Www.techwise-circuits.com Techwise (Macao Commercial Offshore) Circuits Ltd. (Member of Kingboard...

www.techwise-circuits.com

Techwise (Macao Commercial Offshore) Circuits Ltd.(Member of Kingboard Chemical Holdings Ltd.)

Techwise Circuits

Company Profile

Customer Satisfaction is Always Our First Priority!

Date: Feb 2014



• Established in 1994• Net sales in 2013 : USD 215 Million

• Total investment over USD 200 Million

• 3 factories in Guang Dong, China

• 5,000 employees

• Strong financial support as subsidiary of Kingboard Chemical Holdings Ltd.– Founded in 1988 – HK listed since 1993 (code: 0148)

Background



Kingboard The World Biggest Laminate Supplier



Top 15 PCB Shops Sales Tunover Ranking 2012

Rank PCB Makers Sales Turnover1 Nippon Mektron 2,8882 Unimicron 2,3833 SEMCO 2,0024 Young Poong Group 2,0005 Ibiden 1,9246 Zhen Ding Technology 1,8817 Tripod 1,3268 TTM Technologies 1,3109 Sumitomo Denko 1,219

10 Daeduck Group 1,14711 HannStar Board (GBM) 1,11212 Viasystems 1,08013 Nanya PCB 1,00714 Kingboard PCB Group 93515 CMK Corporation 908

Million dollar NT information 2013-Q2



Start production capacity in Techwise to 230ksq.ft/month

Acquire ISO9002 and UL certification

1996

Establish Techwise in Huiyang (1st facility)

1994

Expanded Capaticity to 700ksq.ft/Month

Acquire QS9000 and ISO 14000 certificate

2000

Set up Fogang factory (TSF, 2nd facility)

2001

Acquired by Kingboard Chemical Holding Ltd.

2002

Acquire TS16949: 2002

certificate

2005

Implementation of 5S Mgmt system

2006

Set up the 2nd Fogang factory (FTC, 3rd facility)

2007

Adjust Drilling layout to smooth inner & outer layers process in Huiyang factory

2011

Investment US$5 million

for new machines and

re-layout

2013

20 Years Experience

Investment US$5 million for new machines and sewage treatment system

2014



Factory Locations Fo Gang (FTC.TSF). Hui Yang(HTT)

Hong Kong香港

Hui Yang惠阳区

70KM

230KM

2nd Factory Fo Gang(TSF)3.5H drive from HK1.5H drive from Guangzhou airport

3rd Factory FoGang (FTC)3.5H drive from HK1.5H drive from Guangzhou airport

Head Quarters 1st Factory Hui Yang (HTT)1.5H drive from HK3H drive from Guangzhou



Head Quarters of Techwise

• HDI Capability• Back Drilling capability• Factory Area: 53,000 ㎡ • Number of worker: 1,700• Outer capacity: 80,000 ㎡ /month

• Layer count: 2-28L• Surface finish-HAL, LF HAL, Imm Tin, OSP• Imm Gold, Flash Gold, Dip Tank Hard Gold / Soft Gold• ISO 9002/QS 9000/TS 16949/ISO 14001/ UL 796/CQC

Hui Yang Factory (1st Factory)



• Target to high volume project• Factory sets up on 2001• Factory Area: 38,000 ㎡ • Number of Worker: 1,700• Outer capacity: 110,000 ㎡ /month

• Layer count: 2-6L

• Surface finish: HAL, LF HAL, • Imm Tin/ Silver/ Gold• Dip tank Hard/Soft Gold/OSP

• ISO 9002/ QS9000/ TS16949/ ISO14001/ UL796/CQC

Fo Gang Factory (2nd Factory)



• Factory sets up in 2007• Factory Area: 38,000 ㎡ • High level of Automation• Room for further ramp up in capacity

• Number of Worker: 1,600• Outer capacity: 80,000 ㎡ / month

• Layer count: 2-18L

• Surface finish: OSP, Imm. Gold, Imm.Tin, Dip Tank Hard Gold

• ISO 9002/QS 9000/TS16949/ISO14001/ UL 796/CQC

Fo Gang (3rd Factory)



Workforce

Management 50

Sales & Customer Service 50

Engineering 600

Quality (QC & QA Engineer ) 900

Production 3,000

Administration 400

Total 5,000



G.M.O.

