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    AutoFeeder:

    800-535-5538

    www.autosplice.comREELed SOLUTIONS FOR

    AUTOMATING INTERCONNECTS

    Innovative New SMT PinsProvide Automated Surface Mount Pin Assembly

    Trea

    dHead

    &MiniFoot

    SMTPins

    Autosplice s M iniFoot and Tread Head

    SMT pins provide an ultra-small footprint,

    rigid solder joint and repea tab le pin

    to pad alignment, facilitating

    autom at ion. Tread Head SMT p ins

    have a n unique tread p attern on the

    bottom surfac e of the p in head,

    which promo tes out-ga ssing d uring

    reflow, creating a vacuum under the

    hea d p ulling the p in tightly into

    prop er alignme nt with the PCB pa d.

    The MiniFoo t p in de sign uses a "bow -

    tie" shap e foo t tha t p rovide s a stab le

    founda tion, while p romo ting solder

    wicking for an optimal solder fillet

    co ncentrated a round the ba se of the

    pin. The result is consistent pin-to-pad

    alignment and superior solder joint

    pull-streng th. The SMT p ins a re

    pa ckage d and reeled for automa tic

    plac eme nt on stand ard SMT platforms

    using Auto splice s Auto Feede r.

    New SMT Pin Design provides an ultra-small footprint, stable solder joint and

    co nsistent alignmen t.

    MiniFoot

    Data Pin:SMT Pin Features:q High conductivity

    copper constructionq Small, stable foot

    q Various leng ths andfeatures

    q Available in differentplating options

    q Compa tible withAutosplices AutoFee der

    q Packaged for automation

    AutoFee de r Features:q Automated plac ement

    of MiniFoot andTreadHead pins

    q Automatic selfre-plenishment

    q Flexible for variousdiameters and pin lengths

    q Refresh rates lessthan 250ms

    q Compa tible with allleading pick-and-plac eequipment

    TreadHead

    Power Pin:

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    MiniFoot Data Pins:

    q Packa ged c ontinuously on a

    reel for automation

    q Manufactured in high

    conductivity copper

    q Stable foot print that promotes

    pin to pad alignment

    q Design flexibility for various

    lengths and features

    q Small PCB footprint

    Pin Specifications:

    A BType Part No. Pin Size Length Shoulder Height

    Sta nd ard Pin 9-L12511375R .025 x .025 0.375 0.275

    Pin with Standoff 9-L23581275R .025 x .035 0.275 0.150

    : AA = 90/10 Tin/Lead .000120" minimum

    LL = 90/10 Tin/Lea d .000300" minimum

    Standa rd Pin Pin with Standoff

    Pad Recomme ndation

    .03(0.8)

    .03(0.8)

    .100(2.54)

    .065(1.65)

    .100(2.54)

    .065(1.65)

    .035(0.89)

    .03(0.8)

    BB

    AA

    .015(0.38)

    .015

    (0.38)

    .025(0.64) SQ

    .035(0.89)

    .025(0.64)

    .035(0.89)

    .025(0.64)

    .040(1.01)

    .012(0.30) SQ

    .070 (1.78)

    .105 (2.67)

    .201(5.11)

    .090 (2.29)

    Mechanical Specifica tions:

    q Mate rial: C11000 Cop pe r

    q Pac kaging: Co ntinuous on a

    15" Co rrugat ed Plastic Ree l

    With 10,000 Piec es Per Ree l

    q Plating Op tions:

    "LL" = 90/10 Tin/ Lea d .000300" -

    .000500"

    "AA" = 90/10 Tin/ Lea d .000120"

    minimum

    (Underpla te .000050" minimum

    Nickel)

    Performance Specifications:

    q Elec trical C ond uc tivity: 101% IACS

    at 68F (20C)

    q Thermal Conductivity:

    226 BTU/sq.f t/ ft/ hr/ F @68F

    q Op erating Temp erature:

    -65C (-85F) to 125C (257F) at

    85% RH

    Automation:

    q Autosplice Auto Feed er

    Solderability:

    q Per IPC J-STD-002A

    Paste Recommendations:

    q Thic kne ss: .008" - .010"

    q Size: 1:1 Full Ape rture to Pad

    Pac kage d in a c ontinuously reeled

    format.

