W. Albert Gu,

2August, 2020 Analog Power Conversion LLC

W. Albert Gu, Ph.D., President & CEO

BSNE – National Tsing Hua U. (Taiwan); MSNE – U. of New Mexico; Ph.D. Engr. – Kansas State U.

Microsemi, TriQuint, Motorola, Sandia National Lab

Co-Founder of GCT (GaAs Foundry merged with WIN Semiconductor, Taiwan, in 2003)

30+ Years in RF Application Engineering with 15 Issued US Patents

Dumitru G. Sdrulla, CTO

BSEE & MSEE – Polytechnic Institute of Bucharest, Romania

Microchip/Microsemi/APT, IPRS-Baneasa (Bucharest), ICCE-Baneasa (Bucharest)

Key Technologist behind APT/Microsemi’s MOSFET, IGBT, RF MOSFET and SiC MOSFET & SBD

40+ Years in Power Device Design and Fabrication with 13 Issued US Patents & NumerousPublications and Foreign Patents

Sam S. Ochi, SVP – Driver Chain

BSEE & MSEE – University of California at Berkeley, CA

Microsemi, IXYS, Analog Devices, Maxim Integrated Products

Co-Founder of Maxim Integrated Products, and Leading Expert in Analog & Mixed-Signal IC Designspecializes in Driver IC Design for WBG Power Devices and Switch-Mode Full-Bridge Modules

40+ Years in Analog & Mixed-Signal IC Design with 31 Issued US Patents & Numerous Publications


Amaury Gendron-Hansen, Ph.D., Technical Lead – SiC

BSEE –College of Engineering, Supélec; MSEE –University of Paris; Ph.D. Microelectronics.– Univ. Paul Sabatier, Toulouse (All in France)

Microsemi/Microchip, GlobalFoundries, Freescale Semiconductor

Leading Expert in Power Device Design & Fabrication, Specializes in 4H-SiC & TCAD Simulations

15+ Years in Power Electronics and ESD Protection with 14 Issued US Patents & Numerous Publications

Les Szepesi, Technical Lead – Silicon

BSEE & MSEE – Massachusetts Institute of Technology, Cambridge, MA

Microsemi, Avago Technologies, Hewlett-Packard, FLIR Systems, Spacelabs, John Fluke Mfg.

Leading Expert in Si and SiC Devices Design & Fabrication including MOSFET, LDMOS, CMOS & HEMT

35+ Years in Electronics Design & Fabrication with 6 Issued US Patents & numerous Publications

Kamrul Russel, Ph.D., PE, Technical Lead – Thermal/Packaging

BSME – Bangladesh Univ. of Eng. and Tech.; MASc & Ph.D. – McMaster Univ., Hamilton, ON Canada

Christie Digital Systems Inc., Cinnos Mission Critical Inc., SmallPC

Leading Expert in Structural & Thermal Simulations, and Packaging & Assembly of Electronic Devices

12+ Years in Thermal/Fluidic/Mechanical Design & Modeling with 9 Peer-Reviewed Journal Publications


Silvaco – TCAD Device Design Tool

Victory OMNI 2D – All Silvaco TCAD Tools: Device, Process, Meshing, Solid Modeling, Pre & Post- Processing, Virtual Wafer Fab, Parasitic Extraction,

DeckBuild – TCAD Input Deck and Runtime Environment

TonyPlot – TCAD Visualization Tools

Maskview – TCAD Layout Tools

Cadence –Analog, Mixed-Signal IC Design Tools

Spectre Accelerated Parallel Simulator (APS) – Circuit-, Block- & System-Level SimulationTools at 5X Speed

Virtuoso ADE Explore – Circuit Simulator & Testbench, Parametric, Corners, and MonteCarlo Analyses

Virtuoso Schematic Editor – Multi-Sheet & hierarchical Design Entries at 5X Speed,Comprehensive Component Libraries, and Sophisticated Wire-Routing Capabilities

Virtuoso Layout Suite,

Assura Design Rule Checker (DRC)

Assura Layout vs. Schematic Verifier (LVS)

Analog Power Conversion LLC 52020

ANSYS – Multi-Physics Design ToolsStructural & Fluids Bundle– ANSYS Mechanical Enterprise: AIM Standard, Composite PrepPost, Fatigue Module,

SpaceClaim Direct Modeler, DesignXplorer, Rigid Body Dynamics– ANSYS CFD Enterprise: Fluent AND ANSYS CFX, PolyFlow, AIM Standard, DesignXplorer

SpaceClaim Direct Modeler, DesignXplorer, Chemkin Pro and FORTE

Electromagnetics BundleANSYS Alinks for EDA, ALinks for MCAD, ALinks for MCAD Parasolid, Distributed Solve

(DSO), Electronics HPC Pack, Electronics Desktop, HFSS (Includes EMIT & Savant), HFSS-IE Solver, HFSS-TR Solver, HFSS SBR+Solver, RF Option, SI Option, Icepak,DesignModeler 2, Maxwell 3D (Includes RMxprt PExprt), Optimetrics (For HFSS,Q3D Extractor, Maxwell), Q3D Extractor, Simplorer Advanced, ANSYS Siwave,SpaceClaim Direct Modeler

