1

Assessment of the potential value return from research

topicsFollow-up actions

ITRS Maastricht

04/07/06

2

Follow-up process• Start working now on the subject of “equivalent scaling

parameters”– Topic to be included in the TWG meetings

• Conference call early June – Joint conf call with IRC / some TWG chairs

• Summer meeting– Half-day workshop IRC / selected TWG chairs

• Contact with other consortia– MEMS Industry group (A.Allan)– iNEMI (A.Allan, JA.Carballo)– IEEE (P.Gargini)

3

To be discussed in the TWG meetings

• Former approach– Economic value through dimensional scaling

• Questions to you– What will pure continuous scaling bring ? – Which non-scaling parameters can you play on that will

bring equivalent scaling value ?• Meeting system performance in another way • or bringing additional functionalities

– How to characterize / evaluate them vs. scaling approach ?

– Are there trade-offs involved between parameters (e.g., frequency vs. # of processors) ?

4

Possible TWG involvement preparation/proposals for July ITRS

• Assy & Packaging – System integration white paper– Passive integration

• Design– Extension of roadmap / system drivers (example

Automotive HV power, Sensors) – System on Chip / network on Chip

• PIDS / Design– extending MASTAR to system level

• Interconnect– Optical– Passive integration

• RF Wireless – Passive integration

• …

5

Format proposalTWG Functionality Technical

Parameter 1… Value Indicator

= f(TP1, …TPn)

AMS / RF Multi-standard adaptability

# of standards Broader application scope

AMS / RF Passive integration

Inductor Q Lower system cost

Design

PIDS

Image sensors Quantum efficiency

Image quality

Don’t feel restricted by that format ! Thinking out of the box is welcome !