Background Statement for SEMI Draft Document...

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Background Statement for SEMI Draft Document 4599B NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 mm LOAD PORT

Note: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document.

Note: Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or a patent application has been submitted. In the latter case, only publicly available information on the contents of the patent application is to be provided.

Background

This document has been developed to provide the interface specifications for a 450 mm load port.

These interface specifications include:

Section 7: Interface between Load Port and Carrier Delivery System (equivalent to 300 mm SEMI E15.1 and E64)

Section 8: Interface between Load Port and Carrier Door (equivalent to 300 mm SEMI E62)

Section 9: Interface between Load Port and Semiconductor Manufacturing Process Equipment (equivalent to 300 mm SEMI E63)

Each section contains an explanatory text, a table summarizing all dimensions, and supporting figures.

A load port according to this document is intended to mate with the specification for the 450 mm carrier as in SEMI document 4570B.

A table in section Related Information – Application Notes is explaining a few areas that have been improved compared to 300 mm SEMI standards as part of “lessons learned”.

The task force has been informed that there may be intellectual property within the main body as carried over from 300 mm standards.

The changes in this document compared to the first Yellow ballot include items such as:

Added Load Port Side Exclusion Volume

Modified z105 value

Added new description for an upper equipment boundary.

Several adjustments to dimensions.

Removed KC Pin definition from Related Information

Several editorial improvements

This formal letter (yellow) ballot will be discussed and adjudicated at the SEMI Standards NA Fall 2009 Meetings taking place at Santa Clara, CA, November 2-5, 2009.

This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted standard. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

Page 1 Doc. 4599B SEMI

Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone:408.943.6900 Fax: 408.943.7943

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DRAFTDocument Number: 4599B

Date: 2009/09/09

SEMI Draft Document 4599 NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 mm LOAD PORT

1 Purpose

1.1 The purpose of this document is to define the basic interface dimensions of a load port on the semiconductor manufacturing equipment, where a 450 FOUP can be loaded and unloaded. The intention of this document is to define a set of requirement and features to enable interoperability of load ports and carriers without limiting innovative solutions.

2 Scope

2.1 The interface specification in this document is driven by and intended to mate with a carrier compliant to the relevant SEMI 450mm FOUP standard.

2.2 Loading and unloading is assumed to take place in semi-automated and automated mode by using any kind of system or device (ie: Person guided vehicle or overhead hoist vehicle).

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

3 Limitations

3.1 This standard does not intend to address manual loading or unloading of a carrier.

3.2 The detailed methods and mechanisms inside a 450 FOUP door of how a carrier door may be engaged to and disengaged from the carrier shell are not specified within this document.

3.3 Since the direct scale-up of the 300 mm methods (e.g., for how a load port is opening/closing a FOUP, KC pin-to-carrier groove interface, KC pin/Groove system-to-load port open/close interface, and wafer pitch/wafer handling) has not yet been demonstrated, this document is to address the need for prototyping and data gathering.

4 Referenced Standards

4.1 SEMI Standards and Documents

SEMI E63 — MECHANICAL SPECIFICATION FOR 300 mm BOX OPENER/LOADER TO TOOL STANDARD (BOLTS-M) INTERFACE

NOTE 1: SEMI is developing a Mechanical Specification for 450 mm Infab Carriers intended to be used in conjunction with this document.

4.2 ISO Specification1

ISO 4287 — Geometrical Product Specifications (GPS) – Surface texture: Profile method – Terms, definitions and surface texture parameters.

ISO/DIS 68-1 — ISO General Purpose Screw Threads - Basic Profile - Part I: Metric Screw ThreadsNOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

5 Terminology

5.1 Abbreviations and Acronyms

5.1.1 BI — BOLTS interface surface

5.1.2 BOLTS — Used generally as a “term” only within this document to identify the interface between a load port and the semiconductor manufacturing equipment. Originally it is an abbreviation defined in SEMI E63.

1 International Organization for Standardization, ISO Central Secretariat, 1, ch. de la Voie-Creuse, Case postale 56, CH-1211 Geneva 20, Switzerland. Telephone: +41 22 749 01 11; Fax: +41 22 733 34 30; Website: http://www.iso.org




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5.1.3 EB — 450 Equipment Boundary

5.1.4 EBUPPER— 450 Equipment Boundary above z100

5.1.5 KC — Kinematic Coupling

5.1.6 LB — 450 Load Boundary

5.1.7 SME — Semiconductor Manufacturing Equipment

5.2 Definitions

5.2.1 450 BOLTS interface surface (BI) — a physical surface on the semiconductor manufacturing equipment intended to mate with a load port.

5.2.2 450 equipment boundary (EB) & Upper 450 Equipment Boundary (EBUPPER)— consisting of two planes, one plane parallel to the facial plane establishing the boundary between the semiconductor manufacturing equipment and the load port (see dimension y100). And, the second plane parallel to the facial plane and above z100 establishing the boundary between the semiconductor manufacturing equipment and the overhead transport vehicle (see dimension y105)

NOTE 2: The 450 equipment boundary is not defining a physical feature. It is a boundary only between the load port and the SME. The EB and EBUPPER should not be confused with the “physical” equipment front as defined in section 7.9. The equipment front is a real physical feature, while the EB and EBUPPER is a boundary only.

5.2.3 450 FOUP — used generally as a “term” only to identify the front-opening carrier used in fabs for 450 mm wafers.

5.2.4 450 load boundary (LB) — a plane parallel to the facial plane establishing the boundary between the load port and the fab aisle (see dimension y101).

5.2.5 450 load height — the distance from the horizontal plane to the fab floor.

5.2.6 450 load port — the interface location on a semiconductor manufacturing equipment, where a 450 FOUP can be loaded and unloaded.

5.2.7 450 spacing — the distance from the bilateral plane of one load port to the bilateral plane of an adjacent load port on a semiconductor manufacturing equipment.

5.2.8 bilateral plane (BP) — a vertical plane, defining x=0 of a system with three orthogonal planes (HP, BP, FP), coincident with the nominal location of the rear primary KC pin, and midway between the nominal locations of the front primary KC Pins.

5.2.9 facial plane (FP) — a vertical plane, defining y=0 of a system with three orthogonal planes (HP, BP, FP), y33=194 ±0 mm in front of the nominal location of the rear primary KC pin

5.2.10 horizontal plane (HP) — a horizontal plane, defining z=0 of a system with three orthogonal planes (HP, BP, FP), coincident with the nominal location of the uppermost points (tips) of the three kinematic coupling pins.

