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AutoFeeder:
800-535-5538
www.autosplice.comREELed SOLUTIONS FOR
AUTOMATING INTERCONNECTS
Innovative New SMT PinsProvide Automated Surface Mount Pin Assembly
Trea
dHead
&MiniFoot
SMTPins
Autosplice s M iniFoot and Tread Head
SMT pins provide an ultra-small footprint,
rigid solder joint and repea tab le pin
to pad alignment, facilitating
autom at ion. Tread Head SMT p ins
have a n unique tread p attern on the
bottom surfac e of the p in head,
which promo tes out-ga ssing d uring
reflow, creating a vacuum under the
hea d p ulling the p in tightly into
prop er alignme nt with the PCB pa d.
The MiniFoo t p in de sign uses a "bow -
tie" shap e foo t tha t p rovide s a stab le
founda tion, while p romo ting solder
wicking for an optimal solder fillet
co ncentrated a round the ba se of the
pin. The result is consistent pin-to-pad
alignment and superior solder joint
pull-streng th. The SMT p ins a re
pa ckage d and reeled for automa tic
plac eme nt on stand ard SMT platforms
using Auto splice s Auto Feede r.
New SMT Pin Design provides an ultra-small footprint, stable solder joint and
co nsistent alignmen t.
MiniFoot
Data Pin:SMT Pin Features:q High conductivity
copper constructionq Small, stable foot
q Various leng ths andfeatures
q Available in differentplating options
q Compa tible withAutosplices AutoFee der
q Packaged for automation
AutoFee de r Features:q Automated plac ement
of MiniFoot andTreadHead pins
q Automatic selfre-plenishment
q Flexible for variousdiameters and pin lengths
q Refresh rates lessthan 250ms
q Compa tible with allleading pick-and-plac eequipment
TreadHead
Power Pin:
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MiniFoot Data Pins:
q Packa ged c ontinuously on a
reel for automation
q Manufactured in high
conductivity copper
q Stable foot print that promotes
pin to pad alignment
q Design flexibility for various
lengths and features
q Small PCB footprint
Pin Specifications:
A BType Part No. Pin Size Length Shoulder Height
Sta nd ard Pin 9-L12511375R .025 x .025 0.375 0.275
Pin with Standoff 9-L23581275R .025 x .035 0.275 0.150
: AA = 90/10 Tin/Lead .000120" minimum
LL = 90/10 Tin/Lea d .000300" minimum
Standa rd Pin Pin with Standoff
Pad Recomme ndation
.03(0.8)
.03(0.8)
.100(2.54)
.065(1.65)
.100(2.54)
.065(1.65)
.035(0.89)
.03(0.8)
BB
AA
.015(0.38)
.015
(0.38)
.025(0.64) SQ
.035(0.89)
.025(0.64)
.035(0.89)
.025(0.64)
.040(1.01)
.012(0.30) SQ
.070 (1.78)
.105 (2.67)
.201(5.11)
.090 (2.29)
Mechanical Specifica tions:
q Mate rial: C11000 Cop pe r
q Pac kaging: Co ntinuous on a
15" Co rrugat ed Plastic Ree l
With 10,000 Piec es Per Ree l
q Plating Op tions:
"LL" = 90/10 Tin/ Lea d .000300" -
.000500"
"AA" = 90/10 Tin/ Lea d .000120"
minimum
(Underpla te .000050" minimum
Nickel)
Performance Specifications:
q Elec trical C ond uc tivity: 101% IACS
at 68F (20C)
q Thermal Conductivity:
226 BTU/sq.f t/ ft/ hr/ F @68F
q Op erating Temp erature:
-65C (-85F) to 125C (257F) at
85% RH
Automation:
q Autosplice Auto Feed er
Solderability:
q Per IPC J-STD-002A
Paste Recommendations:
q Thic kne ss: .008" - .010"
q Size: 1:1 Full Ape rture to Pad
Pac kage d in a c ontinuously reeled
format.
