Report - EXTRA Final Report2 Contents 1. Introduction 3 2. Work package 1: Fabrication of SOI devices with top and back gates 7 2.1 Fabrication and characterisation of ultra thin SOI MOSFETs

Select PornographicDefamatoryIllegal/UnlawfulSpamOther Terms Of Service ViolationFile a copyright complaint

Please pass captcha verification before submit form