Tezzaron Semiconductor 11/15/2013 1 A Perspective on Manufacturing 2.5/3D Bob Patti, CTO [email protected].
Tezzaron Semiconductor 04/08/2013 1 Implementing 2.5D and 3D Devices Bob Patti, CTO [email protected].
KGD Probing of TSVs at 40 um Array Pitch 3D-TSV Probe Technology Goals MEMS probe tip evolution Contact performance TSV pad damage (or lack thereof) Conclusions.
ECE Senior Project CMOS Camera System-on-a-Chip TEAM MEMBERS Anil Kumar Angana Sheth Saurabh Desai George Moran Jason Moffa Takashi Ishihara.
1 July 2, [email protected] The ASDBLR and DTMROC Detector Mounted Readout for the ATLAS TRT Mitch Newcomer for the ATLAS TRT Electronics Group.
