1 Objective 3.2 Smart Components and Systems Integration Georg Kelm, DG INFSO, Nanoelectronics...
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••• 1 Objective 3.2 Smart Components and Systems Integration Georg Kelm, DG INFSO, Nanoelectronics InfoDay, Brussels, 11 October 2010 FP7 ICT Work Programme 2011-2012
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Transcript of 1 Objective 3.2 Smart Components and Systems Integration Georg Kelm, DG INFSO, Nanoelectronics...
••• 1
Objective 3.2
Smart Components and Systems Integration
Georg Kelm, DG INFSO, Nanoelectronics
InfoDay, Brussels, 11 October 2010
FP7 ICT Work Programme 2011-2012
••• 2
Smart Components - their Applications
Systems2008
~1430B$2009
~1380B$
Devices2008
~275B$2009
~250B$
Equipment2008
~31B$2009
~17B$
Material
~20B$
2010~1440B$
2010~280B$
2010~26B$
Global electronic market supply chain revenue
Source: Gartner, Ic Insights (2008-2009)Automotive
Industrial and Medical
Military, Civil Aerospace, Security
Consumer
Communications
Data Processing
••• 3
IntroductionEuropean vision of the More Moore
and More than Moore domains
More than Moore: Diversification
Mo
ore
’s L
aw:
Min
iatu
riza
tio
n
Bas
elin
e C
MO
S:
CP
U, M
emo
ry, L
og
ic
130nm
90nm
65nm
45nm
32nm
22nm
Beyond CMOS
Analog/RF Passives HV PowerSensors
ActuatorsBiochips
InformationProcessing
Digital content System-on-Chip
(SoC)
Interacting with people and environmentNon-digital content SoC & System-in-
Package (SiP)
Combining SoC and SiP: Higher Value Systems
To reach and support the SoC/SiP trend, Beyond CMOS technologies need to meet
the criteria of integratability and sistemability
••• 4
ICT Work Programme 2011-12 Nanoelectronics
Objective 3.1: Very Advanced Nanoelectronics
Components
• Beyond CMOS technology• Circuit-technology solutions • Nano-manufacturing and
Joint Equipment Assessment
• Coordination and Support Actions
Call 8
60M€
Objective 3.2: Smart components and smart systems integration
• Smart components • Smart (miniaturized)
systems • Micro-Nano Bio Systems
(MNBS)• Coordination and Support
Actions
Call 7 (MNBS – call 8 (39M€))
41M€
••• 5
Obj. 3.2: Smart Components and Systems
Converging trends– Components increase in performance and
functionality– Systems increase in integration and miniaturisation
Smartness requires– Multifunctionality,– System level thinking
– Interdisciplinarity– Heterogeneous Integration
••• 6
Smart Integration (1)
• Smart components derived from advanced core nanoelectronics technologies to achieve new levels of extreme performance and functionality
• Smart systems integrate heterogeneous devices and functionalities (sensing, actuating, processing, energy scavenging, communication) by applying inter-disciplinary knowledge
Together, they provide ‘smart’ hardware platforms, an essential element of future generations of
products, infrastructures and services
••• 7
Smart Integration (2)
Using/Developing • Wide material combinations and different
substrates (as Si, SiC, III-V)• New architectures, devices, processes and
packaging technologies• Modelling and design tools• Fabless and flexible/modular mfg approaches• Yield, reliability, test, validation methods
••• 8
Future Smart Components and Smart Systems:
Smart components (SoC, SiP) with high performance (analogue, high frequency, integrated passives); high voltage/power, special conditions (high temperature, high reliability, long lifetime)
Miniaturized and integrated smart systems, including nanoscale sensing systems
Autonomously operating, power efficient and networked smart systems
Robust systems, adaptive to environment and lifetime requirements.
Smart Components & Smart Systems Integration
Call 7 38M€ STREPs, IPs
••• 9
Coordination and Support Actions: Coordination of EU and national programmes Cooperation of the value-chain actors, from research to
industrialisation Industrial take-up actionsRoadmaps linking applications and technologies International cooperation
Smart Components & Smart Systems Integration
Call 7 3M€ CSA
••• 10
Objective 3.2: Smart Components & Smart Systems Integration
Expected Impact:
1. Improve business relations between relevant actors in the supply chain, including interactions with R&D organisations and users.
2. Strengthen the competitiveness position of European smart components and systems industry; increase its knowledge base
3. Gain market share in high-end electronics application market
4. Contribute to smart solutions for environment protection
••• 11
Example: ATHENIS (FP7 ICT, call 1, STREP)Automotive Tested High-voltage Embedded Non-volatile memory Integrated SoC
The opportunity ! Low cost heterogeneous integration
••• 12
ATHENIS Automotive Tested High-voltage Embedded Non-volatile memory Integrated SoC
OBJECTIVES
• Develop a low cost platform integrating HVCMOS & Nanomech
eNVM to satisfy the following automotive requirements:
» High temperatures (≥ 200C) » High ESD levels (≥ 8kV) » High voltages (5V to ≥120V) » full reverse polarity capability up to 120V » High currents (≥10A)
» ≥ 20 years operating lifetime
• Verify and test for an alternator-like demonstrator (lower production
cost for alternators by including Nanomech eNVM)
••• 13
ATHENIS Automotive Tested High-voltage Embedded Non-volatile memory Integrated SoC
ATHENIS Results at the end of the 2nd year :
• HVCMOS devices that withstand high temperatures and ESD levels.
• eNVM technology, demonstrating a promising behaviour, both in terms of data
retention and dynamic R/W performances against operating temperature.
• predictive TCAD for the HV-CMOS modules, thus providing the background for
the development of a robust automotive technology.
• A first physical automotive system prototype, where the basic rough
functionalities were provided, has been presented.
http://www.athenis-fp7.eu/
••• 14
Thank you
European research on the web:http://cordis.europa.euhttp://ec.europa.eu/comm/research/future/
Information Society and Media:http://ec.europa.eu/information_society/http://cordis.europa.eu/ist/http://cordis.europa.eu/ist/directorate ghttp://cordis.europa.eu/ist/nano/
Contact:[email protected]
European research on the web:http://cordis.europa.euhttp://ec.europa.eu/comm/research/future/
Information Society and Media:http://ec.europa.eu/information_society/http://cordis.europa.eu/ist/http://cordis.europa.eu/ist/directorate ghttp://cordis.europa.eu/ist/nano/
Contact:[email protected]
ATHENIS on the web:
http://www.athenis-fp7.eu/
ATHENIS on the web:
http://www.athenis-fp7.eu/
••• 15
Objective 3.2: Smart Components & Smart Systems Integration
Relevant Initiatives• EPoSS
European Platform on Smart Systems Integrationhttp://www.smart-systems-integration.org/
• ENIACJoint Technology Initiative on Nanoelectronicshttp://www.eniac.eu/
••• 16
Objective 3.2: Smart Components
& Smart Systems Integration
Contacts
Smart Components: Georg Kelm - [email protected]
Smart Systems Integration:
Javier Bonal –[email protected]
••• 17
Objective 3.2: Smart Components & Smart Systems Integration
Funding call 7 (28/9/2010 – 18/01/2011)
Future Smart Components and Smart Systems38 M€ - IPs & STREPs
Coordination and Support Actions3 M€ - CSAs
Funding call 8 (7/2011 - )Micro-Nano Bio Systems (MNBS)
39 M€ - IPs & STREPs
••• 18
Objective 3.2
The new objective“Smart Components and Systems
Integration”
– removes the formal separation between smart components and systems
– energy efficiency, system design-technology interactions, 3D, novel architectures
