WELCOME 4th Optical Interconnect in Data Centers EU-Symposium · PhoxTroT Vision Keywords:...
Transcript of WELCOME 4th Optical Interconnect in Data Centers EU-Symposium · PhoxTroT Vision Keywords:...
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This project has received funding from the European Union’s Seventh Framework Programme for research, technological development and demonstration under grant agreement no 318240.
PhoxTroT - 4th Symposium on Optical Interconnect in Data Centers, ECOC 2016, Düsseldorf, Germany, 18. September 2016
WELCOME 4th Optical Interconnect in Data Centers EU-Symposium
Tolga Tekin, Fraunhofer IZM / TU Berlin, Germany
Richard Pitwon, Seagate, United Kingdom
Nikos Pleros , AUTH, Greece
Emmanouel Varvarigos , CTI ‘Diophantus’, Greece
Dimitris Apostolopoulos , ICCS / NTUA, Greece
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Thanks to
ECOC 2016 General Chairs Ronald Freund, Fraunhofer Heinrich Hertz Institute, Berlin Matthias Berger, Alcatel-Lucent, Nürnberg
ECOC 2016 Technical Program Chairs Peter Krummrich, Technische Universität Dortmund Christian Schaeffer, Helmut Schmidt Universität
ECOC 2016 Local Organis ing Committee Volker Schanz, VDE ITG, Frankfurt Hatice Altintas, VDE Conference Services, Frankfurt
for their kind support!
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4th Optical Interconnect in Data Centers EU-Symposium
09:10 WELCOME by PhoxTroT
09:30 - 11:10 Session 1: THE END-USER PERSPECTIVE
11:30 - 13:30 Session 2: BRINGING TECHNOLOGY TO MARKET - I
14:30 - 16:30 Session 3: BRINGING TECHNOLOGY TO MARKET - II
16:50 - 18:30 Session 4: WHAT COMES NEXT?
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Revolutionizing the Data Centers and HPCs - Optical Interconnects
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PhoxTroT - A Large-Scale Integrating Project
PhoxTroT is a large-scale European research effort focusing on
high-performance,
low-energy,
low-cost,
small-size
optical interconnects across the different hierarchy levels in Data Center and High-Performance Computing Systems:
on-board,
board-to-board and
rack-to-rack.
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PhoxTroT brings together the major European industrial and research players in the field.
Fraunhofer IZM (DE)
Fraunhofer HHI (DE)
Vertilas GmbH (DE)
Seagate (UK)
ams AG (AT)
TTM Technologies (HK)
AMO GmbH (DE)
ICCS/NTUA (EL)
DAS Photonics SL (ES)
Phoenix BV (NL)
CERTH (EL)
Compass EOS Ltd (IL)
Bright Photonics BV (NL)
CTI (EL)
CNRS-UB (FR)
CNRS-LPN (FR)
KIT (DE)
SDU (DK)
UPVLC (ES)
IMEC (BE)
TE Connectivity (NL)
AUTH (EL)
Mellanox (IL)
PhoxTroT - Consortium
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PhoxTroT‘s Mission
To streamline the synergistic evolution of the entire technology portfolio towards cost‐ and energy‐efficient Tb/s‐scale chip‐to‐chip, board‐to‐board and rack‐to‐rack level device development. PhoxTroT aims to generate the necessary energy and cost‐efficiency factors through breakthrough component level advances and through mastering the different technology platform design- and process-level requirements into a coherent methodology for optochip, optical PCB and Active Optical Cable fabrication.
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PhoxTroT’s Holistic Approach
PhoxTroT tackles optical interconnects in a holistic way, synergizing the different technology platforms in order to deploy the optimal "mix & match" technology and tailor this to each interconnect layer.
Plasmonics
Si Photonics
III-V CMOS
electronics
Glass
PICs
Transceivers
Switches & Routers
PCBs
Interfaces
Polymers
Glass
Si Photonics
CMOS electronics
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PhoxTroT’s Ecosystem
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Architecture
Architectural studies for on-board, board-to-board, and system-level hierarchies, based on specifications of the building-blocks developed in PhoxTroT.
Development of Automatic Topology Design tool to aid architecture design.
Layouts of interconnection network topologies on OPCBs.
Calculations of required area, worst case losses.
Executed 3 HPC applications on HellasGrid cluster. Traffic monitored and analyzed.
Collected traffic patterns of HPC and Data Centers applications (literature review).
