10. EEE Parts and Materials Program for Jupiter Missions, Steve ...

National Aeronautics and Space AdministrationE u R O p A C L I p p E R !!!!

.! M I S S I O N! ! C O N C E P T! ! R E V I E W ! .!

Pre-‐Decisional Information — For Planning and Discussion Purposes Only

Radiation Effects in Components and SystemsBremen, GermanySeptember 19, 2016

© 2016 California Institute of Technology. Government sponsorship acknowledged

Reference herein to any specific commercial product, process, or service by trade name, trademark, manufacturer, or otherwise, does not constitute or imply its endorsement by the United States Government or the Jet Propulsion Laboratory, California Institute of Technology.

9/19/16 2

Overview

Mission ComparisonElectronic Parts ApproachEEE Parts Radiation Testing ResultsMaterials ApproachMaterials Radiation ProgramSummary


9/19/16 3

Mission Comparison

• Planned Mission Overview• Radiation Environment Summary• System Hardening Approach• Electronic Parts Approach• EEE Parts Radiation Testing Results• Materials Approach• Selected Materials Radiation Performance• Summary


Issue Europa Clipper Juno Galileo Comments

Total Ionizing Dose 300 KRads 50 KRads 150 krad In vault (Including

RDF)

Displacement Damage

5E11 eq. 1MeV

Neutrons

1E111MeV

Neutrons

1E111MeV

NeutronsIn vault (Including

RDF)

Acceptance Criteria

99% Probability 0.9Confidence

99% Probability

0.9Confidence

3 sigma

ElectronicsApproach

Mostly new Rad Hard design or upgrade

HeritageDesign with shielding

Mostly new Rad Hard design or upgrade

9/19/16 Pre-‐Decisional Information — For Planning and Discussion Purposes Only 4

Clipper Design ApproachMost electronics inside Vault (150krad))Subsystems and Instruments Majority new – design to 300 kradHeritage modified to 300 kradSome heritage shielded to 100 krad or below

Design for environment – minimize shielding

Maximize use radiation hardened EEE parts

Preferred Parts Selection List (PPSL) Vendor guarantied and approved to 300 krad

Characterized and functional/design-worthy to 300 krad or more

Development of Rad Hard parts is avoided

Worst Case Data Sheets

Common Buy for PPSL Parts

Coordinated Characterization and Lot Test ActivitiesTest methods addressing environment

EEE Parts Radiation Hardness Assurance Strategy

5Pre-‐Decisional Information — For Planning and Discussion Purposes Only9/19/16

EEE Parts Plan RequirementsRadiation Requirements – Refer to JPL DocID D-80297

6

Application Analysis determined by Single Event Effects Analysis (SEEA)

Pre-‐Decisional Information — For Planning and Discussion Purposes Only9/19/16

Effect Requirement

TID, ELDRS

Refer to Environmental Requirements Document (ERD) for shielded environment. Parametric acceptance @ 90% confidence w/ 99% probability of success at part level or greater post irradiation specification limits

Displacement Damage

Refer to ERD for shielded environment. Parametric acceptance @ 90% confidence w/ 99% probability of success at part level or greater post irradiation specification limits

SEL Linear Energy Transfer (LET)th >75 MeV-cm²/mg

SEGR/SEB LETth >37 MeV-cm²/mg @ fully-off voltages or by application analysis

SEU LETth >75 MeV-cm²/mg or <10-10 per bit per day or by application analysis

SEFI LETth >75 MeV-cm²/mg or <10-3 events/yr or by application analysis

SET LETth >75 MeV-cm²/mg or by application analysis

Radiation Lot Acceptance Testing (Dose and Displacement)Parametric acceptance 99% probability / 0.90 confidence level (99/90)Sample size is 5 per wafer lot per test conditionMinimum for characterization or investigation is case-by-case

Effects of displacement damage and dose are additiveSlow BJTs, Photonics, and low-doped devices may require lot testTesting for DDD and TID will be done on the same lot

