The Business of Science ® Page 1 © Oxford Instruments 2014 Quantum Technology: Supplying the Picks...

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The Business of Science ® Page 1 © Oxford Instruments 2014 Quantum Technology: Supplying the Picks and Shovels Dr John Burgoyne Quantum Control Engineering: Mathematical Solutions for Industry – Open for Business Event 7 th August 2014, 12.30-17.00, Isaac Newton Institute, Cambridge

Transcript of The Business of Science ® Page 1 © Oxford Instruments 2014 Quantum Technology: Supplying the Picks...

Page 1: The Business of Science ® Page 1 © Oxford Instruments 2014 Quantum Technology: Supplying the Picks and Shovels Dr John Burgoyne Quantum Control Engineering:

The Business of Science®

Page 1© Oxford Instruments 2014

Quantum Technology: Supplying the Picks and Shovels

Dr John Burgoyne

Quantum Control Engineering: Mathematical Solutions for Industry – Open for Business Event 7th August 2014, 12.30-17.00, Isaac Newton Institute, Cambridge

Page 2: The Business of Science ® Page 1 © Oxford Instruments 2014 Quantum Technology: Supplying the Picks and Shovels Dr John Burgoyne Quantum Control Engineering:

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Why “picks and shovels”?

20 February 2006

…Tools enable discovery

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Behind the metaphor

New ideas+

New tools

Newscience

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Page 5: The Business of Science ® Page 1 © Oxford Instruments 2014 Quantum Technology: Supplying the Picks and Shovels Dr John Burgoyne Quantum Control Engineering:

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A suite of materials, metrology and measurement tools for QT

Plasma deposition and etch

Qbit measurement

Qbit manipulation

Surface analysis - chemical

SEM

MBE & UHV sputtering fabrication

Surface analysis - structural

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Device fabrication

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• Growth

• MBE

• Nanowires/nanotubes• High temperature plasma-

enhanced chemical vapour deposition (PECVD)

• Deposition

• PECVD

• Inductively coupled plasma (ICP) deposition

• Ion beam deposition

• Atomic layer deposition (ALD)

• Etch

• ICP etch

• Reactive ion etch (RIE)

• Ion beam etch

Enabling device fabrication via a suite of advanced techniques and processes

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Capabilities from research to pilot-scale and production – solutions that grow with the technology

Wafer handling

50 mm Wafer size 450 mm

Production – cassette to cassette

Open load

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Multi-tool clusters

Kelvin probe

ALD (thermal & plasma)

Hex handler with integrated Kelvin Probe

PECVDSputter

ICP-CVD #1

ICP-CVD #2

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• Process library of > 6,000 processes developed over 25 years• Accessible to all our customers

• Close collaboration with major Universities and R&D facilities• Caltech, Cornell, LBNL, TU

Eindhoven, IMEC, Southampton University, Cambridge University, …

• Process guarantees for key parameters • Including wafer-to-wafer repeatability

for rate and uniformity

Our process advantage

TEOS based SiO2 deposition Typical GaN etched feature (PR remains intact)

Waveguide etch HB LED substrate etch

SiC metal mask etch High rate SiNx at 8 0ºC

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• Unique capability of ALD for monatomic/ mono-molecular layer control over extremely high aspect ratio features

• Example (top): ALD of Al2O3 on carbon nanotubes (CNT)

• Using TMA and O2 plasma

• O2 plasma just enough to react with TMA but not etch CNT

• No additional functionalisation of CNT necessary

• Example (bottom): 20 nm HfO2 onto 25:1 AR Si trenches

• Conformality ~ 100%

Extreme aspect ratio conformal deposition via Atomic Layer Deposition

Trench corner

HfO2Si

Trench bottom

HfO2

Si

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Deposition UHV multi-chamber tool: Institute for Quantum Computing, University of Waterloo, Canada

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• MBE and UHV sputtering methods on multiple materials within the same device

• Metals, metal oxides, superconductors, topological insulators…

• XPS (X-ray photoelectron spectroscopy) analysis of samples

• Oxford Instruments Omicron ARGUS analyser

• In-process analysis• Enables layer-by-layer

quality control of the MBE and sputtering growth processes

Deposition UHV multi-chamber tool: Institute for Quantum Computing, University of Waterloo, Canada

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Device physics and characterisation

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• QT device physics needs low (ultra-low) temperatures

• The initial, “obvious” advantage: no liquid cryogens• No compromise on performance

• Base temperature <10 mK

• Cooling power up to 400 µW at 100 mK

• Attraction for QT science emerged: greatly enhanced sample space vs. ‘wet’• 240 mm diameter mixing chamber plate

• Open structure for easy experimental access

• Ease of use• Sample in vacuum with only a single room

temperature O-ring seal (no IVC)

• Fully automatic cool-down from room temperature to base

• Remote control through TCP/IP protocol

A key enabler for QT/QIP R&D: the TritonTM

Cryofree® dilution refrigerator platform

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• ULT plus…

• Electrical• Wide bandwidth electronics

• GHz pulse sequences

• Low noise amplification

• Low temperature filtering and amplification

• Low electron temperatures

• Magnetic• Homogeneous fields

• Gradient fields

• 3D Vector fields

• AC fields

• Optical• Low vibration

• HV/UHV

• fs pulse sequences

• Single photon emitters

• Optical windows

• Spectroscopic detectors

• Atomic• UHV

• Gas injection

• Ion/electron beam

• Rapid scan SPM

What else is needed for QIP ‘read/write’ control

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Triton DR: typical experimental services

96 off dc lines

Still plate

100 mK plate

4 K plate

2 off optical fibres10 off UT-85 rigid coaxial cables

10 off S1 flexible coaxial cables

Mixing chamber plate, <10 mK

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Experimental services, heat sinking andavailable cooling powers

“Fully loaded” Triton DR: base temperature < 15 mK

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Triton DR integrated 3-axis superconducting magnets

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Multiple Triton DR systems: Centre for Quantum Devices, Niels Bohr Institute, University of Copenhagen, Denmark

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Multiple Triton DR systems: TU Delft, Netherlands

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Fast throughput: top-loading sample exchange

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• 4 off 18 GHz

• 25 off dc lines

30 mm top-loading sample puck

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OVC break

Sample puck

Magnet

Vacuum lock and gate valve

Drive rods

Fast throughput with larger sample space: bottom-loading sample exchange

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• 14 off 40 GHz

• 50 off dc lines

• < 8 hours cool-down time

70 mm bottom-loading sample puck

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MC plate

Docking station

Sample holder

Coaxes routed from MC plate to docking station

Field centre

Fast throughput with larger sample space: bottom-loading sample exchange

Repeat connect/disconnect cycles

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Sample instrumentation

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New platform for yet greater capacity and capability: TritonXL

Ø 240 mm

706 mm

Ø 430 mm

1003 mm

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TritonXL: sample space and wiring access

Triton• Ø 240 mm• 1 x 50mm + 2 × 40 mm+ 1 x 65 mm LoS ports

TritonXL• Ø 430 mm• 6 x 50 mm + 1 x 100 mm

LoS ports

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• The future• On-board cold electronics

• Filtering, multiplexing, amplifiers, …

• Enhanced measurement• Electron temperature thermometry

• Standardised measurement pucks

• Anticipating close participation in a number of QT Hubs

• For discussion!• What are we not seeing yet in QC/QIP?

• What are we not seeing yet in QT beyond QC/QIP?

And finally…

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Thank you