To Backplane
Backplane
Waveguides
AOC
Backplane slot
Board
System
Processor chip
Router
CTI, CERTH
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Mask Generator
Designer
Design Kit
Foundry
Circuit Simulator Physical Simulations
Design Kits for Optical Interconnects PHOENIX, BP
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90-deg bends
Splitters Over crossings
Straight lines Cascaded
bends Straight lines
Multi-Mode Optical/Electrical PCB Development
Multimode polymer waveguide process compatible with panel-scale HLC PCBs developed and demonstrated – TTM
Process for single-layer polymer WG PCBs supporting 300x350mm form factor on rigid MLB PCBs established. Scaling to dual-optical layer construction on going
Multimode O/E PCB test bed (4L+1Opt) with multiple passive components completed.– SEA, CEOS, TTM
Optical mid-board interface by 90° MLA (micro lenses) for chip-to-board I/O and board-edge connectors for WG-to-MMF
Demonstrator 1 (16L+ 1Opt w/ CMOS) CEOS, TTM
Multimode PCB @ 16” 20”Panel Product form factor test bed
Coupling interface verification
Demonstrator 1
TTM, CEOS, SEA
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Single-Mode Optical PCB Development
SM optical PCB process flow
Laser dicing & optical cut-outs
Two step ion-exchange process
Thin film mask on glass
PCB embedding
Propagation loss = 0.1dB/cm
SM chip-to-board coupling interface
IZM
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Electronic VCSEL Driver and TIA Circuits Development
IMEC
40Gb/s NRZ VCSEL driver
Optimized for Vertilas’ single-mode VCSELs
Clockless feedforward equalizer
40Gb/s NRZ Transimpedance Amplifier
Compatible with HHI’s photodiodes
Gain control and limiting output
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VCSEL Development VERTILAS
Short-cavity VCSELs with 1550 nm wavelength developed and manufactured
Optical output power up to 4mW (20°C) and >1.5 mW (80°C)
Modulation bandwidth up to 14 GHz (20°C) and >10 GHz (80°C)
Limited by parasitic capacitance – intrinsic bandwidth >25 GHz (@ 20°C)
25 Gb/s eye (100 Gigabit Ethernet) with 4.5 dB extinction ratio
Optimization of capacitance/bandwidth for next device generation
56 GHz operation
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Two EO switch. mechanisms: Carrier Depletion Silicon Organic Hybrid
Two fundamental 2x2 switches
Add/Drop Rings MZIs Circuit level simulation tool confirmed with passive rings
4x4 non-blocking matrix Design optimization on circuit level
DAS, CERTH, UPVLC EO Router: SOI based 4x4 Non-Blocking Switching Matrix
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Hybrid active high-Q cavities by nanostructuring SOI and exploiting III-V gain
Hybrid InP on SOI Electrically-Pumped Nanolasers for AOC
LPN, AMO
Hybrid cavity with Q>105
Design, III-V growth & processing and optical characterization @LPN
SOI Nanobeam cavity fabricated @AMO
1540 1550 1560 1570 1580-30
-20
-10
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Emission spectra at 150 µA
Norm
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dB
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Wavelength (nm)
CW - RT
I = 150 µA
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16QAM at 40 GBd
Korn, D., et al., Optics Express 21, 2013
Silicon-Organic Hybrid (SOH) Modulators
High-speed electro-optic modulators: SOI slot waveguide + EO organic material
Enabling complex modulation formats
Further Application:
SOH modulator-based flat comb generation
Spectral flatness of 7 lines within 2 dB
Transmission of an aggregate data rate >1Tbs of 784 Gbit/s
KIT, AMO
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Optical TSVs Electrical TSV
TSV serve as enabler for interposers with data exchange between backside and frontside
AMS, IZM Optical Interposer & Through Vias
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TSV as enabler for interposers with data exchange between backside and frontside
Electrical TSV: R= 0.43 Ohm / C= 3.5 pF
Cut off frequency fc = 1/2PRC = 100GHz
Optical TSV: parallel processing of electrical and optical
TSVs: differentiation by metal mask
Removal of TSV bottom metallization
80µm TSV technology
TSV depth:
200µm
TSV depth:
50µm
Further improvement by
reducing the TSV depth
to 100µm and 50µm
AMS, IZM Optical Interposer & Through Vias
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Plasmonic Arc Waveguide based Chip-to-Board Interconnect
FOWG polymer cladding
100 µm pitch
Au strips (15nm x 10µm)
Cross-section of a plasmonic arc waveguide
The plasmonic arc waveguide is based on a long-range surface plasmon polariton propagation mode
FABRICATION CHARACTERIZATION
Flexibility of the plasmonic arc
waveguide
Insertion loss 0.4dB/mm
UB, SDU
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Fiber-to-fiber coupling set-up
~ 2mm
LR-SPP waveguide
Bending loss calculations
Out of plane 90 degree bend
Light coupled to the waveguide
Simulation performed at 1550 nm wavelength
UB, SDU Development of Flexible Long-Range Plasmonic Waveguide for Chip Interconnects
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A Technology Demonstration of the First Fully Optically Interconnected 2U24 OneStor™ Data Storage Platform
XR
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Demonstrator board with 2 optical router chips communicating via WG arrays
WG automated scans
CEOS, TTM, IZM Technology Demonstration with Router
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Rx
Tx
Rx Tx
Active Optical Cable TE, IZM
Demonstration of Active Optical Cable 1.28Tb/s 16QAM modulation format
Integration and packaging of Tx and Rx 40Gbaud chips into zQSFP connector format
Demonstrator concepts identified, 1st demonstrator uses 4PAM modulation, 2nd demonstrator uses 16QAM modulation
Roadmap and timeline defined for active optical cable demonstrators
Concept for power budget and power consumption defined
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4th Optical Interconnect in Data Centers EU-Symposium
SESSION 1: THE END-USER PERSPECTIVE
Chair: Dimitris Apostolopoulos
09:30 Richard Pitwon, Seagate Advances in photonic interconnect for data centre subsystems
09:50 Katharine Schmidtke, Facebook ….
