Tab Bond Process
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L O A D I N G
Transcript of Tab Bond Process
L O A D I N G
L O A D I N G
L O A D I N G
L O A D I N G
L O A D I N G
L O A D I N G
L O A D I N G
TAB BOND PROCESS
OBJECTIVES:
ABLE TO DEFINE WHAT IS TAB BOND PROCESS CONCEPT.
BE ABLE TO IDENTIFY THE 2 BASIC OPERATIONSIN A TAB BOND PROCESS.
TO DETERMINE HOW THE TAB BOND EQUIPMENT WORKS.
TO IDENTIFY TAB BOND WORKING ELEMENTS.
What is Tab Bonding?
It is a process of interconnecting inner-bonding pads of semiconductor dice to lead sites of tab circuit that are part of continuous tape.
Lead to die bonds are made using a single point thermosonic energy toform an intermetalic bond between the lead and a bond location on die.
To promote bond formation, the die is heated prior bonding.
The bond tool is repositioned and the bonding process repeated as many times as is needed to bond all leads at a lead site to the die.
All motions are controlled by the electronic control system in the bonder.
Chip Attach (Pick & Place Principle)
Describes the picking-up of the die by the Pick-Up Tool from the wafer and places it on the Pedestal for bonding.
Pre-Peel Vacuum
Push Up Force
Pick Up Force
Pick Up Time
Blow-off Pressure
Pick
Place
Working Elements Required
Die Pick Holding Vacuum
DPVS
Die Pick Vision System
It recognizes the taught condition to perform the Die Pick & Place operation.
Vision Area
Clarity (Illumination) of the die surface as seen in the vision area -this figure describes the best taught condition
Poor illumination - manual pick is needed due to its condition
Dies
Die Eject Assy
Blue TapeWafer Ring
Table Stop
Pick-Up Tool
Mechanical Set-Up
X & Y Axis (XY Table) Y-axis
X-axis
The Die Eject Assy is stationary
Table moving in the X-axis
Table moving in the X-axis
Table moving in the X-axis
Table moving in the X-axis
Table moving in the X-axis
Table moving in the X-axis
Table moving in the X-axis
Table moving in the X-axis
Table moving in the X-axis
B-Axis (Pick-Up Tool), D-Axis (Die Eject Assy)
B-axis
D-axis
Die Eject Assy moving in the D-axis
Pick-Up Tool moving in the B-axis
Die Eject Assy moving in the D-axis
Pick-Up Tool moving in the B-axis
Die Eject Assy moving in the D-axis
Pick-Up Tool moving in the B-axis
Die Eject Assy moving in the D-axis
Pick-Up Tool moving in the B-axis
Die Eject Assy moving in the D-axis
Pick-Up Tool moving in the B-axis
Z-Axis (Die Ejector)
Z-axis
Die Ejector
Die Ejector moving in the Z-axis
Die Ejector moving in the Z-axis
Die Ejector moving in the Z-axis
Die Ejector moving in the Z-axis
The “PICK”
It proceeds to the Pick Operation once the DPVSrequirement is satisfied.
The “PICK”
Suction Cup
Pick-Up Tool dropped near to the die surface
The “PICK”
Pre-Peel Vacuumactivates
The die is sucked towards the suction cup due to the introduction of the Pre-Peel Vacuum
The “PICK”
Pre-Peel Vacuumactivates
The die is sucked towards the suction cup due to the introduction of the Pre-Peel Vacuum
The “PICK”
Pre-Peel Vacuumactivates
The die is sucked towards the suction cup due to the introduction of the Pre-Peel Vacuum
The “PICK”
Pre-Peel Vacuumactivates
The die is sucked towards the suction cup due to the introduction of the Pre-Peel Vacuum
The “PICK”
Suction Cup
The Die Ejector moves up (Push Up Force) pushing the die back peeling off some blue tape holding it.
Some blue tape are peeled off. This is necessary to enhance the die pick.
Die Pick Holding Vacuum activates to hold back the die. NOTE: This is simultaneous to the moving up of the Die Ejector.
The “PICK”
Suction Cup
The Die Ejector moves up (Push Up Force) pushing the die back peeling off some blue tape holding it.
Some blue tape are peeled off. This is necessary to enhance the die pick.
Die Pick Holding Vacuum activates to hold back the die. NOTE: This is simultaneous to the moving up of the Die Ejector.
The “PICK”
Suction Cup
The Die Ejector moves up (Push Up Force) pushing the die back peeling off some blue tape holding it.
