Tezzaron Semiconductor 04/27/2015 New Trends in Advanced 3D Vertical Interconnect Technology...

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Preparation run Tezzaron-Chartered 06.01.2009 A.Rozanov 1 Introduction Restarts test on PS en Avril 2009 Mesure PS SEU chip SEU-IBM-2008 40 Mhz avec FPGA.

Preparation run Tezzaron-Chartered 06.01.2009 A.Rozanov 1 Introduction Restarts test on PS en Avril 2009 Mesure PS SEU chip SEU-IBM-2008 40 Mhz avec FPGA.

Tezzaron Semiconductor Device Summary Fully functional devices demonstrating a wide variety of applications Good yield –90% process, 96% device Demonstrated.

Tezzaron Semiconductor Device Summary Fully functional devices demonstrating a wide variety of applications Good yield –90% process, 96% device Demonstrated.

Tezzaron Semiconductor 06/14/2011 3D_IC for Real Chips Bob Patti, CTO rpatti@tezzaron.con 1.

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3D-ICs and Integrated Circuit Security - tezzaron.com · 3D-ICs and Integrated Circuit Security Page 1 of 2 ... Each substrate is aggressively thinned. The entire circuit is integrated

3D-ICs and Integrated Circuit Security - tezzaron.com · 3D-ICs and Integrated Circuit Security Page 1 of 2 ... Each substrate is aggressively thinned. The entire circuit is integrated

Tezzaron Semiconductor And Then a Miracle Occurs…. 5 years and many dollars later…….. What’s so Funny about Science? By Sidney Harris (1977)

Tezzaron Semiconductor And Then a Miracle Occurs…. 5 years and many dollars later…….. What’s so Funny about Science? By Sidney Harris (1977)

3D Integration: New Opportunities for Speed, Power …infieri-network.eu/.../Tezzaron_Presentation_INSS_070713_dist.pdf© Tezzaron Semiconductor INFIERI 2013 07/07/2013 3D Integration:

3D Integration: New Opportunities for Speed, Power …infieri-network.eu/.../Tezzaron_Presentation_INSS_070713_dist.pdf© Tezzaron Semiconductor INFIERI 2013 07/07/2013 3D Integration:

2.5/3D Integrated Circuit Technology - Tezzaron

2.5/3D Integrated Circuit Technology - Tezzaron

3D_IC for Real Chips Bob Patti, CTO rpatti@tezzaron.con

3D_IC for Real Chips Bob Patti, CTO [email protected]

Tezzaron Semiconductor 11/15/2013 1 A Perspective on Manufacturing 2.5/3D Bob Patti, CTO rpatti@tezzaron.com.

Tezzaron Semiconductor 11/15/2013 1 A Perspective on Manufacturing 2.5/3D Bob Patti, CTO [email protected].

DRAM Pricing – A White Paper - Tezzaron Semiconductor Pricing – A White Paper ©2002 Tachyon Semiconductor September 30th, 2002 Page 2 of 7 1415 Bond Street, Suite 111, Naperville,

DRAM Pricing – A White Paper - Tezzaron Semiconductor Pricing – A White Paper ©2002 Tachyon Semiconductor September 30th, 2002 Page 2 of 7 1415 Bond Street, Suite 111, Naperville,

The First Multiproject Wafer Run With Chartered/Tezzaron Ray Yarema Fermilab On behalf of the 3D Consortium 2011 Front End Electronics Meeting Bergamo.

The First Multiproject Wafer Run With Chartered/Tezzaron Ray Yarema Fermilab On behalf of the 3D Consortium 2011 Front End Electronics Meeting Bergamo.

Lessons and Future for 3D Circuit Design With focus on Chartered/Tezzaron Activities

Lessons and Future for 3D Circuit Design With focus on Chartered/Tezzaron Activities

Implementing 2.5D and 3D Devices Bob Patti, CTO rpatti@tezzaron.com

Implementing 2.5D and 3D Devices Bob Patti, CTO [email protected]

How 3D Memory is Changing Computing€¦ · Tezzaron Semiconductor 03/13/2015 How 3D Memory is Changing Computing DATE 2015 W05 Robert Patti, CTO rpatti@tezzaron.com 1

How 3D Memory is Changing Computing€¦ · Tezzaron Semiconductor 03/13/2015 How 3D Memory is Changing Computing DATE 2015 W05 Robert Patti, CTO [email protected] 1

DiRAM™ Architecture Makes - Tezzaron Semiconductor · •Burn-In & Test Stack MemCon 2013 18 ... Photonic I/O • Lowest Power • Highest Performance DiRAM4 Launches with 1.2 V

DiRAM™ Architecture Makes - Tezzaron Semiconductor · •Burn-In & Test Stack MemCon 2013 18 ... Photonic I/O • Lowest Power • Highest Performance DiRAM4 Launches with 1.2 V

Tezzaron Semiconductor 04/08/2013 1 Implementing 2.5D and 3D Devices Bob Patti, CTO rpatti@tezzaron.com.

Tezzaron Semiconductor 04/08/2013 1 Implementing 2.5D and 3D Devices Bob Patti, CTO [email protected].