Other Design ToolsSolidWorks – Solid Modeling & CAD Tools

MathCAD – Engineering Calculation Tools

SPICE – General-Purpose Analog Circuit Simulator Tools

ADS – RF/Microwave Circuit Simulator (To be Acquired in 2021)


SiCAMORE Semi (Bend, Oregon)

SiC MOSFET and Schottky Barrier Diode

Silicon MOSFET, IGBT, FRED Diode

RF Silicon VDMOS with Al and Plated-Au Metallization

Radiation-Hardened Semiconductor Device

Episil Technologies Inc. (Taiwan)


Silicon MOSFET, IGBT, Super-Junction MOSFET, FRED Diodes

GaN FET

X-FAB Semiconductor Foundries (Lubbock, Texas)

Silicon Analog IC

Silicon-on-Insulator (SOI) Analog IC



APC’s Core Businesses are in Power Devices for RF &

Microwave Applications

APC’s Wide Expertise ( >160 Years, Combined) Spans:

Silicon – SBD, FRED, MOSFET, IGBT and Super-Junction MOSFET

SiC – SBD, MOSFET and MOSFET with Integrated SBD

Gate Driver IC for Si and Wide-Bandgap Semiconductor (SiC & GaN) Devices

Radiation-Hardened Semiconductor Devices

APC Has No Intention and/or Plan to Get into Switching

Power Electronic Businesses (Switching Speed < 500 kHz)

APC Only Offers Design Services to Customers of Switching

Devices for Non-RF&Microwave Applications

APC Never Competes against Its Design-Service Customers


Deep Knowledge on IP Landscape by Incumbents

APC’s Own IPs Offer to Design-Service Customers

Peace of Mind – Free from IP Infringement Concerns

APC Combined Design Experiences > 160 Years

Established Relationships with Wafer Foundries

Leveraging Economy-of-Scale in APC’s Supply Chain

Leveraging APC’s Deep Knowledge on Marketing in

Power Electronics

Leveraging APC’s Deep Knowledge on Long-Term

Reliability and Failure Analyses


Complete Ownership Model

Complete Design Ownership

Unlimited Global Marketing and Sales

Upfront Payments Include:

1) Design Service Fees and

2) Portion of (Forecasted) Future Profits

Higher Upfront Payments, Lower Overall Costs over Product’s Lifetime

Revenue Sharing Model

Partial Design Ownership with Royalties Levied on Product Sales

Revenue Sharing for 3 Years after Product Launch

Unlimited Global Marketing and Sales

Upfront Payment Covering Design Service Fees Only

Lower Upfront Payments, Higher Overall Costs over Product’s Lifetime


OTSSign-off

(1 wk)OTS – Objective Target

Specifications

Design Cycle (1)Design ➔ TCAD ➔ Design ➔ Tape-Preview Model Review out

(8 to 12 wks)

Wafer (1)Fabrication

(12 to 16 wks)

Evaluation (1)(2 wks)

Design Cycle (2)Design ➔ TCAD ➔ Design ➔ Tape-outPreview Model Review

(2 to 4 wks)

Wafer (2)Fabrication

(10 to 14 wks)

Packaging (1)

(4 wks)

Packaging (2)

(4 wks)

Evaluation (2)(2 wks)

Final DesignReview & Report

(1 wk)

Product Qualification& 1K Hour Burn-in

(12 wks)

Pilot ProductionWafer Fab & Packaging

(16 wks)

Production ReadinessBOM & Logistics Transfer

(2 wks)

QualificationReport

(2 wks)

After-SaleSupports


APC Also Offer Design Services for Scientific, Academic and Exploratory

Endeavors

Proof-of-Concept Design Service Includes

Joint Efforts in Determination of the Target Specifications

Single Pass Design Cycle on a Best-Effort Basis

Single Design Pass Consists of 1) TCAD Model, 2) SPICE Circuit Simulation, 3) Design Tape out,

4) Wafer Fabrication via Foundry Partner, 5) Die-Level Evaluation, 6) Device Packaging via

Assembly Partner, 7) Package-Level Evaluation, and 8) Delivery of Engineering Samples along

with Test Results

Sole Ownership of Intellectual Properties Results Independently from

APC Design Efforts

Joint Ownership of Intellectual Properties Results from Collaborative

Efforts between the Two Parties

Flexible Pricing Model

Fixed Design Fees Including Testing/Evaluation Ranges from $50K to $250K USD

Direct Transfer of Wafer Foundry and Packaging/Assembly Costs with 5% Surcharge asProcessing Fees


APC Headquarter1320 SE Armour Road, Unit B-2,Bend, OR 97702USA

W. Albert Gu, President & CEO

Email: [email protected]: +1 (541) 668-5833

Dumitru G. Sdrulla, CTO


Sam S. Ochi, SVP


W. Albert Gu,

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