Thermal Interface Materials

Thermal Interface MaterialsThermal Interface Materials

LTM6300 Phase Change Material

Thermal Interface Materials

Honeywell TIMs Serve Multiple Applications

Consumer Electronics

Telecomm

IT/Enterprise

Automotive & Power

High-Brightness LED

LTM6300-SPHigh Thermal Conductivity Phase Change Material for Low Power Applications

F E AT U R E S & B E NE F I T S

• High thermal conductivity

• Phase change at 45°C

• Ease of application • Superior handling and reworkability

• Superior reliability performance

• Available in paste/printable format

Honeywell’s LTM6300-SP phase change material (PCM) is specifically

formulated for applications such as LED and other low power density

devices. The patented* material is provided in paste/printable format.

It has a tailored filler size that provides exceptional performance.

LTM6300-SP thermal interface material changes phase at 45˚C to ensure

maximum surface conformance and hence minimal contact resistance.

Use of LTM6300-SP provides longer life and good device stability while

keeping product cost low.

LTM6300-SP Thermal Impedance (TI) vs. Pressure

LTM6300-SP

is well-suited for

devices with low

power density.

0.00

0.02

0.04

0.06

0.08

0.10

0.12

0.14

0.16

0.18

0 5 10 15 20 25 30 35 40 45

Imp

ed

en

ce

(°C

cm

2/W

)

Pressure (PSI)

Honeywell Electronic MaterialsUSA: 1-509-252-2102

China: 86-21-50203266

Germany: 49-5137-999-9199

Japan: 81-3-6730-7092

Korea: 82-2-3483-5076

Singapore: 65-6580-3593

www.electronicmaterials.com

MORE HONEYWELL TIMsLTM6300 is part of Honeywell’s TIM Solutions

family of phase change materials. Whatever the

thermal challenge, we offer a TIM product that

provides just the right characteristics for your

application. Find out more about:

PTM7000 Series PTM6000 Series

PTM5000 Series PCM45 Series

TCM11/12 Series LTM Series

By visiting: electronicmaterials.com

LTM6300-SP

printed on LED

modules.

LTM6300-

SP may be

provided in

jars or cans.

LTM6300-SP Thermal

Impedance vs. Bond

Line Thickness

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0.70

0 1 2 3 4 5 6

Imp

ed

en

ce

(°C

cm

2/W

)

Bond Line Thickness (mils)

LTM6300 Technical Information

Although all statements and information contained herein are believed to be accurate and reliable, they are presented without guarantee or warranty of any kind, express or implied. Information provided herein does not relieve the user from the responsibility of carrying out its own tests and experiments, and the user assumes all risks and liability for use of the information and results obtained. Statements or suggestions concerning the use of materials and processes are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all toxicity data and safety measures are indicated herein or that other measures may not be required.

Physical Properties Unit Test Method LTM6300-SP

Thermal Conductivity W/m·K ASTM D5470 ≥2.03

Thermal Impedance ˚Ccm2/W ASTM D5470 Modified ≤0.40

Specific Gravity g/cm3 ASTM D374 1.8

Viscosity Pa·s @2 1/s, 25˚C RehometerHON <150,000

Volume Resistivity Ω·cm ASTM D257-700 ≥3.0x1015

Typical No Shim Bond Line @ 40 psi mil NA 0.5

THERMAL IMPEDANCE POST RELIABILITY (ASTM E1461)

End of Line 0.25˚C-cm2/WTemperature Cycling “B” 0.17˚C-cm2/W

(-55˚C to +125˚C, 1000 cycles)1000 hrs @ 85˚C & 85% RH 0.23˚C-cm2/WHAST, 96h 0.23˚C-cm2/W1000 hrs @ 150˚C 0.18˚C-cm2/W

Mail: Frank@semiwell.cn

LTM6300-SP Printing GuidelinesThermal managemenT Technical bulleTin:

Application of LTM6300-SP• TheapplicationofLTM6300-SPissuitableforvariousLEDapplicationsinbacklight,generallightingandillumination

Different shapes of LTM6300-SP are possible depending on the screen print design.