Reliability Engineering concurrence on acceptance criteria

Test readiness reviews (TRR)

Use of annealing for CMOS - Dose rate ≥ 100 mrad(Si)/s

Radiation Lot Acceptance Testing (RLAT)


Enhanced Low Dose Rate Sensitivity (ELDRS)Recommend both high and low dose rate irradiation

Both biased and unbiased condition tested if worst case is unknown

MIL-STD-883, Method 1019 Condition B, C, or D as needed

Low dose rate

10 mrad/s to 100 krad

≤ 45 mrad/s to 300 krad

Displacement Damage (DD)5E11 (1MeV eq. Neutrons, 2X) inside vault

Dominated by electrons

Parts for test will be determined case by case

Electron-proton equivalency tests have been performed

Radiation Requirements (Dose and Displacement Damage)


Preferred Parts Selection List (PPSL)

PPSLSelected from commonly used devices

Characterization complete

Verified 300 krad requirement

May require RLAT of flight lot

Active devices only

Candidate List (PPCL)Likely capable of meeting radiation requirement

Require characterization

ELDRS required in many cases

Presently > 375 devices on each list9Pre-‐Decisional Information — For Planning and Discussion Purposes Only9/19/16

PPSL

Candidate List


Radiation Effects Evaluations – EEE Parts

Volatile Memory

Non-Volatile Memory

Power Subsystem devices

Avionics devices

Optocouplers

ELDRS Testing

Field Programmable Gate Arrays


Volatile Memory - Significant FindingsSDRAM

All tested devices limited to 100 krad or less“100 krad guaranteed” can be < 100 kradWorst case condition - refresh on

DDR2Existing data validate capability to 200 to 300 kradRLAT required

DDR3Test results support TID capability to 200 to 300 RLAT required

All devices are prone to SEFI/SEU events and require mitigation, though none latch (no SEL)


Volatile Memory Radiation Test StatusPart# Supplier Size

(GB) Width TID (krad) Comments

DDR3

MT41J128M8JP Micron 1 x8 >200 Functional >300 krad with stuck bits

K4B1G0446G Samsung 1 x4 >250 Functional >300 krad with stuck bits

DDR2

IMXS108D2DEBG Intelligent Memory TBD x8 TBD

IS43DR81280 3DPlus-ISSI 1 x8 >200 RLAT to > 300 krad Planned

SDRAM

IS42S86400B ISSI 0.5 x8 80 100 with stuck bits, refresh ”on” is worst case

EDS5104ABTA3DPlus-ISSI 0.5 x4 50 Used on Juno

UT8SDMQ64M48 Aeroflex 3 x48 100 Actual performance in refresh mode may be less

SDRAM limited to < 100 krad – DDR2/3 ~ 300 krad

Non-Volatile MemorySpacecraft requires > 1 Tb memory storageDriven by science data requirements

Need to hold data until opportunity to transmit

No radiation hardened devices large enough

Commercial devices were evaluated

A single device was found suitable Samsung 8Gb SLC Version M NAND flash > 500 flight devices in X8 modules


Significant system level mitigation required –Error Detection/Correction, Voting, Erase and Rewrite


Non-Volatile Memory

Device TID/DD(krad) Comments

Micron 4Gb <100 Not recommended for Europa3/8 DUT non-functional after 100krad

Micron 32Gb 55 Not recommended for Europa3/5 DUTs fail to erase

Micron 32Gb eNAND 10 Not recommended for EuropaNon functional at 50 krad

Samsung 8Gb Rev A >200

1% BER at 40kradErase still possible after 600krad Not an ECM candidate due to SEE

Samsung 8Gb Rev M >200

5E-5 BER @ 50krad, 10% BER at 200krad, write-able. Tested to 300 krad with Erase/Rewrite in 25 krad steps

