THEMIS Mission CDRInstrument I&T 1 UCB, June 14 - 18, 2004 Instrument Integration and Test Rick...

THEMIS Mission CDR Instrument I&T 1 UCB, June 14 - 18, 2004

Instrument Integration and Test

Rick Sterling / Sharon Jelinsky

University of California – Berkeley

Thm_CDR_IT_Revc


Overview

Overview / Topics I&T Sequence

Facilities

Integration Platform

Instrument Requirements

Integration/Test Flow

Schedule Milestones

Transportation


Sequence

LevelLevel LocationLocation StatusStatus

Instruments (ESA, SST, EFI, FGM, SCM, IDPU, BOOMS)

SSL, Europe

ETU Versions In Progress

Instrument Suite SSL ETU begins August

Instruments with Probe Swales,GSFC

First Probe begins February 2005

Probes with PCA Swales, GSFC

Begins December 2005

PCA with rocket KSC Begins August 2006


Thermal Chambers• Space Sciences Lab • New Chamber for EFI Booms• Cal Chamber Upgrade for SST

Test Chamber Requirements• Pre-Test Clean• Pre-Test Bakeout• TQCM Monitoring• Cryo-Pump• Final Bakeout• GN2 Backfill

Calibration Chambers• Vacuum only• Ion Gun• Manipulator

Facilities - Environmental

Available Chambers Type HiBay L1 TV AXB Booms HiBay L2 TV STEREO320 T10 TV STEREO320 Cal Vac ESA Cal320 “Mini” TV SCM, Bake-outsB20-TV “Bayside” TV EFIB20-Large TV TV Payload TV B20-Cal VAC2 Vac SST Cal B20-TV “Snout” TV

Comment

339-TV CalSST, IDPU, EFI ESA MCPs

Vibration Facilities

• Wyle

• AMES

EMI/EMC

• EMCE Engineering – Fremont


Room B20

3 T/V Test Chambers: Bayside, Snout, Bertha

High Vacuum Base Pressures of 1x10e-6 torr or better

Thermal Systems with LN2 cooling and IR heating

Thermal Controllers: Watlow hardware & Anawin Software

Test Chambers Certified prior to instrument testing

–Verify Outgassing levels less than 1% TML and 0.1% CVCM

–RGA measures of residual gasses to less than 1x10e-7 PP

–TQCM to measure condensable materials deposition rates

B20 T/V CHAMBERS


Bertha - Large Thermal Vacuum Test Chamber• Dimensions: 9 ft. Diameter x 16 ft. Long• Accommodates 2 THEMIS Instrument Suites at once• Temperature cycles of -80C to +80C • Base Pressure of less than 1 x 10e-6 torr• Tests full ETU and 5 Flight Instruments

Chamber ‘Bertha’


THEMIS Snout

•Dimensions: 3 ft. Diameter x 3 ft. Long

•Accommodate EFI Axial Boom

•Temperature cycles of -100C to +110C

•Base Pressure of less than 1 x 10e-6 torr

•Tests IDPU, AXB T/V, and Boom Deployment

Chamber ‘Themis Snout’


Bayside

• 3 ft. Diam x 3 ft. Length

• Fits 2 Instruments

• Temp Range: –100 to +110C

• Base Pressure: <1 x 10e-6 torr

Chamber ‘Bayside’


Thermal TestingTV Plan • 2 Component-Level TV Cycles Prior to Instrument-Level I&T• 6 Instrument Level TV Cycles at Instrument-Level• Survival, Cold Start, Cycles (Functional at extremes), Bake-out

Deployments in Vacuum• SPB: Full Deploy w Takeup reel• AXB: Deploy Hot & Cold• MAG: First Motion Hot & Cold

Typical TV Profile:Instrument

Profile (6cy)

-60

-40

-20

0

20

40

60

80

0 12 24 36 48 60 72 84 96 108

Hours

Temp

CPT

CPT

LPT LPT LPT LPT LPT

LPT LPTLPTLPT LPT

BAKEOUT


Bertha Vacuum Chamber in full working order

Thermal System designed; Baseplate and Shroud in production

Thermal Controller off the shelf & on order

Snout Vacuum Chamber manufacture complete and under test

Thermal System designed; Baseplate and Shroud in production

Thermal Controller off the shelf & on order

Bayside Vacuum Chamber in full working order

Thermal System designed and built

Thermal Baseplate and Shroud under installation and test

Status of Chamber Upgrades


Clean Room Features

Requirement: 100K Class

Nitrogen Gas purge available

Continuous Oxygen Monitoring

Temperature and Humidity Monitoring

Weekly Air Quality sampling

Controlled Access

Crane Certification

Staff Training

Clean Rooms SSL


Clean Room B20


Clean Room 125


Integration Platform

Instrument Suite on Platform Platform is same size as s/c deck Framing supports platform to set comfortable work height Metal rack alongside holds GSE and support equipment GSE communicates with BAU Simulator via hardwire or ethernet