10:10 Elad Mentovich, Mellanox PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity Flex OTN
10:30 Bert Offrein, IBM Research System and Device-level Integration Trends of Optical Interconnects in Data Centres
10:50 ROUND TABLE DISCUSSION
11:10 – 11:30 COFFEE BREAK
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4th Optical Interconnect in Data Centers EU-Symposium
SESSION 2: BRINGING TECHNOLOGY TO MARKET - I
Chair: Richard Pitwon
11:30 Marika Immonen, TTM Technologies Optical PCB Technology for In-Chassis Interconnects – H-V Fabricator’s View
11:50 Joni Mellin, ams ams and Silicon Photonics - From Research to Business
12:10 Susannah Heck, Kaiam Embracing diversity: hybrid integration for data center optics
12:30 Kazuhiko Kurata, PETRA Chip scale optical transceiver "optical I/O core" based on silicon photonics platform
12:50 Lê Nguyên Bình, Huawei Technologies Düsseldorf PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access
Ultra- High Capacity Flex OTN
13:10 ROUND TABLE DISCUSSION
13:30 – 14:30 LUNCH BREAK
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4th Optical Interconnect in Data Centers EU-Symposium
SESSION 3: BRINGING TECHNOLOGY TO MARKET - II
Chair: Nikos Pleros
14:30 Hideyuki Nasu, Furukawa VCSEL based solderable optical modules
14:50 Charles Baudot, ST Micro Addressing future trends in integrated silicon photonics
15:10 Felix Betschon, Variooptics Bringing EOCB’s to the market - what’s missing?
15:30 Peter De Dobbelaere, Luxtera Silicon photonics transceivers for hyper-scale datacenters: Deployment and roadmap
15:50 Takaaki Ishigure, Keio University High bandwidth density 3-D optical wiring realized with the Mosquito method
16:10 ROUND TABLE DISCUSSION
16:30 – 16:50 COFFEE BREAK
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4th Optical Interconnect in Data Centers EU-Symposium
SESSION 4: WHAT COMES NEXT?
Chair: Andreas Hakansson
16:50 Paraskevas Bakopoulos , National TU Athens Optical switching for scalable and programmable data center networks
17:10 Huiyun Liu, UCL First practical III-V quantum-dot lasers monolithically grown on silicon
for silicon photonics
17:30 Mohamed Sufyan Is lim, University of Edinburgh LiFi: Making Fiber Wireless
17:50 Anna Lena Giesecke, AMO GmbH Photonic Integrated Circuits for PhoxTroT: Advances in Lithographic Fabrication Techniques
18:10 ROUND TABLE DISCUSSION
18:30 END of Symposium
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4th Optical Interconnect in Data Centers EU-Symposium
09:10 WELCOME by PhoxTroT Tolga Tekin
09:30 - 11:10 Session 1: THE END-USER PERSPECTIVE
Chair: Dimitris Apostolopoulos Speakers: Richard Pitwon, Katharine Schmidtke, Elad Mentovich, Bert Offrein
11:30 - 13:30 Session 2: BRINGING TECHNOLOGY TO MARKET – I
Chair: Richard Pitwon Speakers: Marika Immonen, Joni Mellin, Susannah Heck, Kazuhiko Kurata, Lê Nguyên Bình
14:30 - 16:30 Session 3: BRINGING TECHNOLOGY TO MARKET - II
Chair: Nikos Pleros Speakers: Hideyuki Nasu, Charles Baudot, Felix Betschon, Peter De Dobbelaere, Takaaki Ishigure
16:50 - 18:30 Session 4: WHAT COMES NEXT?
Chair: Andreas Hakansson Speakers: Paraskevas Bakopoulos, Huiyun Liu, Mohamed Sufyan Islim, Anna Lena Giesecke,