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    SIiVIULATION OF SEiVIICONDUCTOR DEVICES AND PROCESSES Vol.

    6

    Edited

    by H. Ryssel P.

    Pichler September

    1995

    A M ethod for Extra cting th e Threshold Voltage

    of M O SF E T s Based on Current Components

    K. AOYAMA

    NTT LSI Laboratories,

    3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa Pref., 243-01 JAPAN

    Abstract

    A new method for extracting the threshold voltage of MOSFETs is presented.

    The threshold voltage is the gate voltage at which the second difference of the

    logarithm of the drain current takes a minimum value. The method is applied to

    a 0.6-pm NMOSFET. The threshold voltage characteristics are compared with

    ones measured with previous methods and it is shown that the proposed method

    overcomes previous problems. The threshold voltage is extracted based on a

    physical background verified with 2D device simulation and shows a transition

    voltage at which drift and diffusion components in the drain current are equal.

    1. Introduction

    A serious problem is that threshold voltage definitions in measurements differ from

    the one in compact MOSFET models. The threshold voltage in compact models is

    defined as the gate voltage at which the surface potential 4 f the channel reaches

    the double Fermi potential in the bulk 2d f. This definition is very popular but has the

    disadvantages tha t the position where 4 2dj in the channel is not clear and it is

    difficult to measure

    4

    in MOSFETs. On the other hand, threshold voltages in mea-

    surements are extracted by the constant current CC) , the linear extrapolation LE)

    and the transconductance change TC ) methods [ I], [2]. With

    C C

    the difficulties are

    measuring the effective channel length and width and defining

    a.

    constant value of the

    drain current. LE should be applied only in the low drain voltage region. In the high

    drain voltage region, however, the square root of current extrapolation SRE) should

    be applied. With extrapolation methods such as LE and SRE, th e continuity in all

    operation voltages is lost. The threshold voltage characteristics with T C are strange

    for drain voltage changes, as shown in Fig. 1. A threshold voltage definition th at

    overcomes the above disadvantages is needed. This paper presents a new method for

    extracting the threshold voltage: the second difference of the logarithm of the drain

    current minimum SDLM).

    2.

    Method

    The diffusion component and the drift component can be respectively approximated

    by an exponential function and a polynomial expression, as shown in Fig. 2. The

    first difference of the logarithm of the drain current almost stays constant when

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    K. Aoyam a: Method for Extra cting the Threshold Voltage of MO SFET s

    119

    th e diffusion comp onent is domin ant and grad ually app ro acl~ es ero when th e drift

    comp onent is dom inant, as shown in Fig. 3 (a) . Fig.

    3

    ( b ) s.hows the second difference

    takes a minim um value at th e unique transition voltage in an N M OS FE T. In this work,

    this voltage is defined as the thresh old voltage. Th is threshold voltage is shown in

    Fig. 1 for various drain voltages com pared to ones extrac ted w ith previous meth ods .

    Th e characteristics are reasonable even for drain voltage changes.

    3 Verification

    With a view to certify that the dominant component in the drain current changes

    from diffusion to drift at the threshold voltage extracted with the above method, the

    rate of each comp onent was calculated by 2D device simulation. In the sim ulation , an

    NM OSFET wi th L 1.Opm was used w ith Vd, 3.OV an d sb OV. As a result, the

    min imu m value is calculated with this meth od a s shown in Fig.

    4

    like in measu rem ents

    and the po tent ia l dis tr ibutions a t the interfaceof Si and SiOz obta ined are those shown

    in Fig. 5. T he drift comp onent and diffusion conlponent [id s(d ij/)] re

    where is th e electron mobility,

    n

    is th e electron density, is th e cond uction band

    potent ia l ,

    4

    [, is the relative potential an d

    [

    is the electron q uasi-Fermi potential.

    At each position at the interface, the rates of drift and diffusion compete with the

    rates of (d$ /dx) and

    [-d(

    ,)/dx]. Fig.

    6

    shows the distribu tion of the r ate of

    current com ponents throu gh t he channel. T he average rate of th e drift compo nent in

    th e channel region is

    where x, and xd ar e the source edge an d th e drain edge and

    L

    is t h e channel length.

    Fig.

