New corporate presentation july 2010
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Transcript of New corporate presentation july 2010
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Dynamic & Proto Circuits Inc.
Corporate Presentation
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DAPC Facility 54,000 Sq.ft./6,000 Sq.M
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Multilayer Process
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Solder Mask OptionsBLUE
BLACK
GREENRED
CLEAR
DRY FILM
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Investing in Technology
New equipment to optimize our production and delivery
capabilities
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HASL Machine
The HAL5224 Hot Air Solder Leveling System is designed to provide the highest quality solder leveling at high throughput rates while preserving the highest reliability and serviceability standards available. Argus International has been designing, building and operating HASL systems for over a decade. The experience earned in a decade of dedication to engineering the HASL process is evident by the high quality work produced.
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High Speed / Small Hole N/C Drilling Equipment
The Schmoll Drilling machines have 6 (six) stations per drilling machine and allow DAPC to be more efficient in drilling panels with a large volume of vias at a rapid speed and accuracy. We are able to mechanically drill holes as small as 6 mil. This greatly enhances the efficiency of high mix low volume production and mass production quantities of printed circuit boards.
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Mass VCP-5001Via Plugging
Machine
This machine is designed to fill holes in printed circuit boards with conductive or non-conductive paste. The hole filling can be performed with through-hole vias and blind vias. The machine is equipped with a full vacuum chamber and heated heads to ensure reliable via filling for the most demanding aspect ratios and a glass cover for visual quality control on both panel sides.
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Soldermask Coater
The DP-1500 applies all types of liquid photoimageablecoatings, including soldermask, primaryimage, dielectric, and legend. This versatile machine incorporates more than eight years of experience of dual-sided coating with many new features designed to reduce cycle time, increase yields and improve process reliability.
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Technology Roadmaps
Materials and Manufacturing Capabilities
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Technology RoadmapAttribute Standard Advanced 2012
Minimum Line Spacing, Internal Layer 0.005”/.005” 0.003”/0.003” 0.003”/0.003”Minimum Line/Spacing, External Layer 0.005”/.005” 0.003”/0.003” 0.003”/0.003”Minimum drilled hole size 0.008” 0.006” 0.004”Aspect Ratio (Thickness to Drill) 8:1 16:1 25:1Land Size Internal (Diameter over Drill) 0.012” 0.010” 0.010”Land size External (Diameter over Drill) 0.012” 0.008” 0.008”
No Connect (Diameter over Drill) 0.020 0.016 0.015Plated Hole Tolerance ± .003” ± 0.002” ± 0.002”Minimum Laser Via Hole N/A N/A .004”Laser Via Aspect Ratio N/A N/A 1.5:1
Laser Via Land Size (Diameter Over Drill) N/A N/A 0.008”Minimum Dielectric Thickness 0.004” 0.003” 0.002”Minimum core Thickness 0.004” 0.003” 0.002”
