iNEMI Meetings at OFC 2015
Conference iNEMI
Optoelectronic TIG and Project Meetings
Monday, March 23, 2015
10:00 am – 5:15 pm PDT
Los Angeles Convention Center
March 23, 2015
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Agenda
• 10:00 – 10.15 am Introductions and INEMI Overview: David Godlewski, iNEMI
• 10:15 – 10.40 am Development of cleanliness specification for expanded beam connectors project, Tatiana Berdinskikh, Celestica International Inc. and Tom Mitcheltree, USConec
• 10:40 – 11:05 am Optical modeling for contamination effects for transceivers using ZEMAX, Christine Chen, Avago Technologies
• 11:05 – 11:30 am The effect of dust on lensed and non-lensed connectors, Michael Kadar-Kallen, TE Connectivity
• 11.30 – 12.00 pm PSMC history and status, Bob Pfahl, iNEMI
• 12:00 – 1:00 pm Break
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Agenda
• 1:00 – 1.15 pm Introduction to IEC 86B Task Force Group on Scratch
Recognition,Tatiana Berdinskikh, Celestica International
Inc, and Jamie Chivers, DORC
• 1:15 – 1.30 pm Why is scratch analysis is so difficult, Jamie
Chivers, DORC
• 1.30 – 1.45 pm Effects of Video Noise on Defect Detection
Repeatability, Doug Wilson, Fiber QA
• 1.45- 2.00 pm Experiment of Measure Effect of Image Focus
on Defect Detection and Measurement, Doug
Wilson, Fiber QA
• 2.00 – 2.30 pm Fiber endface automated inspection: some
proposals, Vitalina Rudyk, Sumix
4
Agenda
• 2:30- 2:45 pm Scratch vs RL, Matt Brown, JDSU
• 2.45 – 3:00 pm Break
• 3.00 – 3:30 pm Crosstalk Performance of MTP/MPO Connectors for High Power Applications, Toshiaki Satake, USConec
• 3: 30- 4:00 pm Proposal to Standardize Evaluation and Criteria for “Contamination-Repellant” by Connector Insertion/Extraction, Satoshi Kaneyuki and Sho Kondo, TOTO
• 4:00 – 4:15 pm Update on Visual Inspection Requirement and Artifact, Dr. Yu Lu, Ton Bolhaar, Mike Gurreri, Broadband Network Solutions
• 4:15 – 5:00 pm Opto Electronics Gaps analysis working session
• 5:00 – 5:15 pm Wrap up/Summary
iNEMI Overview
March 2015
6
Material Enclosed
iNEMI Overview
Membership
Technology Roadmap
Collaborative Initiatives & Projects
7
About iNEMI
International Electronics Manufacturing Initiative (iNEMI) is an industry-led
consortium of over 100 global manufacturers, suppliers, industry
associations, government agencies and universities. A Non Profit Fully
Funded by Member Dues; All Funding is Returned to the Members in High
Value Programs and Services; In Operation Since 1994.
Visit us at www.inemi.org
5 Key Deliverables:
• Technology Roadmaps
• Collaborative Deployment
Projects
• Research Priorities Documents
• Proactive Forums
• Position Papers
Mission: Forecast and Accelerate improvements in the Electronics
Manufacturing Industry for a Sustainable Future.
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Global Operations
• iNEMI is headquartered in Herndon, Virginia, USA.
• Opened an office in Shanghai and added a team member in Europe in 2007.
• Dr. Haley Fu is leading operations in Asia, based in Shanghai, China.
• Grace O’Malley is representing iNEMI in Europe from her base in Ireland.