5.2.11 nominal location — the value a dimension would have if its tolerance were reduced to zero.

5.2.12 load port frame — mechanical feature on a load port surrounding the load port door.

5.2.13 load port door — mechanical feature on a load port surrounded by the load port frame. It can be engaged with the carrier door and together they can be moved away to allow access to wafers in a carrier.

5.2.14 plane — a theoretical surface which has infinite width and length, zero thickness and zero curvature.

6 Ordering Information

6.1 The user should specify which of the load port options is required.

7 Requirements for Interface between Load Port and Carrier Delivery System

7.1 Load Height — The nominal load height of any load port in a fab is defined by dimension z101 and depicts the nominal distance from the horizontal plane to the floor. A set of load ports, but not necessarily each load port




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separately, must be adjustable at installation over the range associated with z101 in Table 1. This adjustability requirement also applies for load ports according to Option C (raised load port).

NOTE 3: For more details see Related Information 1.

7.2 Aisle Clearance of Load Port — No part of a load port shall protrude beyond the load boundary (LB) as measured from the BOLTS interface surface. See dimension y101.

NOTE 4: There is no requirement for any kind of physical plate of a certain height or shape at the load boundary.

7.3 Clearance Above Load Port and Below Carrier — No part of the load port except those features intended for interaction with the carrier (e.g. kinematic coupling pins, carrier hold-down features) shall protrude above dimension z160. There shall be no interference between any part of the load port and the carrier when delivered within the lead-in range defined in the 450mm FOUP document.

7.4 Vertical Clearance for Overhead Transport — To provide clearance for overhead carrier transport, no part of the equipment (including the 450 FOUP on a load port) in front of a plane defined by the 450 equipment boundary (towards the load boundary) and the entire width of the SME shall be higher than z100 from the floor. The volume below z100 may contain carriers stored in an internal buffer. Additionally, no part of the overhead transport system shall protrude below z102.

7.5 Horizontal Clearance for Overhead Transport — No part of the semiconductor manufacturing equipment shall protrude towards the facial plane beyond both the equipment boundary (EB) and upper equipment boundary (EBUPPER) as defined by dimension y100 and y105. The vertical “chimney” between both of the equipment boundaries and the load boundary above the horizontal plane as defined by dimensions y100, y101 and x103 must not be occupied by the semiconductor manufacturing equipment.

7.6 RFID Reader/Writer Placement Volume — A load port must allow for installation of a unit that can read from or write to an RFID tag (as it may be installed in the corresponding placement volume on the rear of a 450 FOUP) within the limits of a volume defined by x110, y110, y111, z110, z111. Reading/writing is intended to take place with the carrier in a position as initially delivered to the load port (undocked position). If no reader/writer unit is installed, this placement volume may be covered.

NOTE 5: As a consequence of the requirement defined above, any RFID reader/writer unit must fit in the placement volume defined above.

NOTE 6: RFID reader/writer within this context is understood as those parts that must be located within this volume in order to be able to communicate with the tag on the carrier. Usually this is the antenna. Other components of an RFID reader/writer system are not necessarily required to be placed within this volume.

7.7 Spacing — Load ports adjacent to each other on the semiconductor manufacturing equipment must be located at a distance as defined by dimension x100.

7.8 Photo-Coupled I/O Device Placement Volume — In the lower area of each load port there must be volume, defined by x120, y120, the load boundary, z121, and z122, allowing for placement of a photo-coupled I/O device for communication to floor-based transport vehicles. This placement volume is centered on the bilateral plane.

7.8.1 A photo-coupled I/O device may be installed anywhere within this placement volume upon the discretion and design requirements of the load port supplier. However, the center of its beam line must be within the vertical limits defined by dimension z120. In horizontal direction (perpendicular to the facial plane) the beam line must also be centered to the bilateral plane within the same limits as defined by the tolerance associated to z120.

7.8.2 If no photo-coupled I/O device is installed, the placement volume may be covered by a panel.

NOTE 7: A photo-coupled I/O device is much smaller than the placement volume defined above, thus providing some design freedom for device mounting. Typical I/O devices have a depth of 20 to 70 mm. The load port supplier is free to mount the I/O device either closer to the LB or closer to the EB, depending on the actual design of the load port. If the lower part of a load port is recessed from the LB, it may be desirable to mount the device still inside the LP housing by utilizing the full depth of the placement volume.

7.9 Equipment Front —a part on the front of the semiconductor manufacturing equipment protruding furthest towards the facial plane is defined as the equipment front. The equipment front shall not penetrate the equipment boundary.




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NOTE 8: While the equipment boundary is a virtual boundary plane at a fixed distance from the BOLTS interface surface, the equipment front is a physical feature.

7.10 Docking Interface Placement Volume — A load port must provide clearance for installation of a docking interface within the limits of a volume defined by y130 and z130. It extends over the full width of the semiconductor manufacturing equipment. If no docking interface is installed, this placement volume may be covered by a panel.

7.11 Volume for Fork-Lift Truck — The entire volume below a load port between the load boundary and the BOLTS interface surface shall be kept clear up to height above the floor defined by dimension z105 and x142 in order to allow for access by a fork-lift truck upon equipment move-in. The volume may be covered by a removable panel. See figure 5 for a sketch of the volume.

7.12 Fork-Lift Exclusion Volume on Load Port below Carrier — Two exclusion volumes on the left and right side of the load port must be kept clear so that fork-lifts or conveyors may be used to load/unload a carrier to/from a load port. These exclusion volumes are defined by x140, x141, y140, y141, z140, and z141.

7.13 Alignment Mark on Load Port — In order to support alignment and verification a load port shall have a visible mark (cross-hair) to depict the intersection of the facial plane and bilateral plane.

7.14 Alignment Feature on Semiconductor Manufacturing Equipment — The BOLTS interface surface was chosen in this standard to reference dimensions in horizontal (y) direction, since it is the most accurate stationary and non-adjustable feature on the semiconductor manufacturing equipment with respect to the load port.

7.14.1 Because the BOLTS interface surface may not be accessible when a load port is attached, a rigid, always exposed feature on the semiconductor manufacturing equipment is required to support alignment of the semiconductor manufacturing equipment to the carrier transport system upon move-in and install.