Samsung 8Gb Rev D >200 Functional test only

Samsung 8Gb Rev E <100 Not recommended for Europa

Unrecoverable page errors at 100krad

Samsung V-NAND128 Gb

~ 20 krad(~200 krads array) Control circuitry – limiting factor

Optocoupler Displacement Damage Tests


Several acceptable to Europa Displacement Damage Levels

Device Equivalent Neutron(1 MeV) Fluence Current Transfer Ratio

Isolink OLH249 <5E11 CTR<20%

Isocom IS49 >2E12 CTR ~60%

Isocom CSM141A >2E12 CTR ~70%

Isolink OLS049 <5E11 CTR<20%

Avago HCPL-5700 >2E12 CTR ~80%

Micropac 66179 <2E12 CTR<40%

Micropac 66296 <2E12 CTR~60%

Micropac 66294 >2E12 CTR ~75%

Power System Radiation Test

162/25/15

Part# Supplier Function TID (krad) SEE Comments

MSK5063RH MSK Buck Regulator 300 Destructive SEE at Vin > 40V @ 0.100 rad(Si)/s

MSK5055RH MSK Buck Regulator 300 No SEFI @ 0.100 rad(Si)/s

MSK196RH MSK Current Sense Amplifier In work Not Planned Alternate parts

being reviewed

MSK6000RH MSKCurrent limiting switch: Dual High Side Driver

300 Not Planned @ 0.100 rad(Si)/s

MSK5800RH MSK Linear Regulator In planning Not Planned Alternate parts being reviewed

DAC121S101QM Texas Instr.

12-‐bit DAC Converter 300 Pending Review @ 0.100 rad(Si)/s

LTC2977 LTC PMBus Controller <20 krad(Si)


Selected RH power devices can meet 300 krad

Avionics Device Testing

Part Desc Manufacturer TID (krad)

SELth Comments

Isolator IL611 Isolator NVE 300 >75

Isolator IL715T Isolator NVE 300 >75

AD9283S A/D ADI N/A Destruct

Si8642EA Isolator SilLab N/A Destruct

SI8600AB Isolator SilLab N/A Destruct

UT8ER512K32 SRAM Aeroflex 300 > 100 Tested at 0.1 R/s

UT8R4M39 SRAM Aeroflex 300 > 110 Tested at 0.1 R/s

UT200 Spacewire Aeroflex >400 > 109 Tested at 0.1 R/s

1709/19/16


SRAM/Spacewire were 100 krad Vendor rated -‐Functional to 300 krad when tested at 0.1 R/s -‐ Annealing


FPGA Radiation Tests and Evaluation

Device Manufacturer TID/DD(krad)

SEL(MeV-cm²/mg) Comments

Virtex V4QV Xilinx >300 > 75 Considered obsolete

Virtex V5 Xilinx >500 >75 Non-SEE hardened

Virtex V5QV Xilinx >1000 > 75 Preferred part

7-series Xilinx >1000 < 20 (some versions)

Not recommended for Europa

RTAX 250/1000/2000/4000

Microsemi 200 to 300 > 117Preferred partStatic current increases, rise/file time degrades at 300 krad.

AeroflexUT6325

Cobham/ Aeroflex 300 > 120 Preferred part

MicrosemiRTG4 Microsemi 150 >110 Device will be rated to 100

krad

V5QV, RTAX, UT6325 found acceptable However V5 power consumption and RTAX TID are still issues


ELDRS Test Method

Standard Method – 10 mrad/s1 Year to 300 krad

Take advantage of mission dose profile

Most received during flyby

90% of dose in < 90 days

Developed “accelerated” method

Validated test method

0.0E+00

5.0E+05

1.0E+06

1.5E+06

2.0E+06

2.5E+06

3.0E+06

0.0E+00

3.0E+02

6.0E+02

9.0E+02

1.2E+03

1.5E+03

300 400 500 600 700 800

Rad(Si)

Days

EHM 11-‐F5A Trajectory Dose Profile

TStep Dose

Cumulative Dose1 2

0.00

0.10

0.20

0.30

0.40

0.50

0.60

-24 -18 -12 -6 0 6 12 18 24

Dose rate (rads/s)