99
Product
Needs
Technology
Evolution
GAP Analysis
Technology Plan
Research
Priorities
Research
Projects
Methodology
Competitive
Solutions
Roadmap
Industry Solution
Needed
Academia
Government
iNEMI
Members
Collaborate
No Work
Required
Available
to Market
Place
Global
Industry
Participation Disruptive
Technology
iNEMI Methodology
13
Technology Roadmap Process
ID key market trends & Evolution
Potential disruptive technologies
Looking 10 years into the future
Critical Analysis of Roadmap
Extract key gaps and challenges
Both Short & Long Term
Further Refine Opportunities
Use technology working groups
Use organized workshops
To ID collaborative projects
Organize & Direct Projects
Teams formed to clearly identify scope/deliverables
Call for member participation
Manage collaborative R&D process
Ensure delivered results
Membership
12
International Member Growth
Across The Total Supply Chain (Q1 2013)
Total Global Supply Chain Integration
70% Growth in past 3 years
The International Membership Incorporated Location; Number of Members
INEMI Member Business TypeNorth
AmericaAsia
RegionEurope Totals
OEM 14 3 2 19
ODM/EMS (inc. pkg. & test services) 5 6 1 11
Suppliers (materials, software, services) 9 18 12 39
Equipment 8 0 2 10
Universities & Research Institutes 8 3 2 13
Organizations 11 1 2 14
Totals 55 31 21 107
Areas of “Critical Mass”
Laminate/Substrate Suppliers
Samsung Electro Mechanics Doosan
Endicott Interconnect Tech. Multejk
Shengyi Sci. Tech AT&S
Elec & Eltek Nanya
Ibiden ITEQ
NGK/NTK Dyconex
Research Institutions
SUNY Binghamton CALCE
Georgia Tech IMEC
UC Berkeley NIST
Fraunhofer ASU
Griffith U ITRI
Peking U MIT
CEA/Leti Aalto U
RIT Purdue
11
Equipment Firms
Micronic/Mydata Universal
Assembleon Teradyne
Hover Davis Nordson
PVI Systems Agilent
Akrometrix Corelis
Speedline Acutronic
OEMs & Semiconductors
Alcatel Lucent MSEI
Microsoft BSCI
Cochlear Intel
Juniper Dell
Lenovo IBM
Med El Blackberry
Delphi HP
Cisco TI
Infineon Emerson
Hillcrest Labs Agilent
Chemicals, Adhesives, Metals
Hitachi Chem Nippon
NAMICS Henkel
Inventec Indium
Heraeus Dow
ODM / EMS Firms
Sanmina SCI Wistron
Flextronics Plexus
Celestica IEC
Valtronic
Packaging Firms
STATS ChipPAC
ASE Group
Amkor
Direct Roadmap Development
iNEMI Organization; How Work Gets Done
Research Committee
Stimulate research to address gaps identified by
iNEMI roadmaps
Technical Committee
Develop & integrate
technology strategies & plans
Drive/coordinate all technical
activities
Board of DirectorsSet strategic objectives &
priorities
Ensure financial ethics &
responsibility
Product Needs
6 Product Emulator Groups
Technology Needs
21 Technology Working Groups
Focus AreaSteering Committees
Drive progress on key
priorities
Ensure membership support
Direct Collaborative R&D
RegionalSteering Committees
Help ensure that iNEMI
addresses member needs in
Europe & Asia
The Technical Plan & Gaps are Defined By:
8 Technology Integration Groups
Gap Analysis
Workshop Identified Gaps
Member Identified Needs
Unique Attributes of iNEMI
12
10 year Technology | Business Roadmap
Delivered every two years like clockwork
Unique Gap Analysis
Technical/Business Evolution Details
Proven Collaborative R&D Methodology
Time tested over 19 years
20-25 active collaborative R&D projects
Strong Global Membership
Depth and Breadth of Supply Chain Leaders
Strong set of Universities & Research Institutes
Ability to Execute
Integrated supply chain approach
Solving complex manufacturing issues
Drive widespread adoption and impact
iNEMI Reputation
Track record of sustainability leadership
In demand for knowledge/science input
Results oriented workshops
Why Organizations Participate
Collaborate & Leverage Precious R&D Resources
Engage with key supplier, customer, and competitor experts
Using a proven methodology and expert project managers
Business Opportunity
Develop relationships with supplier and customer experts
• Leading to more business success down the road
Better anticipation of technology trends and inflexion points
Networking in the Industry
Learning from knowledge experts within the iNEMI membership
Access to In Depth Reports and Studies
Detailed project data and analysis for members only
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Membership Rights – Data & Events
• Any staff of your company world wide can create account at iNEMI web site and access member only information
• Monthly iNEMI member newsletter
• Free access to:
– iNEMI Technology Roadmap ($3,000 per copy for non-members)
– Member only Technical Plan
– iNEMI Project Completion Webinars
– Project Reports and Publications
• Can join any project by agreement to the project statement (PS) and SOW
• Can raise project ideas or proposals to meet your needs
• Free or discounted fee for participating in iNEMI workshops and forums
• Pick and choose the Technical Groups of your interest
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New Type of iNEMI Project
Quick Turn
• First iNEMI Quick Project - Development of cleanliness
specification for expanded beam connectors project
• Must be completed in less than a year
• Non-Members can join for $5,000
The Industries Broadest
Technology Roadmap
Chuck Richardson, iNEMI
Director of Roadmapping
Provide Update at 4:00 pm
Collaborative Projects
21Jim Arnold02/27/2012 Slide 21
iNEMI
ODM / EMS
Equipment
Suppliers
Device &
Material
Suppliers
Misc Org &
Consulting
OEM
Academic
& Research
Institutes
LEVERAGING BROAD INDUSTRY EXPERTISETO FORECAST AND ACCELERATE IMPROVEMENTS IN THE
ELECTRONICS MANUFACTURING INDUSTRY FOR A SUSTAINABLE
FUTURE
Test, Inspection
& Measurement
Environmental
Sustainable
Electronics
Final Assembly
Board Assembly
Semiconductor
Technology
Semiconductor
TechnologyPassive
Components
Packaging &
Component
Substrates
Optoelectronics
MEMs / SensorsInterconnect
PCB - Organic
Interconnect
Substrates -
Ceramic
Electronic
Connectors
Thermal
Management
2222
• Cost Reduction by leveraging resources – Typically in the 8X to
20x range on key projects and thrusts:
– Reduce resource demands and $ investments for each
company.