.060(1.52)
.012(0.30) SQ
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Conductivity Comparison
TreadHead Power Pins:
q Packaged continuously in
tape & ree l
q TreadHea d design promotes
self alignment & robust solder
joints
q Manufactured in high
conductivity copper
q Common packaging for various
pin lengths, styles, materials,
platings & sizes
Pin Specifications:
A B C D X Y Z
Part No. Pin SizeHead Ma ting Sha ft Length Head
Pad DimensionsDia me te r Dia me te r Thic kne ss
9-S18141670 0.081 0.120 0.081 0.670 0.050 0.150 0.125 0.036
9-S16241670 0.062 0.100 0.062 0.670 0.050 0.135 0.105 0.032
9-S24041675 0.040 0.100 0.040 0.675 0.025 0.135 0.105 0.032
In amp s, stand ing in free a ir, with a
tem perature rise o f 25C. These are
calculated, continuous current ratings.
Pin Autosplice Standard BrassSize Copper Pins Equiva lent
.040 RD 51 14
.062 RD 120 34
.081 RD 200 58
60
A
60
YZ
Custom Pins
.040" Pin Sizes
Head DesignPad Recom menda tion1:1 Aperture
60
.060 .001(1.52 0.03)
.040 .001(1.02 0.03)
D
C
B
Mechanical Specifications:
q Ma terial: C102000 Cop pe r,
q Pac kaging: Tap e a nd Reel
15" Co rruga ted Plastic Ree l
.040" (1.02mm) and .062"
(1.57mm ) - 5,000 Piec es
.081" (2.06mm) - 4,000 Piec es
q Plating Op tions:
"LL" = 90/ 10 Tin/ Lead .000300" -
.000500"
"AA" = 90/10 Tin/ Lea d .000120"
minimum
(Underpla te .000050" minimum
Nickel)
Performance Specifications:
q Elec trical C ond uc tivity: 101% IACS
at 68F (20C)
q Thermal Conductivity:
226 BTU/sq.ft / ft/ hr/ F @68F
q Op erating Temp erature:
-65C (-85F) to 125C (257F) a t
85% RH
Automation:
q Autosplice Auto Feed er
Solderability:
q Per IPC J-STD-002A
Paste Recomme ndations:
q Thic kne ss: .008" - .010"
q Size: 1:1 (to "X" diameter) Full
Ape rture to Pad
Packaged continuously in tape and
reel.
: LAA = Loose Piece 90/10 Tin/Lead .000120" minimum
LLL = Loose Piece 90/ 10 Tin/Lea d .000300" minimum
TAA = Tape & Ree l 90/10 Tin/Lead .000120" minimum
TLL = Tape & Ree l 90/10 Tin/Lea d .000300" minimum
X
A
L.010
L.010
-Y-
.146 .010(3.70 0.25)
.085 .010(2.16 0.25)
.035 (0.90)
.012(0.30)
.100(2.54)
.025 (0.63)-Y-
.005 Min(0.13)
.081" & .062" Pin Sizes
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autosplice
Innova tive Interconnec tions
Autosplice Inc.10121 Barnes Canyon Road, San Diego, CA 92121 USA
Tel: (858) 535-0077 Fax: (858) 535-0130
E-Mail: [email protected]
Web: www.autosplice.com
For further information contact the AUTOSPLICE Application Engineering Department at 800-535-5538
DS010701
Auto Feeder Technology for Automatic Placement
Compatible with:
AutoFeeder:
q Compatible with most leading pick and place equipment
q Refresh rate < 250 milliseconds
q Self replenishing design
q Common mec hanism for all feeders
q Position accuracy of the pin to the pick location
of .002 in X and Y
q Operates asynchronously from the machine
Fuji Siemans Sanyo Philips Zevatech
q Reel reloads while mounted
q 90 sec ond reload time
q Minimum changeover for various pin lengths
q 24VDC, 75PSIG
q MTBF Target minimum 5KK picks
q Durable, low maintenance
REGISTERED COM
PANY
QS9000
(MiniFoot Feed er shown)
others upon req uest
The informa tion in this dat a shee t is sub ject to c hange . Consult with Autosplic e fo r co nfirmat ion on spec ifica tions.
MiniFoot is a pa tented tec hnology of Autosplice. TreadHead and A utoFeed er pate nt pend ing.