Hours from Perijove

P26 100 milsP26 200 milsP26 500 mils


ELDRS Test MethodTest Verification

9 parts from 3 Vendors RH bipolar

Comparative Tests:10 mrad/s80 mrad/s25 rad/sFlight Like pulsed rate

FindingsConstant dose rate method adequately bounded performanceMost RH bipolar parts were acceptable

ELDRS Test Method – Parts Tested


Accelerated ELDRS test developed – Test Duration ~90 days

Part Description Manuf. Functionalfail

Fail specs

TID (krad) Capability comments

LM124 Operational Amplifier TI No Yes 300

LM2941 Linear Regulator TI No Yes 300

LM136 2.5 Voltage reference

TI No Yes 300

LM139 Comparator TI No Yes 300

REF05 5V voltagereference AD No Yes 300

PM139 Comparator AD No Yes 300

RH117 Linear regulator LT Yes Yes <125 Severely degraded

below 100 krad

RH1014 Operational amplifier LT No Yes 300

RH1009 2.5V Reference LT No Yes 300

Worst – Case Data Sheets


Basis of device selectionMust be used for all Worst-‐Case analyses

Initial tolerance, temperature variation, aging based on manufacturer’s specRadiation variation based on characterization tests Updated based on flight lot test results

Materials ApproachIssues includeDegradation of mechanical propertiesDegradation of dielectric strengthSpace charging effects and discharge

JPL Materials Engineer approval required

Significant radiation effects test effort initiated to evaluate common spacecraft materials

Project use of Approved Materials ListIncludes radiation capability


Dose to surface materials ~ Giga Rads

24

Preferred M&P ListsMaterial Usage Lists Preferred M&P List

Results of Materials Testing Reference data for M&P evaluation including Radiation ResistanceRepresents “preferred” M&P but does not imply that all materials and processes listed therein are appropriate for any application M&P selections outside of the PMPSL must provide rationale for usage

Material Usage ListsM&P selections are documented and submitted for approval

8/6–7/2015

PMPSL provides list of preferred materials and processesApproval authority of Material Usage Lists provides final M&P selection control


Materials Testing

The technical data in this document is controlled under the U.S. Export Regulations; release to foreign persons may require an export authorization. 25

Radiation Testing of Spacecraft materials Total Ionizing Dose (TID)

Mainly polymeric materials, composites, adhesives, lubricants, insulations, etc.Structural applications, material allowablesInclude thermal environment

Displacement Damage Dose (TID/DDD)Glasses, thermal control materials

Electrostatic Discharge (ESD)Wire insulation, connectors, coatings

Example of on-‐going Materials testingCommon Adhesives Electrical Connectors Wire/cable Circuit card materialThermal Control CoatingsMulti-‐layer InsulationGlasses / OpticsComposite materialsLubricants

9/27/16Materials testing being conducted to reduce risk associated with extreme radiation


