Page 1
Page 2
Overview Agenda •Why is EM simulation becoming increasingly important?
•Overview of EM simulation technologies
•Integration of EM simulation into practical Design Flows
•Application examples / Demonstrations
•Summary
Page 3
Overview Agenda •Why is EM simulation becoming increasingly important?
•Overview of EM simulation technologies
•Integration of EM simulation into practical Design Flows
•Application examples / Demonstrations
•Summary
Page 4
Key Driver : Integration •Higher Frequencies
• Traditional closed-form circuit models no longer valid
•Higher Packing Densities • No closed-form models available for particular parts of a design
•Higher Complexity • Mixed Microwave/RF, Analog & Digital often present on the PCB
Agilent E8364B PNA Series Network Analyzer
76 IC’s
14 Modules
Page 5
Key Driver : Simulation Efficiency Computer Platform
Improvements
Simulation Algorithm Improvements
+
Practical EM Simulations of real world problems
•Adaptive Frequency Sweeps •Quasi Static Solvers •Auto Layout Pre-Processing •Direct Solvers •Iterative Solvers •Adaptive Mesh Refinement •Conformal Meshing •Multi-Threading Support •GPU Acceleration •64-bit support
•64-bit Operating Systems •Multi-core •GPU’s •Relatively low cost
Page 6
Overview Short Demo... •C-Band Microstrip Hairpin Filter Simulation
Page 7
Overview Agenda •Why is EM simulation becoming increasingly important?
•Overview of EM simulation technologies
•Integration of EM simulation into practical Design Flows
•Application examples / Demonstrations
•Summary
Page 8
Overview Generalised EM Simulation Process Objective : To find an approximate solution to Maxwell’s equations that satisfy given boundary conditions and set of initial conditions Key Steps
• Create the Physical Model • Draw/Import Layout Geometry, Assign Materials etc...
• EM Simulation Setup • Define Boundary Conditions, Ports, Simulation Settings etc...
• Perform the EM Simulation • Discretise the physical model into mesh cells and approximate the field/current using a local function (Expansion/Basis function) • Adjust the function coefficients until the boundary conditions are satisfied
• Post-processing • Calculate S-parameters, TDR Response, Antenna Far Field Patterns etc...
Page 9
Overview EM Simulation Technologies •Method of Moments (MoM) •Finite Element Method (FEM) •Finite Difference Time Domain (FDTD)
FDTD
FEM MoM • 3D Arbitrary Structures • Full Wave EM Simulation • Direct, Iterative Solvers • Frequency Domain EM • Multiport simulation at no additional cost • High Q
• 3D arbitrary structures • Full Wave EM simulations • Handles much larger and complex problems • Time Domain EM • Simulate full size cell phone antennas • EM simulations per each port • GPU based hardware acceleration
• 3D Planar structures • Full Wave and Quasi-Static • Dense & Compressed Solvers • Frequency Domain • Multiport simulation at no
additional cost • High Q
Page 10
Overview Method of Moments 3D-Planar EM Simulation
3D-Planar, Frequency Domain Preparing a multilayer board / IC:
Interconnect layer(s) divided into planar mesh cells
Surface currents are the unknowns Coupling is modeled by pre-computing
substrate (Green’s functions) Assumes infinite substrate in x-y
direction At a given frequency:
Current in each mesh cell is solved One compressed matrix solve for all
port excitations
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Overview Finite Element 3D EM Simulation Full 3D, Frequency Domain
Preparing a 3D structure: Define boundary conditions to truncate
simulation domain Segment the simulation domain using
tetrahedral mesh cells Compute Port modes and use as
excitation for 3D structure Approximate E fields over each
tetrahedron with a polynomial containing unknown coefficients
At a given frequency: E-field at each mesh cell is solved Solve one sparse matrix for all port
excitations to determine unknown polynomial coefficients
Derive the S-parameters
Page 12
Overview Finite Difference Time Domain Simulation Full 3D, Time Domain Preparing a 3D structure:
Boundary conditions to truncate simulation domain
Segment the simulation domain using hexahedral mesh cells
Complete simulation domain segmented using E and H fields as unknowns
Time stepping algorithm Alternating update of E and H field at
each mesh cell, progressing in time until steady state time domain is reached
