EM Simulation - Keysight · •64-bit Operating Systems •Multi-core ... OverviewMethod of Moments...

Overview Agenda •Why is EM simulation becoming increasingly important?

•Overview of EM simulation technologies

•Integration of EM simulation into practical Design Flows

•Application examples / Demonstrations

•Summary

Key Driver : Integration •Higher Frequencies

• Traditional closed-form circuit models no longer valid

•Higher Packing Densities • No closed-form models available for particular parts of a design

•Higher Complexity • Mixed Microwave/RF, Analog & Digital often present on the PCB

Agilent E8364B PNA Series Network Analyzer

76 IC’s

14 Modules

Key Driver : Simulation Efficiency Computer Platform

Improvements

Simulation Algorithm Improvements

+

Practical EM Simulations of real world problems

•Adaptive Frequency Sweeps •Quasi Static Solvers •Auto Layout Pre-Processing •Direct Solvers •Iterative Solvers •Adaptive Mesh Refinement •Conformal Meshing •Multi-Threading Support •GPU Acceleration •64-bit support

•64-bit Operating Systems •Multi-core •GPU’s •Relatively low cost

Overview Short Demo... •C-Band Microstrip Hairpin Filter Simulation





•Summary

Overview Generalised EM Simulation Process Objective : To find an approximate solution to Maxwell’s equations that satisfy given boundary conditions and set of initial conditions Key Steps

• Create the Physical Model • Draw/Import Layout Geometry, Assign Materials etc...

• EM Simulation Setup • Define Boundary Conditions, Ports, Simulation Settings etc...

• Perform the EM Simulation • Discretise the physical model into mesh cells and approximate the field/current using a local function (Expansion/Basis function) • Adjust the function coefficients until the boundary conditions are satisfied

• Post-processing • Calculate S-parameters, TDR Response, Antenna Far Field Patterns etc...

Overview EM Simulation Technologies •Method of Moments (MoM) •Finite Element Method (FEM) •Finite Difference Time Domain (FDTD)

FDTD

FEM MoM • 3D Arbitrary Structures • Full Wave EM Simulation • Direct, Iterative Solvers • Frequency Domain EM • Multiport simulation at no additional cost • High Q

• 3D arbitrary structures • Full Wave EM simulations • Handles much larger and complex problems • Time Domain EM • Simulate full size cell phone antennas • EM simulations per each port • GPU based hardware acceleration

• 3D Planar structures • Full Wave and Quasi-Static • Dense & Compressed Solvers • Frequency Domain • Multiport simulation at no

additional cost • High Q

Overview Method of Moments 3D-Planar EM Simulation

3D-Planar, Frequency Domain Preparing a multilayer board / IC:

Interconnect layer(s) divided into planar mesh cells

Surface currents are the unknowns Coupling is modeled by pre-computing

substrate (Green’s functions) Assumes infinite substrate in x-y

direction At a given frequency:

Current in each mesh cell is solved One compressed matrix solve for all

port excitations

Overview Finite Element 3D EM Simulation Full 3D, Frequency Domain

Preparing a 3D structure: Define boundary conditions to truncate

simulation domain Segment the simulation domain using

tetrahedral mesh cells Compute Port modes and use as

excitation for 3D structure Approximate E fields over each

tetrahedron with a polynomial containing unknown coefficients

At a given frequency: E-field at each mesh cell is solved Solve one sparse matrix for all port

excitations to determine unknown polynomial coefficients

Derive the S-parameters

Overview Finite Difference Time Domain Simulation Full 3D, Time Domain Preparing a 3D structure:

Boundary conditions to truncate simulation domain

Segment the simulation domain using hexahedral mesh cells

Complete simulation domain segmented using E and H fields as unknowns

Time stepping algorithm Alternating update of E and H field at

each mesh cell, progressing in time until steady state time domain is reached

No matrix solve Use FFT to obtain broadband S-

parameters

Overview EM Technology Selection MoM

Most efficient for planar, multilayer applications

- IC passives & interconnects - RF PCB interconnects - High-speed PCB signal integrity

analysis - Planar antennas

• FEM, FDTD • Can handle arbitrary 3D geometries ‐ Connectors ‐ Bondwires ‐ Packages ‐ Waveguide ‐ 3D antennas

