Next Generation Integrated Circuits
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Transcript of Next Generation Integrated Circuits
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Next Generation Integrated Circuits
• 300 mm wafers• Copper metallization• Low-K dielectric under interconnect lines• High-K dielectric under gate• Silicon-on-insulator (SOI)• Strained silicon• New gate metals• Dual-core CPU chips
![Page 2: Next Generation Integrated Circuits](https://reader036.fdocuments.us/reader036/viewer/2022062501/56816863550346895ddeb220/html5/thumbnails/2.jpg)
Next Generation Integrated Circuits
• 300 mm wafers• Copper metallization• Low-K dielectric under interconnect lines• High-K dielectric under gate• Silicon-on-insulator (SOI)• Strained silicon• New gate metals• Dual-core CPU chips
![Page 3: Next Generation Integrated Circuits](https://reader036.fdocuments.us/reader036/viewer/2022062501/56816863550346895ddeb220/html5/thumbnails/3.jpg)
Copper Metallization – Low-K Dielectric
![Page 4: Next Generation Integrated Circuits](https://reader036.fdocuments.us/reader036/viewer/2022062501/56816863550346895ddeb220/html5/thumbnails/4.jpg)
Next Generation Integrated Circuits
• 300 mm wafers• Copper metallization• Low-K dielectric under interconnect lines• High-K dielectric under gate• Silicon-on-insulator (SOI)• Strained silicon• New gate metals• Dual-core CPU chips
![Page 5: Next Generation Integrated Circuits](https://reader036.fdocuments.us/reader036/viewer/2022062501/56816863550346895ddeb220/html5/thumbnails/5.jpg)
High-K Gate Dielectric
• Reduced fringing of gate electric field – better switching control, less leakage current
• Reduced tunneling leakage current with thin oxides
• Si3N4, ZrO2, HfO2
![Page 6: Next Generation Integrated Circuits](https://reader036.fdocuments.us/reader036/viewer/2022062501/56816863550346895ddeb220/html5/thumbnails/6.jpg)
Next Generation Integrated Circuits
• 300 mm wafers• Copper metallization• Low-K dielectric under interconnect lines• High-K dielectric under gate• Silicon-on-insulator (SOI)• Strained silicon• New gate metals• Dual-core CPU chips
![Page 7: Next Generation Integrated Circuits](https://reader036.fdocuments.us/reader036/viewer/2022062501/56816863550346895ddeb220/html5/thumbnails/7.jpg)
Silicon-On-Insulator
• No p-n junction for electrical isolation
• Reduced inter-device coupling
• Reduced parasitic capacitance
• No deep diffusion required for isolation - less fabrication time, closer device packing
![Page 8: Next Generation Integrated Circuits](https://reader036.fdocuments.us/reader036/viewer/2022062501/56816863550346895ddeb220/html5/thumbnails/8.jpg)
Next Generation Integrated Circuits
• 300 mm wafers• Copper metallization• Low-K dielectric under interconnect lines• High-K dielectric under gate• Silicon-on-insulator (SOI)• Strained silicon• New gate metals• Dual-core CPU chips
![Page 9: Next Generation Integrated Circuits](https://reader036.fdocuments.us/reader036/viewer/2022062501/56816863550346895ddeb220/html5/thumbnails/9.jpg)
Strained Silicon
• Enhanced carrier mobility – compensates for increased ionized impurity scattering in thin, heavily-doped layers
![Page 10: Next Generation Integrated Circuits](https://reader036.fdocuments.us/reader036/viewer/2022062501/56816863550346895ddeb220/html5/thumbnails/10.jpg)
Next Generation Integrated Circuits
• 300 mm wafers• Copper metallization• Low-K dielectric under interconnect lines• High-K dielectric under gate• Silicon-on-insulator (SOI)• Strained silicon• New gate metals• Dual-core CPU chips
![Page 11: Next Generation Integrated Circuits](https://reader036.fdocuments.us/reader036/viewer/2022062501/56816863550346895ddeb220/html5/thumbnails/11.jpg)
New Generation ICs at Intel
http://www.intel.com/technology/silicon/index.htm
http://www.intel.com/technology/silicon/research.htm?iid=tech_sil+rd
Main Page
Reports and Publications
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New Generation ICs at AMD
http://www.thinkcp.com/AMD/roadmap.html
Processor Cores Roadmap
Main Page
http://www.amd.com/us-en/
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New Generation ICs at AMD
Back to Main
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New Generation ICs at IBM
http://www.research.ibm.com/
http://www.ibm.com/search/?en=utf&v=11&lang=en&cc=&lv=w&q=%2BNanofabrication%20%2Burl.all:research.ibm.com
Main Page
Reports and Publications
http://www-916.ibm.com/press/prnews.nsf/jan/0C17FDCBF4B76CE185256C6F0064206D
Nanofabrication