THERMAL INTERFACE MATERIALS (TIMs)
Transcript of THERMAL INTERFACE MATERIALS (TIMs)
Background:Light Emitting Diodes, or LEDs, have been used in industrial applications like signal indicators for decades. Recently, advances in LED technology have produced products with much higher power and brightness, creating the need for effective thermal management. Since LED light output is directly related to its temperature, it is important to consider thermal management when designing LED-based products.
As LEDs are adopted into more applications, enclosures become miniaturized and power densities increase. Thermal Interface Materials (TIMs) which effectively transfer the heat are required. Parker-Chomerics TIMs offer excellent thermal conductivity (i.e. low thermal impedance) and long-term reliability allowing for preservation of high brightness light output.
Product Attributes:• DecreasesLEDjunctiontemperatures,
increasingproductlifetimes.• Excellentlongtermreliability• LowThermalImpedance• Peel-N-StickPads• ExcellentdispensabilityforGelsand
Cure-In-Place(CIP)Products• DielectricStrength• Manyformstofitapplications:Tapes,
Gels,ThermalPads,Dielectricpads,CIP’s,Greases
Typical Applications• LCDLightEngines(i.e.LapTops
andRuggedizedDisplays)• ArchitecturalLighting• AutomotiveLighting• TrafficLightsandSigns• StreetLighting• Industrial/SafetyLighting
THERMAL INTERFACE MATERIALS (TIMs) For LED Applications & Assemblies
Contact Information:Parker Hannifin CorporationChomericsDivision77DragonCourtWoburn,MA01801
phone 781 935 4850fax 781 933 [email protected]
www.chomerics.comwww.parker.com/chomerics
G579 Gap-Filler pad between LED array on printed circuit board (PCB) and aluminum housing.
ProductInformation
THERM-A-GAP™ Thermally Conductive Gap Filler Pads
Material Color CarrierStandardThickness
(inches)
Dielectric Strength at
Min. Thickness (VAC)
Thermal Impedance at Min. Thickness(ASTM D5470)
(oC-in2/W)
Flammability Rating (UL 94),
See UL File E140244 for
Details
RoHS Compliant
Comments
976 Gold Unsupported 0.040-0.200 8,000 0.27 V-0 YesHighestthermalconductivity,
conformablematerial
974 Blue Unsupported 0.020-0.060 4,000 0.32 NotTested Yes Highthermalconductivity
G974 Blue Fiberglassw/PSA 0.010-0.060 2,000 0.25 V-0 Yes HighthermalconductivitywithfiberglassPSA
G579* Pink FiberglassnoPSA 0.010-0.200 2,000 0.30 V-0 YesBestcombinationofconformabilityand
thermalperformance
G569* Gray FiberglassnoPSA 0.010-0.200 2,000 0.60 V-0 Yes Superiorconformability
HCS10G* Orange FiberglassnoPSA 0.010-0.200 2,000 0.70 V-0 Yes Highestconformabilityandeconomical
575NS Yellow Unsupported 0.020-0.100 4,000 1.10 NotTested Yes Non-Siliconegapfillerpad
G515RFA* DarkGray FiberglassnoPSA 0.010-0.200 N/A 1.10 V-0 YesConformable,EMI/RFIabsorberandthermally
conductive
*Customthicknessesavailable(upto~1inchthick)andcustommoldedshapesareavailable.ContactApplicationEngineeringfordetails.