Materials - Elastomers

Based on Europa Clipper Approved Material List

Elastomers

Material Radiation Dosage Limit (rad) in Air

Radiation Dosage Limit (rad) in Vacuum

Viton 1.0 x 105 1.0 x 106

Buna N, Nitrile 1.0 x 106 1.0 x 107

Neoprene 1.0 x 106 1.0 x 107

Butyl 1.0 x 105 1.0 x 106

Silicone 1.0 x 107 1.0 x 108

Kalrez 1045, Chemraz 1.0 x 106 10 x 106

EPDM 1 x 107 1 x 108

EPR 1 x 107 1 x 108


Materials - Plastics

Based on Europa Clipper Approved Material List

Plastics

Material Radiation Dosage Limit (rad) in Air

Radiation Dosage Limit (rad) in Vacuum

PTFE 1.5 x 104 5 x 105

FEP Teflon 2.4 x 105 1 x 106

PFA Teflon 5.0 x 106 10 x 106

MFA Teflon 1.5 x 104 5 x 105

Zymaxx (PFA + graphite fibers) 5.0 x 106 20 x 106

Glass Filled PTFE 1.5 x 104 5 x 105

Steel Filled PTFE 1.5 x 104 5 x 105

Carbon Filled PTFE 1.5 x 104 5 x 105

PEEK 450G >1000 Mrad >1000 MradKynar 1.0 x 108 1.0 x 109

PCTFE (Kel-F 81) 1.0 x 106 10 x 106

Torlon 1.0 x 109 > 109

Vespel 1.0 x 109 5 x 1010

Summary


Radiation challenge for Europa is significantSystem level approach to surviving radiationSEE mitigation in device selection and system design Mission design limits total dose to 3 Mrad @ 100mil Al Shielding vault for a majority of electronic systemsSubsystem and local shield as requiredCharacterization of parts and materialsUse of approved parts and materials listsSelection of parts and materials for radiation tolerance

Mission design Shielding RH Parts &

Materials

Tolerant circuit design

National Aeronautics and Space AdministrationE u R O p A C L I p p E R !!!!

.! M I S S I O N! ! C O N C E P T! ! R E V I E W ! .!


Thank You

Backup

30Pre-‐Decisional Information — For Planning and Discussion Purposes Only

Materials & Process Control

This document has been reviewed and determined not to contain export controlled technical data.318/6–7/2015

Process requirementsMaterial property requirements,

material traceability, etc.

EMB

JPL M&P

JPL modules

GSE

Instruments

APL M&P

APL modules

Europa M&P hierarchyEstablished responsibilities

and reporting

Material requirementsThermal vacuum stability, planetary protection, corrosion, shelf-life, radiation resistance, electrical discharge characteristics, etc.

M&P approvalMaterial lists requirements

Project M&P Control Plan establishes M&P Selection Criteria and ControlDefines the Materials and Processes (M&P) control program to ensure proper selection and utilization of materials and processes to

meet the Europa Project functional, reliability, mission environment, and safety requirements

M&P Requirements Defined All flight materials and process (excluding EEE parts) must comply with

the requirements in the Project M&P Control Plan

M&P selection methodology Preferred Materials and Processes

32

Driving M&P Requirements• Radiation Environment

– Europa’s orbit resides in a torus of trapped charged particles around Jupiter– Total Ionizing Dose for materials external to the vehicle or with little shielding may see doses on the order of greater than 10^10 rad(Si)

– Space charging effects for dielectric materials cannot be ignored• Build-up of static charge can result in unwanted discharges that can damage materials or near-by circuits

– Material radiation testing being conducted to screen common spacecraft material applications

8/6–7/2015

From “Guide to Mitigating Spacecraft Charging Effects”Hank Garrett and Albert Whittlesey

Example in Arcylic:Lichtenberg pattern created by the discharge path

This document has been reviewed and determined not to contain export controlled technical data.

9/19/16 33

General Radiation Hardening Process Flow for Spacecraft

Radiation Hardening of Spacecraft for High RadiationEnvironments is an Iterative Process


Europa Mission Radiation Environment – TID

• The total ionizing dose (TID) is a measure of the energy deposited by energetic electrons and protons in materials

• TID depends on the outside environment, shielding material, and target material

• The moon encounters are the times with the highest dose rate

• The spacecraft holds a heavily shielded box called “vault” (~400 mil thick Al) that contains most sensitive electronics

• The dose inside the “vault” is reduced to 150 krad compared to the 3 Mrad mission dose cap (behind 100 mil of Al)

Transition between Europa anti-Jupiter and sub-Jupiter hemisphere coverage

The small steps correspond to perijovepasses (close encounters with the moon)

Pre-‐Decisional Information — For Planning and Discussion Purposes Only9/19/16

10. EEE Parts and Materials Program for Jupiter Missions, Steve ...

Documents

Transcript of 10. EEE Parts and Materials Program for Jupiter Missions, Steve ...