No matrix solve Use FFT to obtain broadband S-
parameters
Page 13
Overview EM Technology Selection MoM
Most efficient for planar, multilayer applications
- IC passives & interconnects - RF PCB interconnects - High-speed PCB signal integrity
analysis - Planar antennas
• FEM, FDTD • Can handle arbitrary 3D geometries ‐ Connectors ‐ Bondwires ‐ Packages ‐ Waveguide ‐ 3D antennas
Planar vs. 3D Geometry
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Overview EM Technology Selection Momentum Plus
Effective for complex board High accuracy Frequency domain, so able to handle complex
frequency dependent parameters Effective for large number of ports No approximations to geometry Easy design flow
Minus
3D field patterns require additional computation step
When to use
Complex boards for SI/PI analysis
FDTD Plus
Effective for complex boards High accuracy within approximations
made during meshing Time domain: broadband frequency
responses with one simulation Easy way to plot near fields Easy design flow
Minus
Each port definition is a new simulation Design is approximated during meshing step Frequency dependent parameters require special model
When to use
EMI analysis for boards in combinations with connectors, ESD analysis
Boards with limited number of driving lines
Modelling Complex Boards (Signal & Power Integrity)
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Overview EM Technology Selection MoM, FEM
Solves natively in the frequency domain Best for high Q applications
RF / MW Filters Oscillators
FDTD Solves natively in the time domain
Best for TDR analysis Signal Integrity Transitions
Response / Analysis Type
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Overview EM Technology Selection Device Complexity / Problem Size FEM
Most efficient for multi-port applications Solves for all ports in a single simulation
Packages Interconnect network
FDTD Most memory efficient for high number of
mesh cells Uses a sequence of direct calculations
instead of a matrix solve Highly parallelized, can take advantage
of GPU acceleration Antenna placement on autos, planes Bio analysis with complex human
body models (e.g., SAR)
Page 17
Overview Choosing the Right Solver for Your Application
Geometry Type
Planar / Multilayer
3D, Planar+3D
MoM
Response/ Analysis
Type FEM High Q
TDR, EMI, EMC FDTD
Device Complexity/ Problem
Size
Personal Preference
“Which EM Solver Should I Use?”
Broadband
FEM Multi-Port High #
Mesh Cells
FDTD
Moderate Complexity
“I like Time
Domain”
“I like Frequency Domain” FEM FDTD
Page 18
Overview Agenda •Why is EM simulation becoming increasingly important?
•Overview of EM simulation technologies
•Integration of EM simulation into practical Design Flows
•Application examples / Demonstrations
•Summary
Page 19
Overview Case Study : 2hrs Data Xfer / Simulation START
ADS Layout Export GDS file Import GDS file
into other 3rd party EM tools
Re-Assign material information
Set up geometry & ports for simulation
Export port locations to a .MSK file
Run custom program to create script file to auto-
generate ports in 3rd party EM tools
Auto-generate Ports
(For complex designs) Run EM simulation for S-parameters
Import S-parameters from EM tool into ADS
Reconnect Ports from EM with other passives and actives for co-simulation and verification
10 min.
30 min.
30 min.
Hours of Simulation
20 min.
10 min.
END
RE
PE
AT
EM Tech file
Duplicate layer infomration ADS
Tech file
Page 20
Overview Agilent 3D EM Platform Release History
EMPro 2008
FEM Simulator
AMDS
EMDS
EMPro 2009
FDTD Simulator
FDTD Simulator FEM & FDTD Simulators
EMPro 2010 May 2010 EMPro 2010.07 July 2010 EMPro 2011.02 February 2011 EMPro 2011.04 April 2011 EMPro 2011.07 July 2011
January 2010
Page 21
Overview Agilent EM Simulation Portfolio ADS Platform
FDTD Simulator Finite Difference Time Domain
FEM Simulator Finite Element Method
Momentum Simulator Method of Moments
EMPro Environment Parameterized
3D EM Components
EMDS
ADS Layout Export
Page 22
Overview 3D EM Component Import Capability Create 3D EM
Component in EMPro Import 3D EM Component
into ADS and place in layout
2D View 3D View
Run FEM simulation of 3D EM Component + Layout in ADS
Add schematic components and run FEM / circuit co-sim
1 2
3 4
Page 23
Overview Additional Platform Links
AMDS
ADS Platform
FDTD Simulator Finite Difference
Time Domain
FEM Simulator Finite Element Method