Planar vs. 3D Geometry

Overview EM Technology Selection Momentum Plus

Effective for complex board High accuracy Frequency domain, so able to handle complex

frequency dependent parameters Effective for large number of ports No approximations to geometry Easy design flow

Minus

3D field patterns require additional computation step

When to use

Complex boards for SI/PI analysis

FDTD Plus

Effective for complex boards High accuracy within approximations

made during meshing Time domain: broadband frequency

responses with one simulation Easy way to plot near fields Easy design flow

Minus

Each port definition is a new simulation Design is approximated during meshing step Frequency dependent parameters require special model

When to use

EMI analysis for boards in combinations with connectors, ESD analysis

Boards with limited number of driving lines

Modelling Complex Boards (Signal & Power Integrity)

Overview EM Technology Selection MoM, FEM

Solves natively in the frequency domain Best for high Q applications

RF / MW Filters Oscillators

FDTD Solves natively in the time domain

Best for TDR analysis Signal Integrity Transitions

Response / Analysis Type

Overview EM Technology Selection Device Complexity / Problem Size FEM

Most efficient for multi-port applications Solves for all ports in a single simulation

Packages Interconnect network

FDTD Most memory efficient for high number of

mesh cells Uses a sequence of direct calculations

instead of a matrix solve Highly parallelized, can take advantage

of GPU acceleration Antenna placement on autos, planes Bio analysis with complex human

body models (e.g., SAR)

Overview Choosing the Right Solver for Your Application

Geometry Type

Planar / Multilayer

3D, Planar+3D

MoM

Response/ Analysis

Type FEM High Q

TDR, EMI, EMC FDTD

Device Complexity/ Problem

Size

Personal Preference

“Which EM Solver Should I Use?”

Broadband

FEM Multi-Port High #

Mesh Cells

FDTD

Moderate Complexity

“I like Time

Domain”

“I like Frequency Domain” FEM FDTD





•Summary

Overview Case Study : 2hrs Data Xfer / Simulation START

ADS Layout Export GDS file Import GDS file

into other 3rd party EM tools

Re-Assign material information

Set up geometry & ports for simulation

Export port locations to a .MSK file

Run custom program to create script file to auto-

generate ports in 3rd party EM tools

Auto-generate Ports

(For complex designs) Run EM simulation for S-parameters

Import S-parameters from EM tool into ADS

Reconnect Ports from EM with other passives and actives for co-simulation and verification

10 min.

30 min.

30 min.

Hours of Simulation

20 min.

10 min.

END

RE

PE

AT

EM Tech file

Duplicate layer infomration ADS

Tech file

Overview Agilent 3D EM Platform Release History

EMPro 2008

FEM Simulator

AMDS

EMDS

EMPro 2009

FDTD Simulator

FDTD Simulator FEM & FDTD Simulators

EMPro 2010 May 2010 EMPro 2010.07 July 2010 EMPro 2011.02 February 2011 EMPro 2011.04 April 2011 EMPro 2011.07 July 2011

January 2010

Overview Agilent EM Simulation Portfolio ADS Platform

FDTD Simulator Finite Difference Time Domain

FEM Simulator Finite Element Method

Momentum Simulator Method of Moments

EMPro Environment Parameterized

3D EM Components

EMDS

ADS Layout Export

Overview 3D EM Component Import Capability Create 3D EM

Component in EMPro Import 3D EM Component

into ADS and place in layout

2D View 3D View

Run FEM simulation of 3D EM Component + Layout in ADS

Add schematic components and run FEM / circuit co-sim

1 2

3 4

Overview Additional Platform Links

AMDS

ADS Platform

FDTD Simulator Finite Difference

Time Domain

FEM Simulator Finite Element Method

Momentum Simulator Method of Moments

EMPro Environment Parameterized

3D EM Components

EMDS

ADS Layout Export

Cadence Allegro PCB/SiP

Mentor Expedition

Agilent Genesys

Cadence Virtuoso

Overview EMPro 3D EM Modeling Environment Interactive, Intuitive, Efficient, 3DEM design

