Low cost 3 -inch Rapid Thermal Processing system for ... · Non-contractual document,...

Non-contractual document, specifications subject to change without notice www.annealsys.com

Low cost 3-inch Rapid Thermal Processing system for research and development applications

Up to 1250°C, up to 250°C/s, high vacuum capability 1

RTP


Applications

Implant annealing Ohmic contact annealing Rapid Thermal Oxidation (RTO) Rapid Thermal Nitridation (RTN) Densification and crystallization Selenization CVD of graphene Diffusion from spin-on dopants Etc.

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• Infrared halogen tubular lamp furnace with silent fan cooling • Quartz tube chamber with water-cooled stainless steel flanges • Fast digital PID temperature controller • Thermocouple control (optional pyrometer) • Atmospheric and vacuum process capability • Purge gas line with needle valve • Up to 4 process gas lines with digital MFC • PC control with Ethernet communication for fast data logging • Optional SiC coated graphite susceptor for small samples • Optional turbo pump and pressure control • Optional double chamber for cross-contamination issues

Key features

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Design: Benchtop system for up to 3-inch wafers

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Double chamber configuration for cross-contamination issues

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Halogen lamps

Quartz tube

Thermocouple Exhaust and vacuum

Door

Quartz holder Wafer

Process gas

Rear screen

Reactor design

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Furnace control

• Infrared halogen tubular lamp furnace with fan cooling: Low noise level No compressed air consumption

• Power blocks are power control (not voltage control):

Power to lamps is independent of Lamp filament resistivity Lamp aging

• Better process reproducibility

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Temperature control

Temperature control: N type thermocouples (Room temperature to 1250 °C) Optional pyrometer (700°C to 1250°C)

Fast digital temperature controller: No temperature overshoot Set of PID parameters for different temperature levels Automatic autotuning procedure PID parameter tables attached to each recipe

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Vacuum and Gas configuration

MFC

Gas 3 Gas 2 Gas 1

Vacuum gauge

Vacuum valve

To Vacuum pump

Exhaust Check valve

Opt

iona

l

MFC

MFC

Wafer

Purge

MFC

Gas 4

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Example of configuration with four process gas lines and purge line

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Vacuum and Gas configuration


Customized configurations

Other customized configurations are available upon request

Glove box interface for sample transfer under controlled atmosphere

Door

Quartz holder Wafer

Glove box

Process chamber

Controlled atmosphere

AS-Micro furnace

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Optional features Warranty: Warranty extension for second year or for second and third year Lamp furnace: Proportional control (power gradient between top and bottom) System: Pyrometer for temperature control (range: 700°C to 1250°C) Additional process gas line (double ferrule or VCR) EPDM sealing (NH3 use) HV valve kit (for high vacuum compatibility of the process chamber < 10-6 mbar) Soft-pump angle valve to prevent samples from moving at initial pump down Pirani capacitance diaphragm gauge (range: 5x10-4 to 1500 mbar) Capacitance manometer and downstream pressure control Glove box interface and glove box Twin chamber option Substrate holders: Susceptor kit in graphite or SiC coated graphite, special quartz holders Vacuum pumps: Rotary oil pump, rotary Fomblin pump, dry scroll pump Turbo pump Safety features: Nitrogen gas ballast Software: Wafer traceability Miscellaneous: Stainless steel laboratory table for AS-Micro 1400 mm x 700 mm Spare part kit

Non-contractual document, specifications subject to change without notice www.annealsys.com 13

Access modes: • Operator, Engineer, Administrator

Recipe mode: • Up to 100 steps per recipe • TC and pyrometer calibration associated to recipe • PID table associated to recipe

Process: • Full data logging • All data and table saved in process historical • Automatic autotuning (PID calculation) • Automatic pyrometer calibration

Manual mode: • Manual control of heating, vacuum and gas

Configuration mode: • Mass flow ranges, calibration tables, alarm values…

Same software for all Annealsys systems = robustness and reliability

PC Control Software


PC Control Software: Step editor for process recipes


PC Control Software: Real time display and data collection


PC Control Software: Diagnostic capabilities


Specifications

AS-Micro Maximum substrate diameter 3-inch

Chamber dimensions 85 mm diameter x 250 mm

Number of lamps / Maximum power 6 / 15 kW

Lamp cooling Fans

Temperature range RT to 1250°C

Ramp rate 0.1°C to 250°C/s

Temperature control Fast digital PID controller

Thermocouples 2 N type

Pyrometer Optional

Gas injection Loading flange

Purge gas line Standard

Process gas line with mass flow cont. Up to 4

Pumping port Backside flange

Vacuum valve and vacuum gauge Standard

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Facility requirements

AS-Micro Voltage 3x400V+N or 3x220V Power 15 kW

Water flow 8 l/mn

Compressed air 6 bars / 0.1 m3/h

Process gases 2 bars

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Dimensions and Weight

AS-Micro Single chamber

AS-Micro Twin chamber

Width 700 mm 700 mm Height 700 mm 1,825 mm Depth 700 mm 700 mm

Weight 82 kg 142 kg

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Customers Austria: Montanuniversität Leoben China: Huawei Technologies, IMUT, IHEP, USST France: Université de Bourgogne, CEMES Toulouse Germany: Universität Karlsruhe India: MSD-IGCAR Israel: Hebrew University Jerusalem, Tel Aviv University Italy: Instituto Culturale di Trento Japan: AIST, Nagoya University, Tokyo University Korea: Postech Kuwait: Kuwait University Luxembourg: Centre de Recherche Public – Gabriel Lippmann Mexico: Cimav, Cinvestav Norway: University of Oslo Romania: NIMP Bucharest Slovakia: Institute of Electrical Engineering Spain: CNM Madrid, ICMAB Barcelona, IMDEA, ICMAB, Tekniker Taiwan: NCU Turkey: Middle East Technical University United Kingdom: Rutherford Appleton Laboratory, University of Bath USA: MIT, Northwestern University, University of West Virginia

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Thank you for your attention

Bâtiment T2, PIT de la Pompignane

Rue de la Vieille Poste 34055 MONTPELLIER Cedex 1

FRANCE

Tel: +33 (0) 467 20 23 63 Email: [email protected]

www.annealsys.com

Low cost 3 -inch Rapid Thermal Processing system for ... · Non-contractual document,...

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