– Ensure technology readiness when required.
– Projects can result in cost reduction (ex. Copper wire bonding).
– Access to thought leaders and senior problem solvers from
across the supply chain.
• Reduce risk of technology introduction
– Reliability – Hard to measure the negative impact of poor
reliability, but can be disastrous.
– Source of supply – Also hard to apply general cost impact
numbers to being late to market – Can also be huge.
• Create globally aligned specifications and methods – pre
competitive level playing field reduces cost
Motivation to Participate in Collaborative Projects
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Project Status
10 Ongoing projects since start 2015
8 scheduled to finish in 2015
4 projects planning second phase in 2015/2016
4 Projects planned to start in Q1
13 more initiatives from the end of year survey being
investigated
Goal to start 8-10 new projects in 2015
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10 New or Continuing ProjectsProject Name TIG Chair Name Member -
Company Name
Est Start Date Actual End Date
Alternative Materials Assessment
Project
Environmental Leo Kenny Intel 01-07-2014 07-20-2015
Automotive Electronic Material
Challenges
Other Anitha Sinkfield Delphi 01-13-2015 02-03-2016
Characterization of Pb-Free Alloy
Alternatives
Board
Assembly
Richard Coyle Alcatel-Lucent 08-01-2013 12-31-2014
Connector High Speed Signaling
Metrology Program: Phase 1
Board
Assembly
Zhichao Zhang Intel 07-24-2014 10-29-2015
Development of Cleanliness
Specification for Expanded Beam
Optoelectronics Tatiana Berdinskikh Celestica 01-19-2015 04-25-2016
Impact of Low CTE Mold
Compound on 2nd Level Solder
Joint Reliability - phase 1
Board
Assembly
Bart Vandevelde imec 07-01-2014 08-01-2015
Metals Recycling Environmental Adam Wheeler Lenovo 01-28-2014 06-02-2015
Quantifying Recycling and Repair
Metrics
Environmental Lisa Dender IBM 11-06-2013 06-02-2015
Ultra Low Loss Laminate/PCB for
High Reliability & Performance
Organic PCB Gary Long Intel 06-18-2014 06-18-2015
Warpage Characteristics of
Organic Packages
Packaging Wei Keat Loh Intel 03-01-2012 01-28-2015
Initiatives
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Results of Initiative Survey
• Survey conducted online in Dec and January
– Members and non members
– 195 respondents
• 23 potential project areas
– Selected from areas identified in technical plan, member
suggestions and output of workshops
• 13 selected for further investigation
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2015 Initiatives
1•Define the product detailed requirements and the process material and equipment needed to enable
2/2 then 1/1 micron line & spacing")MT
2 •Define and execute a study to characterize and quantify the reliability of Copper Micro Bumps MT/ HF
3•Characterize and quantify the reliability performance of Ag alloy bonding wires for high reliability
(example automotive) applicationsMT
4 •Improve warpage qualification framework to ensure SMT yield results at 2nd level interconnect. HF
5•Define material specifications for high power and high density PCB's needed to support under-the-
hood automotive applicationsBB/SP/GO
6 •Develop recommendations of best practices to deliver high yield soldering of QFN-type packages MT
Final Assembly 7 •Develop best automation and design practices for final assembly to optimize cost & quality BG
8•Develop optimized design rules/DFM/DFT & test methodologies to support HDI technology ( <0.3mm
pitch )DG
9•Characterize and quantify the inspection capability of the AXI on HoP (head on pillow) and HiP (Head
in Pillow) defectsDG
10•Develop a industry aligned test and measurement method for peel strength of bendable and wearable
devices.GO/ BB
11•Define a test vehicle for evaluation of specific component packaging technology options for advanced
miniaturization of high reliability medical applicationsDG/GO
MEMS 12•Develop detailed and optimized reliability testing requirements for prioritized and high market impact
MEMS devicesBB
Environment 13•Develop clear business models for key supply chain nodes on the incorporation of Eco Design for high
impact product types and marketsMS
Medical
Package
Board Assembly
Test
www.inemi.orgEmail contacts:
Bill Bader
Bob Pfahl
Grace O’Malley - Europe
Haley Fu - Asia
2929
Annual Participation Fees
Participating Members (For Profit)
Corporate Sales (USD) Membership Dues
$0-5M $5,000
$5-10M $10,000
$10-100M $15,000
$100M-1B $25,000
$1-10B $40,000
$10-15B $55,000
$15B+ $75,000
Affiliate Members (Not-For-Profit)
Category Membership Dues
University $5,000
RI/Org./Gov. Lab/R&D
Center $10,000
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