Environment Full Wave 3D EM FEM and FDTD

Simulation Technologies Parameterize 3D EM components for

co-simulation & optimization in ADS Transfer ADS Layouts to EMPro for

additional 3D-EM simulation Full scripting (Python) and parameterisation

capability Windows & Linux

Overview EMPro Advanced 3D EM Modeling Tools

Revolve

Twist

Draft By Angle Draft By Law

Hole w/wo Draft Hole Special

Chamfer Edges Blend Edges

Shell

Loft Faces

Overview New & Enhanced Geometry Building Blocks

• Quickly create common shapes • Easily parameterized and modified from the standard parts tree

New in 2011.02

Overview New & Enhanced Geometry Building Blocks New in 2011.02

Define endpoints by simply selecting faces on existing geometry

Use standard JEDEC profile, or create custom profiles

Overview Material Definition & Assignment • Use materials from the default library, or create your own • Simply drag and drop material definitions onto parts • Support for complex permittivity materials

Overview Importing Mechanical CAD files into EMPro New in 2011.02

• EMPro allows import of various industry standard CAD formats

Supported CAD formats

Overview Importing PCB Layout files into EMPro New in 2011.02

• EMPro allows import of ODB++ format Data

Overview Viewing Simulation Results in EMPro • Standard plots • Advanced field visualisation & animation • Mesh view • Connectivity view

Overview Recent EMPro GUI Improvements New in 2011.07

•Toolbars and hotkeys •Fully customizable, dockable, portable

•Cut planes •Easily view internal details •Snap new objects to cut planes

•3D visualization enhancements •3D field strength plots •Maximum field locator





•Summary

EM Solutions

Overview Short Demo... • EMPro GUI Overview

• Links ADS to EMPro & EMPro to ADS • Links Cadence Allegro to EMPro

•Application Examples





•Summary

Overview Summary • Agilent EEsof provide access to all three ‘key’ 3D EM Simulation Technologies (MoM, FEM & FDTD)

•Simplifying the design flow and integrating 3D EM modelling with traditional circuit simulation is expanding the possibilities for high frequency circuit analysis

Overview Which Solver ? Application characteristic Momentum FEM FDTD

3D planar structures ++ + +

Full 3D structures ‐ ++ ++

High Q ++ ++ ‐

Broadband analysis + + ++

Large number of ports ++ ++ ‐

Frequency dependent materials ++ ++ +

Accurate loss modeling ++ ++ +

Electrically large structures + ‐ ++

Non‐linear materials/components ‐ ‐ ++

Bio‐medical analysis (SAR/HAC) ‐ ‐ ++

TDR analysis, analyzing transition structures ‐ ‐ ++

Problems with high level of material and shape complexity

+ ‐ ++

Low frequency ++ + ‐

Scattering analysis ‐ ‐ ++

Overview Which Solver ? Application area Momentum FEM FDTD

Planar antennas ++ + +

Planar antenna arrays ++ ‐ +

3D antennas ‐ ++ ++

3D Antenna arrays ‐ + ++

Waveguide ‐ ++ ‐

MMIC ++ ++ ‐

RFIC ++ + ‐

RF board ++ + +

Connectors ‐ ++ ++

Packages + ++ ++

RFID + ++ ‐

SI/PI ++ + +

EMC/EMI ‐ ‐ +

Overview Resources Want more info on 3D EM? http://www.agilent.com/find/eesof-empro Video’s, Webcast Recordings, Brochure, Technical Papers…..

5 minute overview video on YouTube

8 page color brochure

March 24 (archived) webcast on 3D EM flow

May 4 (archived) webcast on EM for SI apps

White Paper: “State of the Art EM Software for Microwave Engineers”

IMS 2010 Paper on EM modeling of packages

Author: Daniel G. Swanson Jr. Wolfgang J. R. Hoefer Date: June, 2003 ISBN: 1580533086

http://www.agilent.com/find/eesof-empro�



EM Simulation - Keysight · •64-bit Operating Systems •Multi-core ... OverviewMethod of Moments...

Documents

Transcript of EM Simulation - Keysight · •64-bit Operating Systems •Multi-core ... OverviewMethod of Moments...