CHO-THERM®, Thermally Conductive Electrical Insulators
Material Color Thickness
(inches)Dielectric
Strength (VAC)
Thermal Impedance**
(ASTM D5470), (oC-in2/W)
Flammability Rating (UL 94), See UL File E140244 for Details
RoHS Compliant
Comments
T500 Green 0.010 5,000 0.19 V-0 Yes Bestthermalperformance
1678 Pink 0.010 2,500 0.20 V-0 YesValue-pricedwithgoodthermalandelectrical
performance
1671* White 0.015 4,000 0.23 V-0 YesHighthermalperformanceandprovenreliabilityin
aerospaceapplications
T609§ LightGreen 0.010 4,000 0.33 V-0 Yes Excellentcombinationofperformanceandvalue
T444§ Beige 0.003 5,000 0.37 NotTested Yes Non-silicone,KaptonMT™****Film
1674§ Blue 0.010 2,500 0.41 V-0 Yes Generalpurposecommercialgradeinsulator
T441***§ Pink 0.008 8,500 0.41 V-0 YesExcellent dielectricstrengthathighhumidity,com-
mericalgradeinsulator
*1671availableincustomthicknesses0.020to0.060inch**TestedwithoutPSA,PSAtypciallyadds0.05oC-in2/Wtothermalimpedance***T441isavailableinotherthicknessesincluding0.013and0.018inches****TrademarkofDuPont§Availableinrollform
Thermal Interface Material
(THERM-A-GAP™ 976)
Package to Substrate Interface
Good OpportunitiesCopper Heat Slug
Package LEDs
Die/Submount to Package
Few Opportunities
Pre-molded Epoxy Lens
Silicone Encapsulant
Flip Chip LED Die
PCB / Thermally Enhanced Substrate
Substrate to Heat Sink/ Enclosure
Interface (system specific)
Excellent Opportunities
THERMFLOW Phase-Change Thermal Interface Pads*
Material ColorThickness
(inches)Carrier (inches)
Available In Roll Form
Dielectric Strength
(VAC)
Thermal Impedance(ASTM D5470),
(oC-in2/W)
Phase-Change Temperature (oC)
(ASTM D3418)
RoHS Compliant
Comments
PC07DM Pink 0.007 0.001Polyester Yes 5,000 0.28 55 YesPolyesterdielectriclayer,inherentlytacky,noadhe-
siverequired.Offersexcellentmechanicalandelectricalproperties
T710w/PSA****
LightGray 0.0055 0.002Fiberglass Yes NA 0.25 45 Yes Fiberglassreinforcement,PSAattachment
T725*** Pink 0.005 FreeFilm Yes NA 0.04 55 YesInheretlytackandeasytouseinassembly.
UL94V-0Rated(seeULfile)
T766****LightGray/Metallic
0.00350.006
0.001MetalFoil Yes NA 0.06 55 YesFoilprovidescleanbreakbetweenheatsink
andpackage
T557* Gray 0.005 FreeFilm Yes NA 0.01 45/64***** Yes Lowestthermalimpedance
T558* Gray/Silver 0.0045 0.001MetalFoil Yes NA 0.02 45/64***** Yes Lowthermalimpedance.Foilforclean-break
T777** Gray 0.0045 FreeFilm Yes NA 0.01 45/64***** Yes Lowestthermalimpedanceandoptimizedreliability
*USPatentNo.6,054,198**Enduserlicenseagreementmayapply***USPatent6,956,739B2****USPatent6,835,453*****Carrierphasechange/Alloymelttemperature
ProductInformation (cont.)
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0 100 200 300 400 500 600 700 800
Temperature Cycles
TIM
, °C
-cm
²/W
Die1 OutcoreDie2 Outcore
Temperature Cycling Testing between 0°C and 125°C with 10 min. ramping time and 10 min. soaking time
XTS 8010 Silicone Gel
0.05
0.10
0.15
0.20
0.25
0.30
0 100 200 300 400 500 600 700 800
Power Cycles
Th
erm
al Im
ped
ance
(°C
-cm
²/W
)
Commercial High End Grease
Chomerics XTS 80XX-Class Gel
Reliability Testing Platform for Greases GELs and Phase Change:
While greases can degrade thermally overtime, GELs and Phase Change materials maintain performance (and brightness).
Thermal GEL Power CycleThermal GEL Temperature CyclePhase Change vs. Grease (Uniform Heating, 120oC)
THERMAL GREASE
Material ColorThermal Impedance above 50oC
(ASTM D5470), (oC-in2/W)Thermal Impedance above 65oC
(ASTM D5470), (oC-in2/W)
Thermal Conductivity
(ASTM D5470), (W/m-K)
Viscosity (cps)
RoHS Compliant
Comments
T650 Blue 0.02at10psi 0.02at10psi 0.80 190,000 Yes Generalpurposethermalgrease
THERM-A-GAP™ Thermally Conductive Dispensable GELs
Material
Thermal Conductivity
(ASTM D5470), (W/m-K)
Dielectric Strength (ASTM D149)
(Vac/mil)
Typical Minimum Bondline Thickness
(inches)
% Deflection at Various Force Levels (ASTM C165 Modified) RoHS
CompliantComments
1lb 3lb 5lb
T630* 0.7 200 0.004/0.010* 36 54 63 Yes Fully-cured,dispensable,extremelyconformable
GEL30 3.5 200 0.004 41 59 71 Yes Excellentcombinationofthermalperformanceandflowrate
GEL8010 3.0 200 0.002 44 64 74 YesExcellentcombinationofthermalperformanceandflowrate.
