2013 Symposium on Design, Test, Integration and Packaging ...toc.proceedings.com/18729webtoc.pdf ·...

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IEEE Catalog Number: ISBN:

CFP13DTI-POD 978-1-4673-4477-7

2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2013)

Barcelona, Spain 16 – 18 April 2013