Chamonix 2010: January 27 th Session 6 – Radiation To Electronics: R2E Summary Radiation 2 Electronics Session 6 - 27 th January 2010 Radiations to Electronics.
1 Patrick Breugnon, Richun Fei, Denis Fougeron, Maurice Garcia-Sciveres (*), Fabrice Gensolen, Mohsine Menouni, Laurent Perrot, Alexandre Rozanov CPPM.
May 2007Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres1 Pixel Electronics slides for UCSC Cover 0.13 FE chip ROD Other Activities (except.
SEU tolerant cells developed for the FEI4 chip Patrick Breugnon, Denis Fougeron, Mohsine Menouni, Alexandre Rozanov CPPM-CNRS-Université de la mediterranée-Marseille.
Report from WP 11: Collimator Materials for Fast High Density Energy Deposition (ColMat-HDED) Jens Stadlmann (GSI) on behalf of Adriana Rossi (CERN) and.
Tests on a Fully Assembled TCT Collimator in the HiRadMat Facility
ECAL LED monitoring system upgrade Pavel Shatalov ITEP, Moscow, Russia Yuri Guz IHEP Protvino, Russia.
1 LAr high speed optical link studies: the status report on the LOC ASIC 1.The LOC ASIC, an introduction 2.The SOS technology 3.LOC1 test results 4.LOC2.
Current Status
SMU Activities Jingbo Ye May 9, 2005, CERN, for Opto-Electronics Readout Systems for SLHC.
Larg. Week, April 2002, Electronics Meeting1 Progress Report On Electronics Activities in Paris Bertrand Laforge LPNHE Paris CNRS/IN2P3 – Universités Paris.
CALIBRATION BOARDS FOR THE LAr CALORIMETERS