    7

    shows the rate of the drift component in the channel increases as the gate

    voltage increases. At

    V

    0.215V, drift equals diffusion. The refore , the threshold

    voltage defined with this m ethod shows th e unique gate voltage th at is the trans ition

    voltage in the dom inant com ponent in th e dra in current .

    4.

    Summary

    A method for extracting the threshold voltage with the second difference of the loga-

    rithm of the drain current was proposed and verified from the physical point of view

    using 2D device sim ulation. Th e ex trac ted threshold voltage has the following fea-

    tures: It is extrac ted from only th e drain current without both th e effective channel

    leng th and w idth and has a physical meaning. It shows th e ga te voltage a t which

    drift and diffusion in the drain current are equal each other. These features may be

    useful for unifying the threshold voltage in compact models and in measurement.

    References

    [ I ] M.

    J.

    Deen and

    Z. X.

    Yan, A new meth od for measuring t h e threshold v oltage of

    small-geometry M OS FET s from subthreshold conduct ion , Sol id-Sta te Electron-

    ics, vol. 33, no. 5, pp. 503-511, 1990.

    [2]

    H. S.

    Wong,

    M. H.

    White ,

    T. J.

    Krutsick and

    R.

    V. Bo oth , Mo deling of transco n-

    ductance degradation and extraction of threshold voltage in thin oxide MOS-

    FETs , Solid-State Electronics, vol. 30, no. 9, pp. 953-968, 1987.

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    12

    K.

    Aoyama: A Method for Extracting the Threshold Voltage of

    MOSFETs

    NMOSF T

    Lp=Odpm Wpe l l OW V s W V

    transition polynomial

    - voltage expression

    diffusion

    exponential

    . . . . . .

    . . . . .

    function

    I I

    0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

    gate voltage: Vgs

    drain voltage: Vds V)

    Fig. 2. The idea of extracting the

    Fig.

    1.

    Comparison of the threshold voltages

    threshold voltage in this work.

    extracted with previous methods and SDLM

    for various drain voltages using the measured

    drain current in the NMOSFET.

    12

    g-10

    -

    -

    V

    N

    f 8 8-20

    >

    V

    z

    A

    V

    4

    M

    30

    -

    -

    0

    -40

    0.2 0.4 0.6 0.8 1.0 1.2 0.2 0.4 0.6 0.8 1.0 1.2

    gate voltage: Vgs V)

    gate voltage: Vgs V)

    a) b)

    Fig. 3. Results for this method when applied to a submicron NMOSFET for the

    various substrate voltages. a) The first difference-of he drain current.

    b)

    The

    second difference of the drain current.

    16

    --

    0

    il

    M

    -

    0

    V

    -20

    f 8

    6 -40

    V

    -

    . 4

    3

    60

    8 ;

    4

    -80

    0 0.2 0.4 0.6 0.8 1.0 0 0.2 0.4 0.6 0.8 1.0

    gate voltage: Vgs V)

    gate voltage: Vgs V)

    a) b)

    Fig. 4. The derivatives of the drain current calculated from 2D device simulation.

    a) The first difference of the drain current. b) The second difference of the drain current.

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    K.

    Aoyarna: A Method for E xtracting the Threshold Voltage of MOSFET s 12

    1

    . . . . . .

    . . . . .

    . . . . .

    . . . . .

    . . .

    j j

    4.0

    ativd pot edti al.... '..... hk

    onduct~on and potential

    4.5

    0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2

    distance: x pm )

    Fig. 5. The conduction band potential and the relative

    potential distribution at the interface at Vds=3.0V and

    Vgs=02V using 2D device simulation results. The device

    structure used in the simulation is also shown.

    1.3 1.4 1.5 1.6 1.7 1.8 1.9

    distance: x pm)

    Fig.

    6 The rate of the two drain current

    components in the channel calculated

    using the conduction band potential and

    the relative potential at the interface of Si

    and S i0 2 .

    Vth

    extracted with S LM method

    0.15 0.20 0.25 0.30 0.35

    gate voltage: Vgs V)

    Fig.

    7

    The RATE of the drift current

    component at the interface for various

    gate voltages. At Vgs=0.215V, the drift

    component is equal to the diffusion

    component.