Some blue tape are peeled off. This is necessary to enhance the die pick.
Die Pick Holding Vacuum activates to hold back the die. NOTE: This is simultaneous to the moving up of the Die Ejector.
The “PICK”
Suction Cup
The Die Ejector moves up (Push Up Force) pushing the die back peeling off some blue tape holding it.
Some blue tape are peeled off. This is necessary to enhance the die pick.
Die Pick Holding Vacuum activates to hold back the die. NOTE: This is simultaneous to the moving up of the Die Ejector.
The “PICK”
The Die Ejector moves down back to position.
The Pick-Up Tool moves up (Pick Up Force) to its axis holding the die on a certain time (Pick Up Time).
Pre-Peel Vacuumdeactivates
The “PICK” & “PLACE” Transition
The Pick-Up Tool is positioned to move & place the die on the Pedestal
The “PICK” & “PLACE” Transition
To Pedestal
The “PICK” & “PLACE” Transition
To Pedestal
The Pedestal
Precisors
The Pick-Up Tool places the die on its Pedestal
The “PLACE”
The “PLACE”
The Blow-Off Pressure lays the die on the Pedestal
The “PLACE”
The Blow-Off Pressure lays the die on the Pedestal
The “PLACE”
The Blow-Off Pressure lays the die on the Pedestal
The “PLACE”
The Blow-Off Pressure lays the die on the Pedestal
The “PLACE”
The Pick-Up Tool moves back to continue another cycle
A certain valve activates a vacuum that holds the die towards the Pedestal once a high vacuum is detected on the Pedestal surface.
Die on the Pedestal
The “PLACE”
The Pick-Up Tool moves back to continue another cycle
A certain valve activates a vacuum that holds the die towards the Pedestal once a high vacuum is detected on the Pedestal surface.
Die on the Pedestal
The “PLACE”
The Pick-Up Tool moves back to continue another cycle
A certain valve activates a vacuum that holds the die towards the Pedestal once a high vacuum is detected on the Pedestal surface.
Die on the Pedestal
The “PLACE”
The Pick-Up Tool moves back to continue another cycle
A certain valve activates a vacuum that holds the die towards the Pedestal once a high vacuum is detected on the Pedestal surface.
Die on the Pedestal
The “PLACE”
The Precisors vibrate to move & correct die position on the Pedestal
Die on the Pedestal
The “PLACE”
The Precisors vibrate to move & correct die position on the Pedestal
Die on the Pedestal
The “PLACE”
The Precisors vibrate to move & correct die position on the Pedestal
Die on the Pedestal
The “PLACE”
The Precisors vibrate to move & correct die position on the Pedestal
Die on the Pedestal
The “PLACE”
The Precisors vibrate to move & correct die position on the Pedestal
Die on the Pedestal
The “PLACE”
The Precisors vibrate to move & correct die position on the Pedestal
Die on the Pedestal
The “PLACE”
The Precisors vibrate to move & correct die position on the Pedestal
Die on the Pedestal
Pedestal from Die Load to Unload Position
Once the Precisors are done, it is now ready to move to Die Unload Position at the Work Holder Assy. This time it releases (vacuum is deactivated) the die once bonded.
Load Unload
BOND FORCE
HEAT
WORKING ELEMENTS:
ULTRASONIC POWER
BOND TIME
3. BOND TIME
4. HEAT
WORKING ELEMENTS:
2. ULTRASONICPOWER
1. BOND FORCE
TO SUMMARIZE:
THERE ARE 2 MAJOR OPERATIONS IN TAB BOND PROCESS:- WAFER DIE PICK AND PLACE- SINGLE POINT TAB BONDING
WAFER DIE PICK AND PLACE OPERATION HAS THE FOLLOWING WORKING ELEMENTS:- PRE-PEEL & HOLDING VACUUM- PUSH UP & PICK UP FORCE- PICK & PLACE BOND TIME- BLOW OFF
TAB BOND OPERATION HAS THE FOLLOWING WORKING ELEMENTS:-ULTRASONIC POWER-BOND FORCE-BOND TIME-HEAT
THE TAB BONDING PROCESS IS NOT SUCCESSFUL WITH THE ABSENCE OF ANY OF THE WORKING ELEMENTS.
Tab bonding is a process of interconnecting inner-bonding pads of a dice to lead sites of tab circuit by means of single point thermosonic energy (combination of heat energy, ultrasonic energy and force) that forms an intermetallic (adhesion) bond between the die bonding pad and circuit leads.
THE END
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