Momentum Simulator Method of Moments
EMPro Environment Parameterized
3D EM Components
EMDS
ADS Layout Export
Cadence Allegro PCB/SiP
Mentor Expedition
Agilent Genesys
Cadence Virtuoso
Page 24
Overview EMPro 3D EM Modeling Environment Interactive, Intuitive, Efficient, 3DEM design
Environment Full Wave 3D EM FEM and FDTD
Simulation Technologies Parameterize 3D EM components for
co-simulation & optimization in ADS Transfer ADS Layouts to EMPro for
additional 3D-EM simulation Full scripting (Python) and parameterisation
capability Windows & Linux
Page 25
Overview EMPro Advanced 3D EM Modeling Tools
Revolve
Twist
Draft By Angle Draft By Law
Hole w/wo Draft Hole Special
Chamfer Edges Blend Edges
Shell
Loft Faces
Page 26
Overview New & Enhanced Geometry Building Blocks
• Quickly create common shapes • Easily parameterized and modified from the standard parts tree
New in 2011.02
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Overview New & Enhanced Geometry Building Blocks New in 2011.02
Define endpoints by simply selecting faces on existing geometry
Use standard JEDEC profile, or create custom profiles
Page 28
Overview Material Definition & Assignment • Use materials from the default library, or create your own • Simply drag and drop material definitions onto parts • Support for complex permittivity materials
Page 29
Overview Importing Mechanical CAD files into EMPro New in 2011.02
• EMPro allows import of various industry standard CAD formats
Supported CAD formats
Page 30
Overview Importing PCB Layout files into EMPro New in 2011.02
• EMPro allows import of ODB++ format Data
Page 31
Overview Viewing Simulation Results in EMPro • Standard plots • Advanced field visualisation & animation • Mesh view • Connectivity view
Page 32
Overview Recent EMPro GUI Improvements New in 2011.07
•Toolbars and hotkeys •Fully customizable, dockable, portable
•Cut planes •Easily view internal details •Snap new objects to cut planes
•3D visualization enhancements •3D field strength plots •Maximum field locator
Page 33
Overview Agenda •Why is EM simulation becoming increasingly important?
•Overview of EM simulation technologies
•Integration of EM simulation into practical Design Flows
•Application examples / Demonstrations
•Summary
Page 34 EM Solutions
Overview Short Demo... • EMPro GUI Overview
• Links ADS to EMPro & EMPro to ADS • Links Cadence Allegro to EMPro
•Application Examples
Page 35
Overview Agenda •Why is EM simulation becoming increasingly important?
•Overview of EM simulation technologies
•Integration of EM simulation into practical Design Flows
•Application examples / Demonstrations
•Summary
Page 36
Overview Summary • Agilent EEsof provide access to all three ‘key’ 3D EM Simulation Technologies (MoM, FEM & FDTD)
•Simplifying the design flow and integrating 3D EM modelling with traditional circuit simulation is expanding the possibilities for high frequency circuit analysis
Page 37
Overview Which Solver ? Application characteristic Momentum FEM FDTD
3D planar structures ++ + +
Full 3D structures ‐ ++ ++
High Q ++ ++ ‐
Broadband analysis + + ++
Large number of ports ++ ++ ‐
Frequency dependent materials ++ ++ +
Accurate loss modeling ++ ++ +
Electrically large structures + ‐ ++
Non‐linear materials/components ‐ ‐ ++
Bio‐medical analysis (SAR/HAC) ‐ ‐ ++
TDR analysis, analyzing transition structures ‐ ‐ ++
Problems with high level of material and shape complexity
+ ‐ ++
Low frequency ++ + ‐
Scattering analysis ‐ ‐ ++
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Overview Which Solver ? Application area Momentum FEM FDTD
Planar antennas ++ + +
Planar antenna arrays ++ ‐ +
3D antennas ‐ ++ ++
3D Antenna arrays ‐ + ++
Waveguide ‐ ++ ‐
MMIC ++ ++ ‐
RFIC ++ + ‐
RF board ++ + +
Connectors ‐ ++ ++
Packages + ++ ++
RFID + ++ ‐
SI/PI ++ + +
EMC/EMI ‐ ‐ +
Page 39
Overview Resources Want more info on 3D EM? http://www.agilent.com/find/eesof-empro Video’s, Webcast Recordings, Brochure, Technical Papers…..
5 minute overview video on YouTube
8 page color brochure
March 24 (archived) webcast on 3D EM flow
May 4 (archived) webcast on EM for SI apps
White Paper: “State of the Art EM Software for Microwave Engineers”
IMS 2010 Paper on EM modeling of packages
Author: Daniel G. Swanson Jr. Wolfgang J. R. Hoefer Date: June, 2003 ISBN: 1580533086
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