• LTM6300-SPwilldryafterapproximately15hoursatambienttemperatureswithathicknessof10to12mils*

• LTM6300-SPdrytimecanalsobeacceleratedinaforcedexhaustovenorsimilarequipmentat50˚Cfor3.5hours

% Weight Loss of Carrier Fluid @ RT

Carrierfluidevaporationvtimeinopenair@25˚Cfora20mmX20mm,10milsample

% Weight Loss of Carrier Fluid @ 50˚C

Carrierfluidevaporationvtimeinopenair@50˚Cfora20mmX20mm,10milsample

*Dry time may vary depending on environment temperature and ventilation conditions

Suggested Measurement of Dried LTM6300-SP Thickness

Rework of LTM6300-SP• IfreworkisrequiredsimplyremoveLTM6300-SPfromtheheatsinksurfaceanduseanappropriatecleaningsol-ventsuchasacetone,IPAortoluenetoremoveanyresidue

• Solventcanbeappliedtosoftenandremovethedriedapplications.Ahardplasticedgemaybeappliedtoassisttheremovalofdriedapplicationaswell

• ReapplyLTM6300-SPonthenewlycleanedsurface

1. Zero the drop gauge reading on application surface (e.g. heat sink)

2. Measure the LTM layer thickness

Dry LTM

Flat Tip

Although all statements and information contained herein are believed to beaccurateandreliable,theyarepresentedwithoutguaranteeorwarrantyofanykind,expressorimplied.Informationprovidedhereindoesnotrelievetheuserfromtheresponsibilityofcarryingout itsowntestsandexperiments,andtheuser assumes all risks and liability for use of the information and resultsobtained.Statementsorsuggestionsconcerningtheuseofmaterialsandpro-cessesaremadewithoutrepresentationorwarrantythatanysuchuseisfreeofpatent infringementandarenotrecommendationsto infringeanypatent.Theusershouldnotassumethatalltoxicitydataandsafetymeasuresareindicatedhereinorthatothermeasuresmaynotberequired. TB1470310Rev2©2010HoneywellInternationalInc.

Honeywell Electronic Materials

Customer&TechnicalSupport

Hotline:509-252-2102

Fax:509-252-8617

www.honeywell.com/sm/em

86-21-50203266

WORLDWIDE DEVELOPMENT, MANUFACTURING AND SUPPORT

United States Santa Clara, California Sunnyvale, California Spokane, Washington Chandler, Arizona Salt Lake City, Utah Bryan, Texas Houston, Texas Mansfield, Texas Fombell, Pennsylvania

Morristown, New Jersey

Europe Seelze, Germany

Asia Shanghai, China Jincheon, Korea Tokyo, Japan Yaita, Japan Chonburi, Thailand Hsinchu, Taiwan Singapore

E

EE

E Research & Development Site Manufacturing Site N Support Site

Although all statements and information contained herein are believed to be accurate and reliable, they are presented without guarantee or warranty of any kind, express or implied. Information provided herein does not relieve the user from the responsibility of carrying out its own tests and experiments, and the user assumes all risks and liability for use of the information and results obtained. Statements or suggestions concerning the use of materials and pro-cesses are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all toxicity data and safety measures are indicated herein or that other measures may not be required. August 2016 Rev1©2016 Honeywell International Inc.

Honeywell Electronic MaterialsUSA: 1-509-252-2102China:Germany: 49-5137-999-9199Japan: 81-3-6730-7092Korea: 82-2-3483-5076Singapore: 65-6580-3593Mail:www.electronicmaterials.com

HONEYWELL TIM ADVANTAGES

Quality• Industry-leading reliability over

device lifetime

• More than twenty years specializing in TIM materials R&D and manufac-turing

• Proprietary formulations optimized for the needs of specific applications

• Proven, long-standing supplier with multiple worldwide quality certifica-tions

Customer Focused• Serving diverse range of customers

• TIMs offered in both pad and paste formats for ease of application

• Superior global technical support

• Portfolio of other materials, such as thermal spreaders, electrical

interconnect and pure metals

Find out more by visiting: electronicmaterials.com

Frank@semiwell.cn