7.14.2 For that purpose, the BOLTS interface surface shall extend vertically beginning at the minimum value of z379 from the HP and shall be exposed over its entire width and over a height defined by dimension z384 (see figure 13).

7.15 Kinematic Coupling Pins — A load port must have a set of three primary coupling pins as defined in the 450 mm carrier document. A load port must be designed such that there will be no interference between any part of the load port and a carrier delivered within the lead-in range of r15 specified in the 450 mm carrier document.

7.16 Options — Semiconductor Manufacturing Equipment can be configured with a variety of load port combinations chosen from the options defined in this section. If no option is specified, Option A is assumed. The three-dimensional sketches within the options sections are for illustration. Dimensional requirements are shown in the figures at the end of the entire section.

NOTE 9: Volumes depicted for certain purposes, e.g. for a load port or for carrier buffering, do not preclude the placement of items like EMO, light tower, and GUI within these volumes.

NOTE 10: Options are shown symmetrically with two load ports for clarity. However, configurations with one load port only as well as asymmetrical configurations are not excluded.




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7.16.1 In Option A, the load port must be at the nominal load height as specified by dimension z101, and it must be open from above to facilitate automatic carrier delivery from an overhead transport system. The volume left and right of the load port may be occupied by the semiconductor manufacturing equipment, with a side clearance of x144 between any part of the semiconductor manufacturing equipment on the side of the load port above z160.

Volume Used by SME

SemiconductorManufacturing

Equipment(SME)

Carrier on Overhead Transport System

•Load Port at Nominal Height•Open „Chimney“ Above Load Port•Volume Left/Right Used by SME

Loadport Side Exclusion Volume

Volume Used by SME

Load Port at Nominal Height



Carrier in Transit Up/Down via

„Chimney“

Volume Used by SME


Equipment(SME)

Carrier on Overhead Transport System

•Load Port at Nominal Height•Open „Chimney“ Above Load Port•Volume Left/Right Used by SME


Volume Used by SME





„Chimney“

Figure 1

Three-dimensional view of Option A

7.16.2 Option B is identical to Option A with the exception that the volume left and right of the load port over the entire width of the semiconductor manufacturing equipment is used for carrier buffering.


Equipment

Carrier on Overhead

Transport System

•Load Port at Nominal Height•Open „Chimney“ Above Load Port•Volume Left/Right Used for Carrier Buffering


Volume Used for Carrier Buffering

Load Port at Nominal





„Chimney“


Equipment

Carrier on Overhead

Transport System

•Load Port at Nominal Height•Open „Chimney“ Above Load Port•Volume Left/Right Used for Carrier Buffering








„Chimney“

Figure 2 Three-dimensional view of Option B

7.16.3 In Option C the distance from the horizontal plane of the load port may be at any height above z101 that leaves the top of the carrier under z100.




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Equipment

Carrier on Overhead

Transport System

•Raised Load Port•Load Port Open Above•With or Without other Options

Raised Load Port

Raised Load Port

Unspecified Volume

Figure 3 Three-dimensional view of Option C

7.16.4 In Option D the load port must be at the nominal load height as specified by dimension z101, is not open from above, and it must have a clearance around the carrier as specified by dimensions z103 and x103.




Equipment

Carrier on Overhead

Transport System

•Load Port at Nominal Height •Load Port Covered Above („Load Lock“)•With or without other Options

Unspecified Volume

“Load Lock”

Figure 4 Three-dimensional view of Option D

7.17 Load port Side Exclusion Volume for User Defined Objects - An exclusion volume shall exist on the equipment if the equipment is wider than the load ports (for example, equipment with two load ports wider than x374+x100+x374=1268mm must incorporate a load port side exclusion volume). This exclusion volume shall exist on both sides of the outer most load ports and shall be bounded by x143 and x144 below z161 and bounded by x103 and x144 above z161. The exclusion volume shall extend from the EB to the LB. If x144 extends past the edge of the SME then x144 will be reduced to the outermost edge of the SME (i.e. the load port side exclusion volume will not define or increase the width of the SME). The load port side exclusion volume shall remain clear of any




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obstruction on the SME, (e.g. lights, buttons, GUI etc.) and must remain available for any user defined object. This volume will only exist on load port options A and B.

Table 1 Dimensions of Interface between Load Port and Carrier Delivery System

Symbol Used Figure Value Specified Datum Measured From Feature Measured To

x100 5 638 ± 1 mm Bilateral plane of a load port Bilateral plane of an adjacent load port

x103 6 ≥307.5 mm

Bilateral plane Clearance of on both sides of the Option A load port above the horizontal plane where no part of the semiconductor manufacturing equipment shall protrude

x110 5 150 mm Left hand side edge of placement volume for RFID reader/writer (symmetric to both sides of bilateral plane)

Right hand side edge of placement volume for RFID reader/writer (symmetric to both sides of bilateral plane)

x120 5 200 mm Left hand side edge of placement volume for photo-coupled I/O device (symmetric to both sides of bilateral plane)

Right hand side edge of placement volume for photo-coupled I/O device (symmetric to both sides of bilateral plane)

x140 8 215 mm Bilateral plane Inner edge of fork-lift exclusion volume

x141 8 292.5 mm Bilateral plane Outer edge of fork-lift exclusion volume

x142 5 488 mm Left hand side edge of exclusion volume for lift-truck access under SME (symmetric about bilateral plane).

Right hand side edge of exclusion volume for lift-truck access under SME (symmetric about bilateral plane).

x143 6 315 mm Bilateral Plane of first and last load port of the SME

Inner most surface of Load Port Side Exclusion Volume

x144 6 355 mm Bilateral Plane of first and last load port of the SME

Outer most boundary of Load Port Side Exclusion Volume

y100 5 40 mm BOLTS interface surface 450 equipment boundary

y101 5 573.75 mm BOLTS interface surface 450 load boundary

y104 5 321.25 (Nominal)

With +10 / -5 mm adjustability

BOLTS interface surface Facial plane on load port (undocked)

y105 5 10 mm BOLTS interface surface Equipment Boundary Upper (above z100)

y110 5 5 mm Load boundary Edge of placement volume for RFID reader/writer towards LB

y111 5 45 mm Load boundary Edge of placement volume for RFID reader/writer towards FP

y120 5 473.75 mm Load boundary Front edge of placement volume for photo-coupled I/O device

y130 5 100 mm Load boundary Front edge of placement volume for docking interface

y140 8 Identical with y100 BOLTS interface surface Front edge of fork-lift exclusion volume

y141 8 Identical with y101 BOLTS interface surface Rear edge of fork-lift exclusion volume




