MEMS/NEMS Technology and Devices Lecture 1: Introduction AMN- 606 MEMS/NEMS Technology and Devices...

AMN- 606 MEMS/NEMS Technology and Devices

Lecture 1: Introduction

Dr. Hassan Mostafa

[email protected]

Cairo University

Fall 2018

Course Information

Course website:

http://scholar.cu.edu.eg/hmostafa/classes/amn606

Office hours by email appointments

Instructor office:

Electronics & Communications building, Top floor, Room 8414

This course

cover basic MEMS/NEMS fabrication technologies

various transduction mechanisms

piezoelectric, thermoelectric, thermionic, and piezoresistive

cover the theory of operation of few sensors/actuators

infrared detectors, radiation sensors, rotation and acceleration sensors, flow sensors, pressure and force sensors, and motion sensors

MEMS/NEMS Cairo University 2

Course Information

Textbook reference:

An Introduction to Microelectromechanical Systems Engineering (Artech House Mems Library) by Nadim Maluf

Optional references

Fundamentals of Microfabrication by Marc J. Madou

Micromachined Transducers Sourcebook by Gregory T. A. Kovacs

Marking scheme

30% Course Project

70% Final Examination


Really small devices



10,000 Meter Scale


1,000 Meter Scale


100 Meter Scale


10 Meter Scale


1 Meter Scale


0.1 Meter Scale


10 mm Scale


1 mm Scale


100 micrometer Scale


10 micrometer Scale


1 micrometer Scale


0.1 micrometer (100 nm) Scale


(<10 nm) Scale

The realm of molecules, DNA, proteins, and atoms.

What are MEMS/NEMS?

MEMS/NEMS = Micro/Nano-Electro-Mechanical Systems

Tiny machines (micro and nano scale)

Not just micro/nano-fabrication

Enabling technology to augment as they are fabricated for a specific application (non-standardization)

Miniaturization for performance enhancement


Optical Switch from

Lucent

Lab-chips from

Agilent


Examples

Microphone from

Knowles Digital Micro-mirrors

Device (DMD) from TI


Examples

Inkjet Nozzle from

HPAccelerometer from

Analog Devices


Examples

Micro-scale gear chains

Micro-scale guitar


Examples

Needle without pain

Roboroach


Examples

History

There’s plenty of room

at the bottom

1959


Richard Feynman

What I want to talk about is the problem of

manipulating and controlling things on asmall scale.

It is a staggeringly small world that isbelow. In the year 2000, when they lookback at this age, they will wonder why itwas not until the year 1960 that anybodybegan seriously to move in this direction.

Why cannot we write the entire 24volumes of the Encyclopedia Brittanica on

the head of a pin?

Interdisciplinary

Traditional

Above mm: traditional mechanics

Micron to mm: microelectronics and electrical engineering

Nanometer to micron: chemists

Now

Micro

Nano

Engineering

Biology

Chemistry

Feeds each other


MEMS Fab in the world


MEMS Advantages

MEMS devices integrate multiple functions like sensing, decision making and control functions on a single chip

High Sensitivity

Portability

Batch fabrication reduces manufacturing cost and time

Low power consumption

Easy to maintain and replace



Introduction to MEMS


Micro/Nano Fabrication

No such thing as “Shrinking machines”

Must learn how to build them small



Top-Down

Start from bulk substrate and remove materials to form the desired structure

Similar to forming a statue from a large rock

Example: Photo-lithography



Bottom-Up

Start from atoms to form the desired structure

Similar to LEGO bricks



Bottom-Up

Example: using Atomic Force Microscope tip



Clean room facility:

Originally developed by NASA for satellite manufacturing

Clean rooms now in use for all MEMS and semiconductor

manufacturing.




Particle free walls, furniture, and accessories must be used

Airflow through 0.3 microns filters




Main function of clean rooms is control of particle contamination

Requires control of air flow, water and chemical filtrations,

human protocol

Class N clean room means fewer than N particles (>0.5 µm) in

1 cubic foot of air

Classes types:

Class 10,000

Class 1,000

Class 100

Class 10




Class 10,000 Class 1,000 Class 100 Class 10

PCBs, MEMS, MEMS,ICsPackaging, Packaging, RF/Photonic ICs

Medical devices Hard disk drives


Photolithography

Coat, protect, expose, etch, repeat…


Photolithography

Start with wafer (a clean, flat surface)


Photolithography

Grow a thin film of desired material

Coating in furnace


Photolithography

Spin coat photo-resist layer Photo-resist goes wet and dried after spin


Photolithography

Expose photo-resist to UV light through a mask Mask is aligned to wafer before exposure


Photolithography

Resist is removed from exposed areas

Remaining resist reproduces the mask pattern


Photolithography

Resist protects selected regions during etch

Pattern is transferred to substrate material


Packaging

For the micro-device to be useful, it must be “packaged”

80% of the MEMS cost is in packaging

Packaged device can be inserted into system

MEMS/NEMS Technology and Devices Lecture 1: Introduction AMN- 606 MEMS/NEMS Technology and Devices...

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