    .060(1.52)

    .012(0.30) SQ

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    Conductivity Comparison

    TreadHead Power Pins:

    q Packaged continuously in

    tape & ree l

    q TreadHea d design promotes

    self alignment & robust solder

    joints

    q Manufactured in high

    conductivity copper

    q Common packaging for various

    pin lengths, styles, materials,

    platings & sizes

    Pin Specifications:

    A B C D X Y Z

    Part No. Pin SizeHead Ma ting Sha ft Length Head

    Pad DimensionsDia me te r Dia me te r Thic kne ss

    9-S18141670 0.081 0.120 0.081 0.670 0.050 0.150 0.125 0.036

    9-S16241670 0.062 0.100 0.062 0.670 0.050 0.135 0.105 0.032

    9-S24041675 0.040 0.100 0.040 0.675 0.025 0.135 0.105 0.032

    In amp s, stand ing in free a ir, with a

    tem perature rise o f 25C. These are

    calculated, continuous current ratings.

    Pin Autosplice Standard BrassSize Copper Pins Equiva lent

    .040 RD 51 14

    .062 RD 120 34

    .081 RD 200 58

    60

    A

    60

    YZ

    Custom Pins

    .040" Pin Sizes

    Head DesignPad Recom menda tion1:1 Aperture

    60

    .060 .001(1.52 0.03)

    .040 .001(1.02 0.03)

    D

    C

    B

    Mechanical Specifications:

    q Ma terial: C102000 Cop pe r,

    q Pac kaging: Tap e a nd Reel

    15" Co rruga ted Plastic Ree l

    .040" (1.02mm) and .062"

    (1.57mm ) - 5,000 Piec es

    .081" (2.06mm) - 4,000 Piec es

    q Plating Op tions:

    "LL" = 90/ 10 Tin/ Lead .000300" -

    .000500"

    "AA" = 90/10 Tin/ Lea d .000120"

    minimum

    (Underpla te .000050" minimum

    Nickel)

    Performance Specifications:

    q Elec trical C ond uc tivity: 101% IACS

    at 68F (20C)

    q Thermal Conductivity:

    226 BTU/sq.ft / ft/ hr/ F @68F

    q Op erating Temp erature:

    -65C (-85F) to 125C (257F) a t

    85% RH

    Automation:

    q Autosplice Auto Feed er

    Solderability:

    q Per IPC J-STD-002A

    Paste Recomme ndations:

    q Thic kne ss: .008" - .010"

    q Size: 1:1 (to "X" diameter) Full

    Ape rture to Pad

    Packaged continuously in tape and

    reel.

    : LAA = Loose Piece 90/10 Tin/Lead .000120" minimum

    LLL = Loose Piece 90/ 10 Tin/Lea d .000300" minimum

    TAA = Tape & Ree l 90/10 Tin/Lead .000120" minimum

    TLL = Tape & Ree l 90/10 Tin/Lea d .000300" minimum

    X

    A

    L.010

    L.010

    -Y-

    .146 .010(3.70 0.25)

    .085 .010(2.16 0.25)

    .035 (0.90)

    .012(0.30)

    .100(2.54)

    .025 (0.63)-Y-

    .005 Min(0.13)

    .081" & .062" Pin Sizes

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    autosplice

    Innova tive Interconnec tions

    Autosplice Inc.10121 Barnes Canyon Road, San Diego, CA 92121 USA

    Tel: (858) 535-0077 Fax: (858) 535-0130

    E-Mail: [email protected]

    Web: www.autosplice.com

    For further information contact the AUTOSPLICE Application Engineering Department at 800-535-5538

    DS010701

    Auto Feeder Technology for Automatic Placement

    Compatible with:

    AutoFeeder:

    q Compatible with most leading pick and place equipment

    q Refresh rate < 250 milliseconds

    q Self replenishing design

    q Common mec hanism for all feeders

    q Position accuracy of the pin to the pick location

    of .002 in X and Y

    q Operates asynchronously from the machine

    Fuji Siemans Sanyo Philips Zevatech

    q Reel reloads while mounted

    q 90 sec ond reload time

    q Minimum changeover for various pin lengths

    q 24VDC, 75PSIG

    q MTBF Target minimum 5KK picks

    q Durable, low maintenance

    REGISTERED COM

    PANY

    QS9000

    (MiniFoot Feed er shown)

    others upon req uest

    The informa tion in this dat a shee t is sub ject to c hange . Consult with Autosplic e fo r co nfirmat ion on spec ifica tions.

    MiniFoot is a pa tented tec hnology of Autosplice. TreadHead and A utoFeed er pate nt pend ing.