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z100 5 ≤2410 mm Floor Vertical boundary for SME between the equipment boundary and the load boundary

z101 5 913 mm (Nominal)

with ±10 mm adjustability of

load port or set of load ports

Horizontal plane Floor

z102 5 ≥2450 mm Floor Vertical boundary for OHT between the equipment boundary and the load boundary

z103 7 ≥485 mm

Horizontal plane Protrusion of any part of the load port above the carrier towards the horizontal plane

z105 5 863 mm Horizontal plane Upper edge of volume below load port recommended to kept empty for fork-lift truck access to semiconductor manufacturing equipment

z110 5 25 mm Horizontal plane Upper edge of placement volume for RFID reader/writer

z111 5 60 mm Horizontal plane Lower edge of placement volume for RFID reader/writer

z120 5 663 ± 3 mm Horizontal plane Center of optical beam line of photo-coupled I/O device

z121 5 613 mm Horizontal plane Upper edge of placement volume for photo-coupled I/O device

z122 5 100 mm Upper edge of placement volume for photo-coupled I/O device

Lower edge of placement volume for photo-coupled I/O device

z130 5 100 mm Floor Upper edge of placement volume for docking interface

z140 8 19 mm Horizontal plane Upper edge of fork-lift exclusion volume

z141 8 ≥20 mm

Upper edge of fork-lift exclusion volume

Lower edge of fork-lift exclusion volume

z160 6 ≥21 mm

Horizontal plane Encroachment of any non-interacting feature on the upper side of the load port towards the bottom of the carrier

z161 6 ≥1484 mm

Floor Lower boundary of load port side exclusion volume in front of load boundary.




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Figure 5 Interface between Load Port and Carrier Delivery System

EQUIPMENTBOUNDARY(BELOW z100)

FACIALPLANE

CARRIERFRONT

BOLTS INTERFACESURFACE(BI)CARRIER ON

LOAD PORT

BILATERALPLANES

z1022450

VERTICALBOUNDARYFOR OHT

x100=638±1y120=473.75

FLOOR

FLOOR

-HP-

-FP--BP- -BP-

z101=913 (Nominal)with ±10

adjustability for each load portor set of load ports

-LB-

-EB-

z110=25

FRONT VIEW SIDE VIEW

z122=100

x120=200

x110=150

z130=100

y130=100

z120=663±3

z111=60

z121=613

y101=573.75

z16021

y111=45 z105=880

y100=40

CARRIERON OVERHEAD

TRANSPORTSYSTEM

y110=5

-EB-

y105=10(ABOVE z100)

-BI-

EQUIPMENTBOUNDARY UPPER(EBUPPER)

y104=321.25 (Nominal) with +10/-5 adjustability

HORIZONTALPLANE

z1002410

VERTICALBOUNDARYFOR SME

x142=488.0




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Figure 6 Load Port Option A

FRONT VIEW

z16021

SIDE VIEW

FLOOR

-HP-

VERTICALCLEARANCE

FOR OVERHEADTRANSPORT

-BP--LB-

-BP--EB-

OPTION A

-FP-

x103307.5

z1002410

x144=355

x143=315

z1611484

LOADPORTSIDE

EXCLUSIONVOLUME

FOR USERDEFINEDOBJECTS




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-FP-

FLOOR

-HP-

z101=913 (Nominal)with ±10

adjustability for each load port or set of load ports

z1002410

-FP-

OPTION B OPTION C OPTION D

-FP-

z103485

Figure 7

Load Port Options B, C, and D




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x140=215

x141=292.5

y141=y101

-LB-

-BP-

TOP VIEW

CARRIER ENVELOPE

-BOLTS INTERFACE SURFACE-

y140=y100

-EB-

z140=19

z14120

-HP-

CARRIERENVELOPE

FRONT VIEW

-BP-

x140=215

x141=292.5

Figure 8 Fork-Lift Exclusion Volumes on Load Port Below Carrier




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8 Requirements for Interface between Load Port and Carrier Door

The requirements of this section only need to be met if the load port has the capability to open and close a carrier.

8.1 Reserved Areas for Vacuum Application Features — Four areas, located symmetrically to the vertical and horizontal center line of the load port door, defined by r238, x231 and z231, are reserved for placement of optional vacuum application features. If present, the vacuum application features on the load port door must be smaller than r238 in order to mate with flat surfaces defined on the carrier door.

NOTE 11: The same four areas are defined on the carrier door.

8.2 Door Mechanism (300mm method) — The carrier door can be latched and unlatched by a set of two “T” heads on shafts, called latch keys. Unlatching the carrier door from the carrier shell is intended by rotating the keys counter-clockwise (as viewed by a person standing in front of the load port facing the equipment boundary) to horizontal.

8.2.1 Latching the carrier door to the carrier shell is intended by rotating the keys clockwise to vertical. The latch keys must not rotate beyond these limits of the rotation angle .

8.2.2 Convex features on the outer edges of the latch keys must have blend radii of r241, r242, and r243 to prevent small contact patches with large stresses that might cause wear and particles. Other convex features on the latch keys need only be de-burred and rounded off. The surface finish of the latch keys must have a roughness of Ra247.

NOTE 12: Radius r243 blends to zero at d237.

8.2.3 Latch keys are intended to mate with corresponding key holes required on the carrier door.

8.3 Load Port Door — The outer edge of the load port door is defined by dimensions x233, z233 and r233.

8.4 Load Port Frame — The inner edge of the load port frame is defined by dimensions x234, z234 and r234.

8.5 Door Pins — The two optional door pins located on the load port door may be used to limit the maximum displacement of the carrier door while on the load port door in case of a vacuum loss on a load port that is using optional vacuum features to hold the carrier door in place. The two door pins are intended to mate with a hole on one side and a slotted hole on the other side required on the carrier door. The surface finish of the door pins must have a roughness less than or equal to Ra247. The load port shall have the ability to assist with FOUP door recovery when the system experiences utility loss. A method of doing this is to use the optional Load Port door pins.

8.6 Frame Pins — The two optional frame pins located on the load port frame may be used to limit the movement of the carrier frame during opening/closing of the carrier door. The two frame pins are intended to mate with a hole on one side and a slotted hole on the other side required on the carrier frame. The surface finish of the frame pins must have a roughness less than or equal to Ra247.

