Advanced Packaging MATERIALS CHALLENGES &...
Transcript of Advanced Packaging MATERIALS CHALLENGES &...
Advanced Packaging MATERIALS CHALLENGES & OPPORTUNITIES
Dr. ASHAY DANIDirector of MATERIALS Technology Development
ASSEMBLY TECHNOLOGY DEVELOPMENT, Intel Corporation
drivers• The World Is Becoming More And More Dependent On Data
• Transforming to a DATA-CENTRIC Infrastructure
• Move FASTER + Store MORE + Process EVERYTHING
• Advances In Systems Performance Require
• Small, Thin, Compact , High Bandwidth & Low Power architecture only available with
“Heterogeneous Integration” on Advanced Packaging
1. Scaling Packaging features to keep up with Moore’s law
2. Enable Heterogeneous integration to deliver higher functionality
with High Manufacturability, Quality & Reliability, optimal cost
Multi-Chip Packaging challenges
Improved Thermal Interface Materials (TIMs) and Interface
Control Needed for MCPs
Efficient ThermalsMCP Size Reduction
Improved materials for flow in tight spaces, tight KOZ, high reliability and
compatibility
SKL-Y20x16.5x0.91mm
…N
ext
g
en
Next gen
Room Temperature Reflow Temperature
Improved Solutions to maintain flat packages for Robust Manufacturing
Yields With High Reliability
Warpage occurs due to C.T.E.
Mismatch between Different Packaging
Materials
Material Handling &
Manufacturing
Die to substrate
Interconnect
Package to PCBInterconnect
Package Warpage
MATERIALS for HETEROGENEOUS PACKAGEMATERIALS Solution Space DRIVEN BY architecture, geometry and market segments
• Small & Thin Form Factor
• Interconnect annular space, KOZ
• Warpage control
• Enhanced Thermals
• Improved SMT
• Enable choice of packaging architectures
• High Manufacturability, quality & reliability
Drivers
• Focus areas: New Materials which Enable Scaling & Heterogeneous Packaging manufacturability & reliability
Materials
First Level Interconnect
Thermals
Ball Grid array
Second Level Interconnect
PACKAGE APPLicATION CHALLENGES MATERIALS SOLUTIONS• Improved Spray/Dip flux rheology, activity,
cleanability for fine pitch• Fine solder powder for tight solder paste print• NCF/NCP for manufacturability and reliability
• Solder paste jetting & Pin Dipping paste materials to meet scaling and KIZ/KOZ targets
• Solder paste powder size and loading critical to deliver rheology, activity and robust manufacturability & reliability
Warpage induced:
* Solder bump bridging (SBB)
* Non Contact Open (NCO)
* Non Wet Open (NWO)
• Low Temperature solders (LTS) BGA• Joint Reinforced Paste (JRP)/BLUF materials• Cu core solder ball controlled collapse• Improved SMT solder Paste for manufacturability
and reliability.
• Improved Solder Thermal Interface Materials• Improved STIM flux materials rheology, activity
for high manufacturability & reliability• Improved & compatible Polymer Thermal
Interface Materials for MCPDie1 Die2 Die3 Die4
Substrate
Z-Height
Variation
IHS
RTIM = (BLT0 + Z-height variat ion) / Keffect iveRTIM = BLT0 / Keffect ive
TIM
Key Challenge: Managing All The Attributes Involved in the Surface Mount Process to Achieve Acceptable Yields
Typical SLI Failure Modes
Leaded solderPeak Temp Range
Lead free solderPeak Temp Range
25C 150C 200C 260C
Pa
cka
ge
Wa
rpa
ge
Reflow Temperature
+
-Difficulties Compounded By Higher
Melting Temp Pb-Free Solders
Pa
cka
ge
Wa
rpa
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Silicon Thickness
Reducing Package Core Thickness
Package Warpage Worsens as Package Thickness is Reduced
Silicon
Package Core
Second Level Interconnect
Package Build Up
Solder Bridge Defect due to compression
Non-Contact/Non-Wet/Head-on-Pillow Defects due to
expansion
Universal Adoption of LTS can enable thin and light BGA designs
So
lde
r B
rid
ge
Ris
k
BGA Pitch
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Op
en
Ris
k
Platform Z-height (PCB+BGA)
255 C255 C
190 C190 C
LOW TEMPERATURE SOLDERS
•Heterogeneous On-Package Integration is a Critical Enabler for the “Age of Data”…Challenges remain to enable small, thin, high density MCP interconnects, 3D stacking, and high bandwidth
• New Materials Technology Innovations based on structure-property fundamentals are needed that would address small & thin MCP warpage, improved MCP Thermals, improved SMT, high manufacturability and improved reliability
–Creative risk taking is needed to accelerate assembly materials and equipment supplier collaborations to develop out-of-box materials and process innovations