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Low cost 3-inch Rapid Thermal Processing system for research and development applications
Up to 1250°C, up to 250°C/s, high vacuum capability 1
RTP
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Applications
Implant annealing Ohmic contact annealing Rapid Thermal Oxidation (RTO) Rapid Thermal Nitridation (RTN) Densification and crystallization Selenization CVD of graphene Diffusion from spin-on dopants Etc.
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• Infrared halogen tubular lamp furnace with silent fan cooling • Quartz tube chamber with water-cooled stainless steel flanges • Fast digital PID temperature controller • Thermocouple control (optional pyrometer) • Atmospheric and vacuum process capability • Purge gas line with needle valve • Up to 4 process gas lines with digital MFC • PC control with Ethernet communication for fast data logging • Optional SiC coated graphite susceptor for small samples • Optional turbo pump and pressure control • Optional double chamber for cross-contamination issues
Key features
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Design: Benchtop system for up to 3-inch wafers
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Double chamber configuration for cross-contamination issues
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Halogen lamps
Quartz tube
Thermocouple Exhaust and vacuum
Door
Quartz holder Wafer
Process gas
Rear screen
Reactor design
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Furnace control
• Infrared halogen tubular lamp furnace with fan cooling: Low noise level No compressed air consumption
• Power blocks are power control (not voltage control):
Power to lamps is independent of Lamp filament resistivity Lamp aging
• Better process reproducibility
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Temperature control
Temperature control: N type thermocouples (Room temperature to 1250 °C) Optional pyrometer (700°C to 1250°C)
Fast digital temperature controller: No temperature overshoot Set of PID parameters for different temperature levels Automatic autotuning procedure PID parameter tables attached to each recipe
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Vacuum and Gas configuration
MFC
Gas 3 Gas 2 Gas 1
Vacuum gauge
Vacuum valve
To Vacuum pump
Exhaust Check valve
Opt
iona
l
MFC
MFC
Wafer
Purge
MFC
Gas 4
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Example of configuration with four process gas lines and purge line
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Vacuum and Gas configuration
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Customized configurations
Other customized configurations are available upon request
Glove box interface for sample transfer under controlled atmosphere
Door
Quartz holder Wafer
Glove box
Process chamber
Controlled atmosphere
AS-Micro furnace
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Optional features Warranty: Warranty extension for second year or for second and third year Lamp furnace: Proportional control (power gradient between top and bottom) System: Pyrometer for temperature control (range: 700°C to 1250°C) Additional process gas line (double ferrule or VCR) EPDM sealing (NH3 use) HV valve kit (for high vacuum compatibility of the process chamber < 10-6 mbar) Soft-pump angle valve to prevent samples from moving at initial pump down Pirani capacitance diaphragm gauge (range: 5x10-4 to 1500 mbar) Capacitance manometer and downstream pressure control Glove box interface and glove box Twin chamber option Substrate holders: Susceptor kit in graphite or SiC coated graphite, special quartz holders Vacuum pumps: Rotary oil pump, rotary Fomblin pump, dry scroll pump Turbo pump Safety features: Nitrogen gas ballast Software: Wafer traceability Miscellaneous: Stainless steel laboratory table for AS-Micro 1400 mm x 700 mm Spare part kit
Non-contractual document, specifications subject to change without notice www.annealsys.com 13
Access modes: • Operator, Engineer, Administrator
Recipe mode: • Up to 100 steps per recipe • TC and pyrometer calibration associated to recipe • PID table associated to recipe
Process: • Full data logging • All data and table saved in process historical • Automatic autotuning (PID calculation) • Automatic pyrometer calibration
Manual mode: • Manual control of heating, vacuum and gas
Configuration mode: • Mass flow ranges, calibration tables, alarm values…
Same software for all Annealsys systems = robustness and reliability
PC Control Software
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PC Control Software: Step editor for process recipes
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PC Control Software: Real time display and data collection
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PC Control Software: Diagnostic capabilities
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Specifications
AS-Micro Maximum substrate diameter 3-inch
Chamber dimensions 85 mm diameter x 250 mm
Number of lamps / Maximum power 6 / 15 kW
Lamp cooling Fans
Temperature range RT to 1250°C
Ramp rate 0.1°C to 250°C/s
Temperature control Fast digital PID controller
Thermocouples 2 N type
Pyrometer Optional
Gas injection Loading flange
Purge gas line Standard
Process gas line with mass flow cont. Up to 4
Pumping port Backside flange
Vacuum valve and vacuum gauge Standard
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Facility requirements
AS-Micro Voltage 3x400V+N or 3x220V Power 15 kW
Water flow 8 l/mn
Compressed air 6 bars / 0.1 m3/h
Process gases 2 bars
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Dimensions and Weight
AS-Micro Single chamber
AS-Micro Twin chamber
Width 700 mm 700 mm Height 700 mm 1,825 mm Depth 700 mm 700 mm
Weight 82 kg 142 kg
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Customers Austria: Montanuniversität Leoben China: Huawei Technologies, IMUT, IHEP, USST France: Université de Bourgogne, CEMES Toulouse Germany: Universität Karlsruhe India: MSD-IGCAR Israel: Hebrew University Jerusalem, Tel Aviv University Italy: Instituto Culturale di Trento Japan: AIST, Nagoya University, Tokyo University Korea: Postech Kuwait: Kuwait University Luxembourg: Centre de Recherche Public – Gabriel Lippmann Mexico: Cimav, Cinvestav Norway: University of Oslo Romania: NIMP Bucharest Slovakia: Institute of Electrical Engineering Spain: CNM Madrid, ICMAB Barcelona, IMDEA, ICMAB, Tekniker Taiwan: NCU Turkey: Middle East Technical University United Kingdom: Rutherford Appleton Laboratory, University of Bath USA: MIT, Northwestern University, University of West Virginia
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Non-contractual document, specifications subject to change without notice www.annealsys.com 21
Thank you for your attention
Bâtiment T2, PIT de la Pompignane
Rue de la Vieille Poste 34055 MONTPELLIER Cedex 1
FRANCE
Tel: +33 (0) 467 20 23 63 Email: [email protected]
www.annealsys.com
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