8.7 Inner and Outer Radii — All required concave features may have a radius of up to r245 to allow cleaning and to prevent contaminant build-up. All required convex features may also have a radius of up to r246 to prevent small contact patches with large stresses that might cause wear and particles.

8.7.1 These limits on the radius of all required features are specified as a maximum (not a minimum) to ensure that the required features are not rounded off too much. The lower bound on the radius is up to the interface supplier.

8.7.2 This radius applies to every required feature unless another radius is called out specifically.

8.8 Door Return Repeatability — The load port door must return to the closed position after opening with a repeatability given by the dimensions x237 and z237. The repeatability of the door in the y axis is not specified and the load port is expected to move the door to a position in the y axis that allows for safe engagement of the FOUP door to the FOUP frame.

8.9 Retraction Force Applied by Latch Keys — If the load port uses retracting latch keys, once the latch keys have been turned to the position that unlocks the carrier door from the carrier, the force (in a direction perpendicular to the facial plane) applied by each latch key to the carrier door must be no greater than f235. The load port shall support the FOUP door to minimize deflection when the keys are retracted.




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Table 2 Dimensions of Interface between Load Port and Carrier Door


ψ 12 0 ± 1° (to unlatch the

carrier door from the carrier)

90 ± 1° (to latch the carrier door to the carrier)

Horizontal plane Clockwise rotation of latch key

d231 10 9 ± 0.1 mm Diameter centered on the intersection of x239 and z230

Surface of door pin shaft

d237 12 8 ± 0.2 mm

Diameter centered on the intersection of x235 and z238

Surface of latch key shaft

d238 11 6 ± 0.1 mm Not applicable Shaft diameter of frame pin

f235 ≤35 N Not applicable Force per latch key applied to the carrier door (in a direction perpendicular to the facial plane)

Ra247 ≤0.30 m Roughness (Ra)

as defined in ISO 4287

Not applicable Surface finish of the door pins, frame pins and latch keys

r233 9 21 ± 0.25 mm Not applicable Outside corner of load port door

r234 9 23 ± 0.25 mm Not applicable Inside corner of load port frame

r236 12 13.5 ± 0.1 mm

Intersection of x235 and z230 Ends of latch key head

r238 9 27.5 mm Intersection of x231 and z231 Boundary of reserved area for vacuum application features on the load port door

r241 12 1.5 ± 0.2 mm

Not applicable Blend radius at convex features on the front edge on the far side of the latch key

r242 12 0.5 ± 0.2 mm

Not applicable Blend radius at convex features on the side edge on the far side of the latch key

r243 12 0.3 ± 0.2 mm

Not applicable Blend radius at convex features on the edge on the near side of the latch key

r245 ≤1 mm Not applicable All concave features (radius)

r246 ≤2 mm Not applicable All convex features (radius)

x231 9 200 mm Bilateral plane Origin of r238 (Vacuum application area)

x233 9 257 ± 0.25 mm Bilateral plane Outside edge of load port door

x234 9 259 ± 0.25 mm Bilateral plane Inside edge of load port frame

x235 9, 12 142 ± 0.2 mm Bilateral plane Center of latch key

x236 12 8 ± 0.1 mm Not applicable Width of latch key head

x237 0 ± 0.2 mm

Position of the load port door before opening

Position of the load port door after closing

x238 9, 11 272 ± 0.2 mm Bilateral plane Center of frame pin

x239 9, 10 220 ± 0.2 mm Bilateral plane Center of door pin

y232 10 11 ± 0.1 mm

Point on door seal area closest to facial plane

End of door pin

y236 12 11 ± 0.1 mm

Front of load port door Far side of latch key head




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y237 12 4.55 ± 0.1 mm

Front of load port door Near side of latch key head

y240 11 10 ± 0.1 mm Load port frame End of frame pin

z230 9, 10, 11, 12

178 mm Horizontal plane Horizontal center line of load port door

z231 9 129 mm Horizontal center line of load port door

Origin of r238 (Vacuum application area)

z233 9 179 ± 0.25 mm Horizontal center line of load port door

Outside edge of load port door

z234 9 181 ± 0.25 mm Horizontal center line of load port door

Inside edge of load port frame

z237 0 ± 0.2 mm Position of the load port door before opening

Position of the load port door after closing

z238 10, 11, 12

0 ± 0.1 mm

Horizontal center line of load port door

Center of latch key, door pin, and frame pin

Figure 9 Load Port Door

x239=220.0±0.2x235=142.0±0.2

z233

=17

9.0±

0.25

z234

=18

1.0±

0.25

x238=272.0±0.2

z230

=17

8.0

x233=257.0±0.25x234=259.0±0.25

r233=21.0±0.25r23

4=23

.0±0.2

5

z231

=12

9.0

r238=27.5

x231=200.0

Frame Pin

Door Pin

Latch Key

Area for optional vacuum application feature on load port door.

-BP-

-HP-

-CL-




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d231=9.0±0.1

y232=11.0±0.1

x239=220±0.2

Spherical

z230=178.0

z238=0.0±0.1

Front of Load Port

Door

-HP-

-BP-

-CL-

Figure 10 Optional Door Pin

d238=6.0±0.1

z238=0.0±0.1

y240=10.0±0.1 z230=178.0

x238=272±0.2

Spherical

Front of Load Port

Frame

-HP-

-BP-

-CL-

Figure 11 Optional Frame Pin




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Figure 12 Latch Key

d237=8.0±0.2

y236=11.0±0.1

y237=4.55±0.1

x235=142±0.2

r241=1.5±0.2

r236=13.5±0.1

x236=8.0±0.1

r242=0.5±0.2

z238=0.0±0.1

z230=178.0

r243=0.3±0.2

90 1position whendoor is latchedto shell

0 1position whendoor is unlatched from shell

Front of Load Port

Door

-HP-

-BP-

-CL-




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9 Requirements for Interface between Load Port and Semiconductor Manufacturing Equipment

9.1 BOLTS Opening The interface on the semiconductor manufacturing equipment consists of an opening, a seal area surrounding the opening, six threaded holes for bolting-on the load port, reserved spaces for the load port inside the semiconductor manufacturing equipment behind the opening, and an exclusion volume for the load port outside of the opening. The dimensions of the opening (also referred to as BOLTS opening) are defined by x371, z371, and z376. See Figure 13 for details.

