Dr Piotr Grabiec, prof. ITE Dept. of Silicon Microsystem and Nanostructure Technol. Instytut Technologii Elektronowej (ITE) Warsaw, Poland ITE is a major.
ITRS Design ITWG 2006 1 ITRS Design + System Drivers Hsinchu, December 2006 Design ITWG Japan: Hiwatashi-san, Asada-san Taiwan: Chung-Ping Chen Europe:
1 Winter Public Conference ORTC 2010 Update A. Allan, Rev 2, 12/02/10.
July 12, 2012ITRS public conference – San Francisco1 More-than-Moore Roadmapping Update.
Seoul Korea December 9, 2008 Assembly and Packaging 2008 International Technology Roadmap for Semiconductors.
ITRS Winter Conference 2006 The Ambassador Hotel Hsin Chu Taiwan 1 International Technology Roadmap for Semiconductors Assembly and Packaging 2006.
ITRS may in the future provide Research Guidance by defining better Innovation Questions for R&D ITRS Maastricht 04/07/06.
A Case for Wireless 3D NoCs for CMPs Hiroki Matsutani (1), Paul Bogdan (2), Radu Marculescu (2), Yasuhiro Take (1), Daisuke Sasaki (1), Hao Zhang (1),
Page 1 Laminate Based System in Package (SiP) Utilizing High Density Interconnect (HDI) Substrates in High Reliability Applications Ron Nowak Senior Manager,
Placitus
AN OVERVIEW OF ADVANCED ELECTRONIC PACKAGING TECHNOLOGY.pdf
1 Objective 3.2 Smart Components and Systems Integration Georg Kelm, DG INFSO, Nanoelectronics InfoDay, Brussels, 11 October 2010 FP7 ICT Work Programme.