Bestforthinbondlineapplications(0.001-0.010inches)
Availableinlargecontainers(1and5gallons)forHighVolumeManufacturers.Largeformatsrequirecustomizeddispensingequipment.*Alsoavailablewith0.010inchglassbeadsasadielectriccompressionstop.RefertoproductT630G.
0.000
0.050
0.100
0.150
0.200
0.250
0.300
0.350
0 500 1000 1500 2000 2500
Aging Time (Hours)
Ther
mal
Impe
danc
e (°
C c
m²/W
)
T777Grease
THERMALLY CONDUCTIVE CURE-IN-PLACE (CIPs) COMPOUNDS
Material Color
Thermal Conductivity
(ASTM D5470), (W/m-K)
Shore A Hardness
(ASTM D2240)
Dielectric Strength (VAC/mil)
ComponentsApproximate Cure Time
at TemperatureRoHS
CompliantComments
T647* Gray 3.0 50 250 2-part48Hoursat25oC
10Minutesat150oCYes 1:1ratio.Highestthermalperformance
T646* Tan 0.9 50 250 2-part
48Hoursat25oC30Minutesat75oC3Minutesat150oC
Yes1:1ratio.Oftenusedinhigh-volume,
automateddispensing
T644* Pink 1.2 15 500 2-part Yes1:1ratio.Goodthermalconductivity.
Lowdensityforweightsensitiveapplications.
1642 Blue 1.0 85 500 2-part Yes10:1lowextractablesiliconecompound.
Goodthermalconductivity.Lowdensityforweightsensitiveapplications.
1641 White 0.9 78 500 1-part48Hoursat25oC
at50%RelativeHumidityYes
Moisturecure,encapsulant,pottingcompound.ComesbundledasakitwithprimerCHO-BOND1086
*Thesecompoundsareavailableinlargecontainers(1and5gallons)forHighVolumeManufacturers.Largeformatsrequirecustomizeddispensingequipment.
THERMATTACH Thermally Conductive Attachment Tapes
MaterialThickness
(inches) Carrier
Lap Shear Adhesion (ASTM D1002 Al-Al),
(psi @25oC)
Thermal Impedance**
(ASTM D5470), (oC-in2/W)
Flammability Rating (UL 94), See UL File E140244 for Details
RoHS Compliant
Comments
T404/T414§ 0.005 KaptonMT™*Film 100 0.60 V-0 Yes Electricallyinsulatingacrylicadhesive
T405§ 0.006 Aluminum 100 0.50 V-0 Yes Lowimpedance
T411§ 0.010Expanded
AluminumMesh40 1.0 NotTested Yes
Siliconeadhesive,recommendedforplasticpackageswithsiliconemoldrelease
T412§ 0.010Expanded
AluminumMesh70 0.30 NotTested Yes Highestthermalperformance,acrylicadhesive
T418§ 0.010 Fiberglass 150 1.2 V-0 Yes Superiorattachmentstrength,acrylicadhesive
*TrademarkofDuPont§Availableinrollform
ProductInformation (cont.)
SOLID STATE HEAT SPREADER (T-WING)
MaterialThickness
(inches)
ThicknessStack Up(inches)
Sizes (Width X Height)
(inches)
Typical Component Temp.
Reduction (oC) See Catalog for Details
Flammability Rating (UL 94), See UL File E140244 for Details
RoHS Compliant
Comments
T-Wing 0.013
0.001PET0.0015Acrylic0.007Copper0.0015Acrylic0.001PET
0.001SiliconePSA
2.0X0.5 3.0X0.5
10-20 V-0 Yes
Flexible,lowprofileheatspreaderslaminatedwithdielectricmaterialonbothsides.SiliconePSAforattachment.Availablecentered(seecatalogueforstandardsizes),oneentireside,or
bothsides.Customshapesavailable.
3.0X0.75 3.0X1.0
4.0X1.0 4.0X1.5
Solid State Heat Spreader T-WING®
Therm-A-Gap™ G974
Aluminum Chassis
LEDs on PCB Attached to T-WING®
Literature Number: MB 1004 EN October 2010