9.2 BOLTS Seal Area On the BOLTS interface surface surrounding the opening must be a flat area for sealing between the semiconductor manufacturing equipment and the load port. The inner dimensions of this BOLTS seal area are the same as the BOLTS opening, and the outer dimensions of the seal area are defined by x372, z372, and z377. The flatness of the seal area must be within y371, and the perpendicularity of the seal area to the bilateral and horizontal planes must be within

9.3 Threaded Holes At six points on the BOLTS interface surface, there must be threaded holes for bolting-on the load port. The opening of the threaded holes must be within the flatness of the seal area (y371), and must be at least y373 deep.

9.3.1 The threads must conform to the ISO/DIS 68-1 specification which has a nominal diameter of 8 mm, a thread pitch of 1.25 mm, a normal length of engagement from 4 to 12 mm, and no allowance (variation from basic diameter).

9.3.2 The centers of the threaded holes are to be located at x373 to the left and right of the bilateral plane, and centers of the top, middle, and bottom pairs of threaded holes are to be located at z378 above, z375 below, and z373 below the horizontal plane, respectively.

9.3.3 Not all of these threaded holes need to be used by every load port, but all six threaded holes must be present.

NOTE 13: The middle pair of threaded holes is in the seal area, and so it may be covered up by some gaskets (which are not specified here).

9.4 Permanent Reserved Volume The volume define by dimensions x370, y374, z380, and z381 inside the semiconductor manufacturing equipment is reserved for the load port into which the semiconductor manufacturing equipment may not protrude.

9.5 Wafer Transport Exclusion Volume The wafer handler may remove/insert wafers from/to a carrier through a window bounded by dimensions x375, z370, and z383 inside the permanent reserved volume when the load port door is open. When the load port door is closed this volume becomes part of the permanent reserved volume.

NOTE 14: It should be understood that the size of the opening on the load port towards the carrier is smaller than the wafer transport exclusion volume. See section 8 for dimensions x234 and z234 (inside edges of load port frame).

9.6 Inner and Outer Radii All required concave features may have a radius of up to r375 to allow cleaning and to prevent contaminant build-up. All required convex features may also have a radius of up to r376 to prevent small contact patches with large stresses that might cause wear and particles. Note that these limits on the radius of all required features are specified as a maximum (not a minimum) to ensure that the required features are not rounded-off too much. The lower bound on the radius is up to the supplier. Note also that this radius applies to every required feature unless another radius is called out specifically.

9.7 Repeatability of docked position The cycle-to-cycle repeatability of the docked position (when the carrier is ready for opening) of a load port shuttle as determined by the position of the kinematic coupling pins, must be within y375.

NOTE 15: While the undocked position itself is not specified, its cycle-to-cycle repeatability is defined by the requirement above. The cycle-to-cycle repeatability may be determined by (1) first measuring and recording the position of the load port shuttle with the KC pins when it is in the position where the carrier door can be opened, than moving the shuttle back to the undocked position and again to the position where the carrier door can be opened. Now the position of the load port shuttle with the KC pins should be measured and recorded again (2). The delta between values (1) and (2) should be within the limits defined in the section above.




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Table 3 Dimensions of Interface between Load Port and Semiconductor Manufacturing Equipment


σ 0 ± 0.1 Bilateral and horizontal plane

Perpendicularity of BOLTS seal area

r375 ≤1 mm Not applicable All required concave features (radius)

r376 ≤2 mm Not applicable All required convex features (radius)

x370 13 ≥284 mm Bilateral plane Encroachment of SME on the sides of the reserved volumes inside the SME

x371 13 285 ± 1 mm

Bilateral plane Edge of BOLTS opening and inside edge of BOLTS seal area

x372 13 ≥314 mm Bilateral plane Outside edge of BOLTS seal area

x373 13 295 ± 0.5 mm Bilateral plane Center of threaded holes

x374 13 ≥315 mm Bilateral plane Encroachment of SME on the sides of the load port outside of the BOLTS interface surface

x375 13 258.5 mm Bilateral plane Edge of wafer transport exclusion volume

y371 13 ± 1 mm flatness over seal area

BOLTS interface surface BOLTS seal area

y372 13 ≤28.9 mm BOLTS interface surface Encroachment of SME on the permanent reserved volume inside the SME

y373 13 ≥20 mm BOLTS interface surface Depth of threaded holes for fastener

y374 13 ≥80 mm BOLTS interface surface Encroachment of SME on the permanent reserved

y375 13 ± 0.5 mm Docked position of the load port shuttle

Docked position after a cycle was performed

z370 13 33 mm Horizontal plane Lower edge of wafer transport exclusion volume

z371 13 808 ± 1 mm

Horizontal plane Bottom edge of BOLTS opening and inside edge of BOLTS seal area

z372 13 ≥828 mm Horizontal plane Outside edge of BOLTS seal area on bottom

z373 13 845 ± 0.1 mm Horizontal plane Center of bottom threaded holes

z375 13 163.25 ± 0.1 mm Horizontal plane Center of middle threaded holes

z376 13 397 ± 1 mm Horizontal plane Top edge of BOLTS opening and inside edge of BOLTS seal area

z377 13 ≥417 mm Horizontal plane Outside edge of BOLTS seal area on top

z378 13 442.5 ± 0.1 mm Horizontal plane Center of top threaded holes

z379 13 ≥473 mm Horizontal plane Encroachment of SME on the top of the load port between the BOLTS interface surface and the load boundary

z380 13 ≥807 mm Horizontal plane Encroachment of SME on the bottom of the permanent reserved volume inside the SME

z381 13 ≥396 mm Horizontal plane Encroachment of SME on the top of the reserved volume inside the SME

z382 13 ≥880 mm Horizontal plane Lower edge of BOLTS interface surface




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z383 13 325 mm Horizontal plane Upper edge of wafer transport exclusion volume

z384 13 25 mm Minimum value of z379 Upper edge of alignment feature on SME

Figure 13 Interface between Load Port and Semiconductor Manufacturing Equipment

x370>284(inside of

equipment)

-FP-

-BP-

EQUIPMENTBOUNDARY

450 FOUPSHOWN IN THE

UNDOCKED POSITION

x375=258.5 WAFER TRANSPORTEXCLUSIONVOLUME

PERMANENTRESERVED

VOLUME

SECTION A-A

BOLTS INTERFACE SURFACE

x374>315

x372>314WAFER TRANSPORTEXCLUSIONVOLUME

ALIGNMENT FEATURESee Section 7.14

450FIMS

PLANE

x371=285±1.0(at seal area)

z373=845±0.1

z371=808±1.0(at seal area)

z375=163.25±0.1

z376=443±1.0(at seal area)

z378=490.5±0.1

x373=295±0.5

z372>828

z380>807(at inside

of equipment)

z382>880

z381>444(at inside

of equipment)

z377>465

ISO M8-6HTHREAD

y371=±1(FLATNESS)

