Critical Design Review Rick...