Maximum PCB Thickness 0.125” 0.256” 0.256”Thickness Tolerance (%) 10 7 6Maximum Board Dimensions 16.5”x22.5” 19.5”x22.5” 19.5”x22.5”
Bow And Twist (Through Hole) % 1.50 1.25 1.00Bow And Twist (SMT) % 0.75 0.75 0.75Minimum Conductor to Edge 0.012 0.010 0.008
Layer-To-Layer Registration Tolerance 0.005” 0.004” 0.003”Component Pitch 0.020” 0.016” 0.010”Soldermask Clearance 0.005” 0.003” 0.002”
Soldermask Dams 0.004” 0.003” 0.002”Impedance Tolerance (>50 Ohms) % ± 10 ± 5 ± 3Maximum layers 22 36 36
Maximum Copper Weight Internal (oz.) 3 3 3Maximum Copper Weight External (oz.) 4 5 5
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Technology Roadmap continued
Materials
Via Construction
Surface Finish
Electrical Test Method
Attribute Standard Advanced 2012
FR4 Yes Yes YesHigh Tg FR4 – (170C..) Yes Yes YesBT Epoxy Yes Yes YesPolyimide Yes Yes YesTeflon Yes Yes YesDuroid Yes Yes YesRoHS Compliant Materials Yes Yes Yes
Nelco N4000-13 Yes Yes YesHeatsink Manufacturing and Lamination Yes Yes Yes
Through Hole Yes Yes YesBlind (Mechanical) Sequential Lamination Yes Yes YesBuried (Mechanical) Yes Yes YesBlind Laser No No Yes
ENIG Yes Yes YesOSP Yes Yes YesWhite Tin Yes Yes YesHASL Yes Yes YesElectrolytic Nickel/Gold Yes Yes YesSilver Yes Yes YesQuality SystemMIL-P-55110 Yes Yes YesMIL-PRF-31032 Yes Yes YesISO-9001:2000 Yes Yes
Flying Probe Yes Yes Yes
YesAS9100B Yes YesYes
Isola FR408 Yes Yes Yes
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Substrate Materials
13 PPM70 PPM0.0134.3260Nelco N7000-2V0Polyimide
12 PPM55 PPM0.0093.8250Nelco N8000Cyanate Ester
15-18 PPM140 PPM0.0134.1185Isola G200BT-Epoxy
CTE-X & Y AxisCTE-Z AxisDissipation
Factor
DielectricConstant @
1 MHZTg (° .C)Supplier/Material
TypeMaterial
High Temperature Materials
11-13 PPM65 PPM0.015-0.0234.0180Isola IS410Hi-Temp FR4
10-14 PPM45 PPM0.015-0.0224.4180Matsushita R-1755VHi-Temp FR4
10-14 PPM35 PPM0.0093.9200Nelco N4000-13
13-14 PPM<55 PPM0.01-0.0153.8 Typ.175-185Isola FR408
10-14 PPM37 PPM0.0234.4180Nelco N4000-6Hi-Temp FR-4
12-16 PPM45 PPM0.0274.4140Nelco N4000-2FR-4
CTE-X & Y AxisCTE-Z AxisDissipation
Factor
DielectricConstant
@1 MHZTg (° .C)
Supplier/MaterialTypeMaterial
Standard
Modified FR-4
Modified FR-4
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Substrate Materials
YesYes12/15952.50-3.20 @ 10
GHzArlon
YesYes9.5/9.51200.001 typ @
10 GHz2.40-2.60 +/-
0.04RogersUltralam 2000
YesYes17/17240.0025 @ 10
GHz6.15 +/- 0.15 @
10 GHzRogersRO3006
YesYes14/1650
0.0040 @ 10 GHz
3.48 +/- 0.05 @10 GHzRogersRO4350
YesYes14/1646
0.0022 @ 10 GHz
3.38 +/- 0.05 @ 10 GHzRogersRO4003
YesNo
31/482370.00092.20 +/- 0.020RT/duroid 5880
YesNo16/1624
0.0012 @ 10 GHz
2.94 +/- 0.04 @ 10 GHzRogersRT/duroid 6002
YesYes19/2464
0.0018 @ 1.9 GHz3.50 @ 1.9 GHz
TaconicRF-35
YesYes9-12130-145
0.0019 @ 10 GHz
2.45-2.65 +/-0.04 @ 10 GHz
TaconicTLX
YesYes
9-12700.0030 @ 10
GHz2.75-3.20 +/-
0.05 @ 10 GHzTaconicTLC
Immersion Gold/Tin Finish?
HASLFinish?
CTE-X & Y AxisCTE-Z Axis
Dissipation Factor
Dielectric Constant
Supplier/MaterialTypeMaterial
High Frequency Materials (core material only)
AD Series0.0018-0.0038
@ 10 GHz
Rogers
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North AmericanTop Tier Customers
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Let the DAPC team get started on your project today!