Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020...

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Intel Confidential 1 Challenges and Opportunities Ahead… Are we ready for the future digital world? Nasser Grayeli Intel Corporation Vice President Technology Manufacturing Group Director – Corporate Quality Network June 2011

Transcript of Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020...

Page 1: Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020 Productivity Era TeleComm Era Internet Era “Smart” Era er Source Wearable computing lab

Intel Confidential11

Challenges and Opportunities Ahead… Are we ready for the

future digital world?

Nasser GrayeliIntel Corporation

Vice President Technology Manufacturing Group Director – Corporate

Quality Network June 2011

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We Have Come a Long Way in 40 Years!

HighHigh

LowLow’’7575 ’’8080 ’’8585 ’’9090 ’’9595

CapabilityCapability

16 Lead CER DIP

’’0000 ’’0505 ‘‘1010

High I/O, Power

CPGA

FC-BGA

C-MCM

QFP

High Density Flip Chip MCP

Low Cost, Size

TSOP

Chip Scale Package

Stack Package

PLCCStack Die

Page 3: Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020 Productivity Era TeleComm Era Internet Era “Smart” Era er Source Wearable computing lab

Digital Growth Worldwide

Source: IDC, Gartner, et Forecast

Internet UsersBillions

1990 1995 2000 2005 2010 2015

0

.5

1

1.5

2

2.5

Personal Computer SalesUnits (Millions)

1990 1995 2000 2005 2010 2015

0

100

200

300

400

500

600

700

Internet TrafficExabytes

2005 2010 2015

0

250

750

1000

Smart Phone Sales(Millions)

2000 2005 2010 2015

0

100

200

300

400

500

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Explosion in Types of Devices & UsagesExplosion in Types of Devices & Usages

New Era of Smart Devices & Usage Models1970 200019901980 2010 2020

Productivity Era

TeleComm Era

Internet Era

“Smart” Era

ServerServer

Source Wearable computing lab

Used with Permission GIVEN®

IMAGING

Page 5: Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020 Productivity Era TeleComm Era Internet Era “Smart” Era er Source Wearable computing lab

Smarter Products are More Complex

Technologies and Form Factors are Rapidly Changing and Evolving

Page 6: Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020 Productivity Era TeleComm Era Internet Era “Smart” Era er Source Wearable computing lab

Putting 2015 into PerspectivePutting 2015 into Perspective

1 Billion More Internet Users

10 Billion More Connected Devices

8x More Internet Traffic and 16x More Storage

More People

More Devices

More People Doing More Things with More Types of Devices

Doing More Things

Source: IDC, Gartner, Frost & Sullivan

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77

Quality Issues Can have an Impact

IPhone 4G: So many problems and no solutions July 18, 2010 by D. Burton

How bad could BP oil spill get for the Gulf & the nation? June 9,

2010 USA Today

Our Own Issue

Intel® 6 Series Chipset Issue

Photos - Courtesy of Apple

Page 8: Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020 Productivity Era TeleComm Era Internet Era “Smart” Era er Source Wearable computing lab

88

Increasing Product & Technology Complexity

Maintaining Quality & Reliability in Face of Increasing Diversity of Materials, Architectures, Circuits and Technology is Critical

E

B

C

IA CoreCache Memory

Display Interface

High Speed Memory Interface

Hig

h S

pee

dSer

ial In

terf

ace

Bas

ic I

/OM

edia

In

terf

ace

Gfx/Security/ Video/Audio

SRAM/RF

Inductors

Precision LinearCapacitors

High Perf /LPwrLogic Transistors

Analog/ HV I/OTransistors

Decap

n+

n- well

n+ n+ n+ n+

Port 1

Vbias= VgatePort 2

Vbias = 0 V

Single Ended Varactor

n+

n- well

n+ n+ n+ n+

Port 1

Vbias= VgatePort 2

Vbias= 0 V

Single Ended Varactor

n+

n- well

n+ n+ n+ n+

Port 1

Vbias= VgatePort 2

Vbias = 0 V

Single Ended Varactor

n+

n- well

n+ n+ n+ n+

Port 1

Vbias= VgatePort 2

Vbias= 0 V

Single Ended Varactor

Varactors

DiodesVertical

BJT

E

B

C

System on a Chip

100,000x Increase

New Materials

New Transistor

Architectures

Dimensional Scaling

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Rapid Ramp of New TechnologyRapid Ramp of New Technology

Robust Design and Manufacturing Defect Detection and Containment Systems are Critical

Source: Microsoft, Apple, arstechnica

Mon

ths

Page 10: Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020 Productivity Era TeleComm Era Internet Era “Smart” Era er Source Wearable computing lab

Hardware: CPU/SOC

Applications

Frameworks

Libraries

Middle-ware

IPs block dependant layer

Firmware

OSOperating System

Kernel

Drivers

Kernel

“Smart” Device

Package Reliability & BGA Mfg DPM

Silicon Reliability & Mfg DPM

One of Several Ingredients

UserUserExperienceExperience

Products Now Require a Higher Level of Integration to Ensure “Quality & Reliability” of Consumer Experience

Package Reliability & BGA Mfg DPM

Silicon Reliability & Mfg DPM

Is the User Experience a Reflection of Quality?