INSTRUMENT PAYLOAD ASSEMBLY PLATE


Parallel Integration and Test of S/C Platforms

Parallel Integration/Test


Instrument Cleanliness/Contamination Requirements• ESA and SST require continual nitrogen gas purge• Oxygen meter following instruments and gas purge equipment• Normal ESD concerns• Magnetometer sensors to be boxed except when under test and before flight

Instrument-Provided GSE Accommodation• Mu-Metal Enclosures for FGM & SCM• N2 Purge Systems for ESA, SST• Sphere Sensor Boxes for EFI

Instrument Red/Green Tag Items Tracking• IDPU - Arming plug enables actuators causing boom deployment• EFI - Electrical: 4 SPB Test/enable plugs plus one AXB test/enable plug• EFI - Mechanical: 4 SPB Snout Covers plus 2 AXB Tube Covers• SST - Covers to be removed before flight• ESA - Cover; Arming plug; purge fitting;cocking pin nut

Instrument Requirements


Instrument Payload I&T Flow

FGMFunctional(Level 2)

SCMFunctional(Level 2)

SSTFunctional(Level 2)

HarnessBake-out

IDPU-HarnessSafe-to-Mate

PayloadEMC/EMI/MAGl

PayloadT-V

ESAFunctional(Level 2)

• Test Review

InstrumentPER

MAG INTEGRATION

EFI INTEGRATION

ESA/SST INTEGRATION

PAYLOAD ENVIRONMENTALPayloadPayloadVibrationVibration

PayloadAcceptance

• ONLY if req’d (workmanship)

MagAlignment

EFI AXBDeploy

EFI SPBDeploy

Mag BoomDeploy

EFIFunctional(Level 1)

EFIFunctional(Level 2)

EFI/SCM/FGMPhasing

ESA/SSTTiming

PayloadCPT


FGM I&T Flow

FGSVibration

FGSThermal

IDPUSafe-to-Mate

IDPU/ESA/SCM Pre-Amp

Vibration

FGSAcceptance


• Inspection• Mass Properties• DC Magnetics

• 2 cycles T-V• Bake-out +60C

• Sensor in TCU

FGEAcceptance


• Without FGS• Inspection

IDPUThermal

• 2 cycles T-V• Bake-out +60C• FGS Functional (Level 1)

FGBVibration

FGB/SCBThermal

• 1 cycle T-V• Hot/Cold Deploy

FGBAcceptance


• Backplane

Alignment EFI/SCM/FGM

Phasing Mag Boom

Deploy Payload

Safe-to-Mate

• Harness

PayloadEMI/EMC/MAGl

PayloadT-V

• 6 cycles T-V• FGM Functional Lev1)

IDPUAcceptance


• Test Review

• Boom Levels

InstrumentPER

FGM BOOM (FGB)

FGM SENSOR (FGS)

FGM ELECTRONICS (FGE)

FGM / PAYLOAD INTEGRATION

PAYLOAD ENVIRONMENTALPayloadVibration

PayloadAcceptance



FGM Level 0 – Without Sensor (Aliveness)• B-field about zero if FGM in Cal Mode (preferred mode)

• B-field saturated if feedback is closed

• Interface full functional

• Power consumption reduced by about 200mW

FGM Level 1 – Sensor in Mu-metal cap (Limited Performance Test)• B-field about 10,000nT, Noise about 1nT

• Full functionality,

but B-field not representative

FGM Level 2 – Sensor in TCU (Comprehensive Performance Test) • B-field < 10nT, Noise <10pT/sqrt (Hz)

• B-field has to be available in full quality

• Delta in calibration coefficients known

FGM Test Configurations


SCM I&T Flow

SCM SensorVibration

SCM SensorThermal

SCM Pre-AmpBake-out


Vibration

SCM SensorBake-out

Functional(Level 3)

• Bake-out +60C• 3 cycles (air)

• SCM Sensor in Mu Metal

SCM Pre-AmpThermal

SCM Pre-AmpAcceptance

IDPUThermal

• 2 cycles T-V• Bake-out +60C• SCM Functional (Level 1)