=0±0.1(PERPENDICULARITY

to BP AND HP)

SECTION B-B

PERMANENTRESERVEDVOLUME

-HP-

EQUIPMENTBOUNDARY

-BP- -FP-

PERMANENTRESERVEDVOLUME

z383=373

z379>521

z384=25

WAFERTRANSPORTEXCLUSIONVOLUME

z370 = 33

y372<28.9See y100 Section 7

y373>20

y374>80

See y104 Section 7

-FP docked-

y375=±0.5(REPEATABILITY)

B

AA

B




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RELATED INFORMATION 1 APPLICATION NOTES NOTICE: This related information is not an official part of this standard and is not meant to modify or supersede it in any way. Rather, these notes are provided primarily as a source of information to aid in the application of the standard. As such, they are to be considered as reference material only. The standard should be referred to in all cases.

R1-1.1 The table below outlines areas in 300 mm that have been identified with potential for improvement in 450mm.

Table R1-1 Improved Approach in 450 mm

Identified Topic of 300mm with Potential for Improvement Improved Approach Chosen in 450 mm

Location of equipment boundary in 300mm is depending on actual physical features. Since these features may vary during equipment’s lifetime, the equipment boundary may vary as well. (E.g. replacing one brand of load port by another could result in a change of the actual position of the equipment boundary, even if the rest of the tool has not moved at all.

The 450 equipment boundary is now at a fixed position and constitutes a “boundary”, which shall not be exceeded by the equipment, but not depending on the presence of a physical feature. The physical feature is now called equipment front. Alignment of equipment to the AMHS now is with reference to a fixed feature, the BOLTS interface surface.

Clearances C1, C2, C3 are somewhat complex, since being conditional, following the carrier shape, and thus are hard to verify.

Replaced by simple rectangular x, y z clearance.

E15.1 is not using the standard x, y z dimension naming convention. Names like D1, C3 or S have been used.

Standard x, y, z dimensions have been introduced, clearly identifying the coordinate. Since some definitions in 450mm are different from 300mm, maintaining the old identifiers would rather be a source for confusion.

No direct dimension is defined for the position of the BOLTS plane compared to the other dimensions of E15.1.

A new dimension was introduced to clearly depict the distance between the BOLTS interface surface and other load port dimensions.

The term load face plane in 300mm may be misinterpreted to be an ideal plane, while in reality it is a physical feature. Its position is depending on actual load port designs and adjustments.

The term 450 load boundary was introduced. It is now at a fixed position and constitutes a “boundary”, which shall not be exceeded by the load port, but is no longer depending on the presence of a physical feature.

The term BOLTS plane was sometimes misunderstood as an ideal plane (like facial datum plane), while it is actually a physical feature with a tolerance associated.

The term BOLTS interface surface was introduced for 450mm instead.

Exclusion volumes for Carrier ID Reader/Writer Units are very complex. Different volumes have been defined for different technologies, docked vs. undocked and different carrier types. Thus both implementation and verification was very difficult.

A single placement volume is specified.

D1 in combination with C2 and known carrier max. dimension is representing an over-constraint.

C2 eliminated (but OHT chimney is of course maintained).

Correlation/interaction of some dimensions in E15.1, E62, and E63 was not always easy to understand. The term load port in E15.1 meant the AMHS interface only, why commonly the term load port is used to identify a complete unit, also including FIMS and BOLTS.

All three key load port interfaces (AMHS, carrier door, and equipment) have been combined into one document and being called load port.




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R1-1.2 It is the device makers’ expectation that semiconductor manufacturing equipment suppliers are ultimately responsible for ensuring that their equipment (as installed in the device makers’ facility) complies with this standard. This expectation is the same whether the load port is developed internally by the semiconductor manufacturing equipment supplier or is purchased from a third party source. In either case, the semiconductor manufacturing equipment supplier is responsible for understanding all of the requirements contained in this standard. Compliance with this standard can only be fully determined after the load port is integrated with the semiconductor manufacturing equipment and is directly affected by its design features (such as user interfaces and light towers).

R1-1.3 It is recommended that the systems that deliver carriers to tool load ports have a mechanism to correct for misalignment of tools and load ports.

R1-1.4 It is recommended that load ports features should maintain a certain vertical clearance and not fully extending up to the vertical boundary defined by dimension z160 in section “Clearance Above Load Port and Below Carrier” in order to reduce the risk of interference with the carrier bottom during delivery of a carrier potentially not being in its ideal position.

R1-1.5 Additional fine tuning of the alignment between the carrier delivery system and the load port may be achieved by adjusting the docking stroke (undocked position) of the load port, where available.

R1-1.6 Many dimensions in this document are defined with reference to the BOLTS interface surface, and not the facial plane (FP). This approach was chosen since the BOLTS interface surface is at a fixed position on the semiconductor manufacturing equipment and it is defined within a certain accuracy, unlike to the FP, which is adjustable and therefore would be hard to be used as a reference upon installation.

R1-1.7 The figure below is showing a graphical representation of the nominal load port height as defined by z101.

Floor

HP

Load Port

Figure R1-1 Graphical Representation of z101

R1-1.8 Spacing between load ports as defined by x100 will be revisited as designs mature with the goal to be driven lower.

R1-1.9 The volume available behind the rear of the FOUP up to the load boundary and extending from the horizontal plane up to z100 may not be sufficient to support physical safety shields. In the case where a device manufacturer chooses to specify a physical safety shield; it is possible part of the shield will be located beyond the load boundary into the aisle. The information in this document does support optical sensing methods utilized on typical OHV systems. The figure below is showing a graphical representation of the potential issue.