WirelessWireless

MemoryMemory

ComputingComputing

GraphicsGraphics

NetworkingNetworking

MultimediaMultimediaMobilityMobility

CompactnessCompactness

Battery Life / Power MgmtBattery Life / Power Mgmt

VirtualizationVirtualization

SecuritySecurity

MultitaskingMultitasking

Ease of UseEase of Use

ResponsivenessResponsiveness

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Form Factors and Usage Models will Continue to Evolve Rapidly and Impact Q&R Requirements

Must Increase Confidence in Modeling Capabilities to Predict the Quality & Reliability Performance of More Complex Form Factor Products

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Regulatory Landscape is Changing Regulatory Landscape is Changing RapidlyRapidly

Mercury Ban

Batteries

WEEE

RoHS

Batteries

Battery law

2000 2011

CA GreenChemistry,

RoHS

State mercury, PBB/PBDE, e-waste laws

E-waste & packaging

laws

E-waste

Battery law

E-waste , Dfe product &Packaging

E-waste

ErP

REACH

E-waste & Energy

E-waste

China RoHS

Energy law

Energy E-waste,

RoHS

Packaging

Federal CPSIA

IPP25 EU States –WEEE & RoHS

RoHS study

E-waste, RoHS

E-waste, RoHSDraft Dfe, Take-back,

Packaging

Draft RoHS, Battery

GCCGCC

CIS

Evolving EMC, Safety, Wireless, Encryption, RegsEvolving EMC, Safety, Wireless, Encryption, Regs

Page 13: Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020 Productivity Era TeleComm Era Internet Era “Smart” Era er Source Wearable computing lab

Achieving our Quality System Goals by Ensuring High Quality Across the Supply Chain

Our Ecosystem is More Interdependent & Our Ecosystem is More Interdependent & Complex than EverComplex than Ever

Capabilities and Limitations to meet requirementsCapabilities and Limitations to meet requirements

Customer requirementsCustomer requirements

Fabless DesignIDM Factories

Customers

Supplier

Foundry / Subcons

OEMsSub-Supplier

Sub-Supplier

ODM/EMS

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CustomerCustomerValueValue

Quality Systems are the Foundation of Our Quality Systems are the Foundation of Our SuccessSuccess

Robust Quality Systems Must Include All Three Elements to be SucRobust Quality Systems Must Include All Three Elements to be SuccessfulcessfulBut Focus Must Shift from Containment to Prevention Systems But Focus Must Shift from Containment to Prevention Systems

PreventionPrevention

Technology Technology QualificationQualification

Change Change ManagementManagement

Preventive Preventive MaintenanceMaintenance

Product DesignProduct Design InIn--line line Process ControlProcess Control

Product QualityProduct QualityMonitorsMonitors

Excursion Excursion Mgmt SystemMgmt System

Product Product DevelopmentDevelopment

Technology Technology DevelopmentDevelopment

MaterialsMaterials

=ContainmentContainment

DetectionDetection

Page 15: Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020 Productivity Era TeleComm Era Internet Era “Smart” Era er Source Wearable computing lab

New Quality Imperatives

Adopt a Systems Perspective to Quality & Reliability

Predictive Design & Modeling Capabilities are becoming more important to Prevent Quality Issues from Occurring

Products Require a Higher Level of Integration to Ensure “Quality & Reliability” of Consumer Experience

Increasing Complexity Requires that we Fully Understand the Material & Processes across the Supply Chain

Page 16: Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020 Productivity Era TeleComm Era Internet Era “Smart” Era er Source Wearable computing lab

Summary

More People Doing More Things with More Devices… Exciting New Era with many opportunities to innovate

Quality Systems must evolve to meet the new market needs or risk failure

New approaches and capabilities are a “Must Have”to Survive

Are you ready for the future digital world?

Page 17: Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020 Productivity Era TeleComm Era Internet Era “Smart” Era er Source Wearable computing lab

Intel Confidential1717

Questions?

Page 18: Intel - ECTC - Keynote - June-11-rev4 (2) Intel - ECTC... · 1970 20001980 1990 2010 2020 Productivity Era TeleComm Era Internet Era “Smart” Era er Source Wearable computing lab

2011-6-218

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