LETI WEEKLY STATUS REPORT

Tom McMullen

Weeks 1 and 2

4/2/2013 – 15/2/2013

LETI wafer thinning project flowPhase 1

ID Project Name Owner Days Start End 3-Feb 10-Feb 17-Feb 24-Feb 3-Mar 10-Mar 17-Mar 24-Mar 31-Mar 5-Apr 12-Apr 19-Apr 26-Apr

1.0 Thin Wafer Assemblies T. McMullen 0 1-Feb 30-Sep

Week 1 Week 2 Week 3 Week 4 Week 5 Week 6 Week 7 Week 8 Week 9        

                                     

1.1

PHASE 1 - Layout and mask production, first 2 wafers with microbumps delivered to Advacam LETI - 3D 10 1-Feb 29-Mar

LETI accpets CERN proposal

                       

1.1.1 Send gds to LETI T. McMullen 5 1-Feb 8-Feb                          

1.1.2Send 2 FEI4b wafers to LETI R. Bates 5 1-Feb 6-Feb

                         

1.1.3

Confirm step size on wafer and centre ofset variation on wafer LETI 5 1-Feb 6-Feb

                         

1.1.4Layout and mask production LETI 10 1-Feb 11-Feb

 

Deliverable 1: Microbumb

gds files

                     

1.1.4

First 2 wafers with micro bumps delivered to Advacam LETI 49 12-Feb 2-Apr

               

Deliverable 2: First 2 wafers

with micro bumps

delivered to Advacam

       

Current

Deliverable

Target not met

Action ListPhase 1 and 2Action What Who When Comment

1 Supply .gds files for FE-I4b wafers to LETI TMcM 8/3/2003 Received file from Bonn unable to open them

2Supply FE-I4b documentation for wafer

step TMcM 8/4/2003 Need to get this from CERN website

3 Send 2 wafers FE-I4b wafers to LETI Rbates 8/5/2003 Wafers shipped 14/2/2013

4 CERN purcahsing info for STFC TMcM 14/2/2013 Contact Sandrine and ask for the invoice for STFC

5 Further funding for flip-chip process Rbates\Cbuttar 31/2/2013Richard awaiting information back from Hienze regarding

this

6 Bow measurement set-up TMcM 31/2/2013 Visit SMC and set up program for bow measurement

Highlights and issues LETI and CERN agree contracts Cash for flip-chip bonding

We have the funding for the thinning work with LETI but will need further funding for the flip-chip process at Advacam

Richard has contacted Heinz regarding this and awaiting feedback. Didier and Peppe have declined to contribute at this time as they have already submitted their proposals for the next 2 years

We will need this further funding by the end of phase 1 (week 9 from Gant on previous slide) to test the LETI micro-bumps

LETI wafer thinning project flowPhase 2

To be published in next report