Managing Director

Stephanie Cheung

Vice President Edmond Chan

Sales & Marketing

Vice President

Edmond Chan

Sales Director

Jacky Yau

MPC & Shipping

Quality Assurance Director

J.M. Huang

Managing Director

Stephanie Cheung

Manufacturing Plant General

Manager

H.B. Shang (FTC)


Manager

P.S. Lau (HTT)


Manager

J.C. Chen (TSF)

Finance & Accounting / MIS Director Solo So

Purchasing Manager 　　　　

Tracy Guo

Personnel & Administration

Organization Chart



210

2436

45

70

100

8596 98

125

146

192

215

231

180

210 215 210215

225

0

25

50

75

100

125

150

175

200

225

250

USD

Million

1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014

Annual Sales Turnover (USD Million)

Forecast in

2014



500

700

1,000 1,000

1,180

1,5001,600

1,800

2,0002,100

2,250 2,250

2,500

2,700 2,700 2,700

0

500

1000

1500

2000

2500

3000

1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014

2,700Ksqft/Month

Monthly Capacity



Location Distribution

Data from the sales turnover in 2013



Layer Count Distribution

Data from the delivery area in 2013



Market and Location distribution

Data from the sales turnover in 2013



18

• Sensor

• Body Electronics

• Engine Starter

• Meter

• GPS

• Car multimedia

• Air bag

• ABS

Automotive



• Printer

• Scanner

• Set top box

• Education products

• Lifestyle white goods

19

Consumer



• Electronics Meter

• Insulin Paradigm

• X-Ray Machine

• Elevator

• Train Black Box

• Control unit

• Blood Pressure

20

Industrial and Medical



World Class Customers in Diverse Markets

Automotive

Consumer

Industrial/Instrumentation/Medical

EMS

http://www.flextronics.com/default.aspx



Product Capability 2014

Feature (Mass Production) -

Layer 1~28 Layers

Impedance Control ±8%

Copper Thickness 1 (oz) to 4 (oz)

Minimum Core Thickness 3.0 mil (Not including copper)

Board Thickness 16~240 mil

Copper Clad Laminate

FR4 (Tg 130,140,150,170oC), filled or unfilled,

Halogen Free, CEM-3, PTFE, Rogers, Aluminum based

Special processBlind and Buried via, Sequential Lamination, Aluminum Heat-sink

Inner Imaging

Min. Line / Space 3 mil / 3 mil



Feature (Mass Production) -

Plating Hole

Min. Hole Size 6 mil (drill)

Aspect Ratio (max)

10:1

Micro via

Min Hole Size 3 mil

Aspect Ratio (max)

1:1

Outer Imaging Min. LW/ LS 3 mil / 3 mil

Surface Finish

HAL ,HAL-Lead Free, OSPElectrolytic Gold Plating, Immersion Gold /Tin /Silver, Gold finger Plating, Flash Gold, Peel-able Mask

PressingThickness Tolerance ≤7%

Wrap / Twist ≤0.75%

Product Capability 2014



RoHS Green Program

Rohs Finishing Options• Flash Gold, OSP / Entek• Electroless Ni Immersion Au• Immersion Tin / Silver • Lead Free HAL

24



Laminate Cutting

Inner Dry Film

Brown Oxide

Inner Middle Inspection

IQC

OrderCAD/CAM

Packing

Shipping Audit

Inner Etching

Pressing

Plating Through Hole

Drilling

Outer Dry Film

Pattern Plating

Etching

Outer Middle Inspection

Solder Mask

Component Mark

I/G,G/F,F/G,HAL

V-Cut,Punching,Routing

E-Test

FQC

I/S,Entek/OSP

Final Audit

Manufacturing Process

Inner layer process Outer layer process

Shipping



Thank you very much!

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