SCBVibration

• 14.1g RMS

FGB/SCBThermal


SCBAcceptance


• Bake-out +60C

Alignment EFI/SCM/FGM

Phasing Mag Boom

Deploy Payload

Safe-to-Mate

• Harness

PayloadEMI/EMC/MAGl

PayloadTV

• 6 cycles T-V• SCM Functional (Lev 2)

IDPUAcceptance


• Test Review

• Boom Levels

InstrumentPER

SCM BOOM (SCB)

SCM SENSOR (SCM)

SCM PRE-AMP

SCM / PAYLOAD INTEGRATION

PAYLOAD ENVIRONMENTALPayloadVibration

PayloadAcceptance


SCM SensorAcceptance


• 3 cycles (air) • Inspection• Mass Properties• DC Magnetics


SCM Test Configurations

SCM Safety – Feedback Plug• Required when SCM Pre-Amp is powered and sensor is not connected

SCM Level 0 – With SCM EGSE I/F Box (Aliveness)• Same Power, Command, Analog output interfaces

• Power and Cal Mode identification by LED

• Cal Signal re-injected to the input

• Signal generator connected to input

• Validation by analysis of data

SCM Level 1, 2 – Sensor in Mu Metal Box (Comprehensive Performance Test) • Sensor kept in mu metal box during integration

• Axis identification

• Re-verification of end-to-end calibration

• Phase relation

• Check of conducted noise

• SCM/EField timing reference


ESA I&T Flow


• Instrument Functional• Cover Simulator Test

ESAThermal

ESAAcceptance


ESA/SSTTiming

PayloadSafe-to-Mate

• Harness

PayloadEMI/EMC/MAG

PayloadT-V

• 6 cycles T-V• ESA Functional (Lev 1)

• Test Review

InstrumentPER

ESA SENSOR

ESA ELECTRONICS (ETC)

ESA / PAYLOAD INTEGRATION

PAYLOAD ENVIRONMENTAL PayloadVibration

PayloadAcceptance



IDPUSafe-to-Mate


Vibration


IDPUThermal


• Backplane

IDPUAcceptance


ETCAcceptance

• Inspection


SST I&T Flow


• SST w/ Radiation Source• Attenuator Test

SST Vibration

SSTThermal

SSTAcceptance


ESA/SSTTiming

PayloadSafe-to-Mate

• Harness

PayloadEMI/EMC/MAGl

PayloadT-V

• 6 cycles T-V• SST Functional (Level 1)

• Test Review

InstrumentPER

SST SENSOR

SST ELECTRONICS(DAP and ETC)

SST / PAYLOAD INTEGRATION


PayloadAcceptance



IDPUSafe-to-Mate


Vibration

DAPAcceptance


• Without SST

• InspectionIDPU

Thermal


• Backplane

IDPUAcceptance


ETCAcceptance

• Inspection


EFI I&T Flow

EFI Pre-AmpBake-out

EFI AXBDeploy

• Sensor in Mu Metal

EFI Pre-AmpThermal

EFI Pre-AmpAcceptance

AXBVibration

AXBThermal


AXBAcceptance


• Bake-out +60C

EFI Functional(Level 2)

EFI/SCM/FGMPhasing

EFI SPBDeploy

PayloadSafe-to-Mate

• Harness

PayloadEMI/EMC/MAGl

PayloadT-V

• 6 cycles T-V• EFI Functional (Lev 1)

• Test Review

InstrumentPER

EFI AXIAL BOOM (AXB)

EFI RADIAL BOOM (SPB)

EFI PRE-AMP

EFI / PAYLOAD INTEGRATION


PayloadAcceptance


• 3 cycles (air) • Inspection• Mass Properties• DC Magnetics

EFI ELECTRONICS(BEB and DFB)

SPBVibration

SPBThermal


SPBAcceptance


EFI Pre-AmpVibration

IDPUSafe-to-Mate


Vibration

BEBAcceptance EFI

Functional(Level 0)

• Without sensors

• Inspection

IDPUThermal


• Backplane

IDPUAcceptance


DFBAcceptance

• Inspection


ETU Instruments Suite Level T/V 9/2/2004

P1 Instruments Suite Level T/V 12/29/2004Delivery to Swales 2/11/2005





Upcoming Integration/Test Milestones

Upcoming Milestones


Transportation

Transportation and Logistics Air Transport of Instrument Suites from Berkeley to Swales

Fed Ex Critical/Specialty Freight Overnight

Point to Point, Highest Security

Transport Berkeley’s spacecraft platform to Swales also

Post-Transport Acceptance Test at Swales

THEMIS Mission CDRInstrument I&T 1 UCB, June 14 - 18, 2004 Instrument Integration and Test Rick...

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