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Figure R1-2 Diagram of a Potential Safety Shield Implementation

Figure R1-3

Diagram of a Potential Load Port Exclusion Volume Implementation

FRONT VIEW

z16021

SIDE VIEW

FLOOR

-HP-

VERTICALCLEARANCE

FOR OVERHEADTRANSPORT

-BP--LB-

-BP--EB-

OPTION A

-FP-

x103307.5

z1002410

x144=355

x143=315

z1611484

LOADPORTSIDE

EXCLUSIONVOLUME

FOR USERDEFINEDOBJECTS

It is up to the end user and the OEM to decide what (if anything) to install in the load port exclusion volume. If the end user decides to implement an object in front of the LB this object will likely have a significant thickness and may increase the depth of the equipment. The object must be placed in front of the LB and the end user should consider the implications to the maintenance access to the load port.

Tool

LP

Shield, Cover

y1




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R1-2 Lockout Pins for FEOL and BEOL Load Ports

R1-2.1 Background ― Device manufacturers are planning to use process options for 450 mm wafers that pose significant risk of cross-contamination of wafers and SME. In such a case, load ports and carriers may be dedicated to front-end-of-line (FEOL) processing or back-end-of-line (BEOL) processing only. To eliminate the possibility of cross-contamination, device manufacturers want to ensure that FEOL carriers cannot be processed on SME with BEOL load ports and vice versa.

R1-2.1.1 In addition to traditional lockout methods (software, electronic, and visual approaches) to eliminate mis-processing, device manufacturers also want a “hard” mechanical lockout that makes it physically impossible for a carrier to register correctly on the kinematic coupling on a wrong load port. This section describes one possible procedure for achieving a hard mechanical interference lockout using pins located on FEOL and BEOL load ports. Corresponding pads on FEOL and BEOL carriers are also discussed.

R1-2.2 Lockout Pads 1 and 2 on Carriers ― FEOL carriers must have lockout pad 1 low and lockout pad 2 high. BEOL carriers must have lockout pad 2 low and lockout pad 1 high. Locations and dimensions for lockout pads 1 and 2 are defined in the 450mm FOUP standard.

HP

15.0

mm

d = 5.0 mm

z12

= 2

1 m

m

Bottom of Carrier

Upper Position

Lower Position Lock

out

Pad

on

Car

rier

Lockout Pin

Spherical

Figure R1-4

Detail of Lockout Pin 1 or 2 on the Load Port

R1-2.3 Mechanical Interference Lockout Pins — FEOL load ports must have a lockout pin 2 centered under lockout pad 2, and BEOL carriers load ports must have a lockout pin 1 centered under lockout pad 1. The dimensions for lockout pins 1 or 2 are shown in the figure above. When a carrier is placed on the wrong load port, the lockout pad and lockout pin will interfere with each other, preventing the carrier from being seated correctly on the kinematic coupling pins. As a result, the carrier placement sensor does not get triggered. Manual operator intervention may be required when this happens.

R1-2.4 Lockout Pin Installation in the Fab — Since it will be impossible for device manufacturers to specify in every case whether SME will be a FEOL equipment or an BEOL SME at the time of ordering (when placing a purchase order), it is their expectation that the production equipment is delivered to the fab with the lockout pins, but without the pins installed on any load port. During SME install in the cleanroom, device manufacturers will decide whether the SME is dedicated as an FEOL or BEOL SME. At that time, SME must be capable of having lockout




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pins 1 or 2 installed on the load ports in the fab. To meet this requirement, each load port must have pre-drilled holes at both 1 and 2 positions. The SME supplier must provide and install the lockout pins in the field. Table below summarizes the lockout requirements and corresponding sensor actions when different types of carriers are placed on different types of load ports.

R1-2.5 Operation — During normal operation, the pins and pads don’t interfere with each other as shown in the figures below. Normal operation is when a FEOL carrier is placed on a FEOL load port or when a BEOL carrier is placed on a BEOL load port, as shown below. Both the carrier placement sensor and the carrier presence sensor are triggered and wafer processing is allowed to continue.

R1-2.5.1 When a FEOL carrier is placed on a BEOL load port or vice versa, the pads and pins interfere with each other as shown in the figure below, and the carrier does not nest correctly on the kinematic coupling of the load port. Note that the extent of interference is highly exaggerated in the figure, and is so depicted only for clarity. When interference occurs, the carrier rests in a secure manner on the front two kinematic coupling pins and the mechanical interference pin. As a result, the carrier placement sensor is not triggered, although the carrier presence sensor detects the presence of the carrier. Wafer processing does not start, thereby eliminating any wafer and equipment cross-contamination opportunity. When such a condition occurs, a production operator may be required to correct the problem.

R1-2.5.2 Some device manufacturers may identify certain type of SME as not being sensitive to FEOL and BEOL contamination issues. In such a situation, the device manufacturer end user has the option to not install either FEOL or BEOL lockout pin. In this case, FEOL and BEOL carriers will work on these load ports without any interference.

Table R1-2 Operational Summary

Carrier Type

Load Port Type

Pad and Pin Interference Requirement

Carrier Placement Sensor State

Carrier Presence Sensor State

FEOL FEOL No interference. Sensor is triggered since carrier is nested correctly.

Sensor detects carrier presence.

FEOL BEOL Pad 1 and pin 2 interfere with each other.

Sensor is not triggered since carrier does not nest correctly.


BEOL BEOL No interference. Sensor is triggered since carrier is nested correctly.


BEOL FEOL Pad 2 and pin 1 interfere with each other.

Sensor is not triggered since carrier does not nest correctly.


FEOL load port BEOL load port

FEOL carrier BEOL carrier

Pin C

Infopad D

Pin D

Infopad C

Figure R1-5

Lockout pad and pin non-interference during normal operation.

Pin 2 Pad 1

Pin 1 Pad 2




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FEOL carrier BEOL carrier

FEOL load portBEOL load port

Infopad C

Pin C

Infopad D

Pin D

Figure R1-6

Lockout pad and pin interference when a carrier is placed on a wrong load port. Carrier does not nest correctly on kinematic coupling.

R1-3 Referenced Documents and Standards

R1-3.1 SEMI Auxiliary Documents

SEMI AUX012— 300 mm FOUP/Load Port Interoperability Report

NOTICE: SEMI makes no warranties or representations as to the suitability of the standard set forth herein for any particular application. The determination of the suitability of the standard is solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are subject to change without notice.

The user’s attention is called to the possibility that compliance with this standard may require use of copy-righted material or of an invention covered by patent rights. Brooks Automation, Inc. has filed a statement with SEMI asserting that licenses will be made available to applicants throughout the world for the purpose of implementing this standard without unfair discrimination. By publication of this standard, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights, are entirely their own responsibility.

Pad 1 Pin 1

Pad 2 Pin 2

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