SPIE 8169_12, Optical Design Conference Marseille, Wafer-Level Micro-Optics, Sept 7, 2011
38
Wafer-Level Micro-Optics: Trends in Manufacturing, Testing and Packaging Reinhard Voelkel, Kenneth J. Weible, Martin Eisner SUSS MicroOptics SA, Neuchâtel, Switzerland [email protected], www.suss.ch SPIE 8169-12
-
Upload
reinhard-voelkel -
Category
Technology
-
view
1.367 -
download
2
description
Micro-optics is an indispensable key enabling technology (KET) for many applications today. The important role of micro-optical components is based on three different motivations: miniaturization, high functionality and packaging aspects. It is obvious that miniaturized systems require micro-optics for light focusing, light shaping and imaging. More important for industrial applications is the high functionality of micro-optics that allows combining these different functions in one element. In DUV Lithography Steppers and Scanners an extremely precise beam shaping of the Excimer laser profile is required. High-precision diffractive optical elements are well suited for this task. For Wafer-Level Cameras (WLC) and fiber optical systems the packaging aspects are more important. Wafer-Level Micro-Optics technology allows manufacturing and packaging some thousands of sub-components in parallel. We report on the state of the art in wafer-based manufacturing, testing and packaging. Keywords: Micro-optics, microlens array, diffractive optical elements, wafer-level optics, wafer-level packaging, beam shaping, fiber coupling, array illumination, Shack-Hartmann, confocal microscope, slow-axis collimator.
Transcript of SPIE 8169_12, Optical Design Conference Marseille, Wafer-Level Micro-Optics, Sept 7, 2011
Wafer-Level Micro-Optics:
Trends in Manufacturing,
Testing and Packaging
Reinhard Voelkel, Kenneth J. Weible, Martin Eisner
SUSS MicroOptics SA, Neuchâtel, Switzerland
[email protected], www.suss.ch
SPIE 8169-12
SUSS MicroOptics – We Set The Standards
World leading supplier of high-quality Micro-Optics
More than 200 active customers
Part of the SUSS MicroTec Group (www.suss.com)
Neuchâtel, Switzerland
SUSS MicroOptics is “Preferred Supplier” for Carl Zeiss SMT
DUV Laser Beam Shaping Solutions for ASML Litho Stepper
Industrial optics manufacturing
started around 1840
Source: www.wikipedia.org
Microscopy and photography
were the technology drivers.
Cameras and binoculars were the
first optical consumer products.
Micro-Optics was not an issue.
Gabriel Lippmann (1845 – 1921)
1891 Interference Color Photography
Wavelength-selective volume holograms
1908 Integral photography
Auto-stereoscopic method to display 3D
images for observation with the naked eye
1908 Nobel Prize
Source: www.wikipedia.org, www.google.com/patents
Walter R. Hess: Stereoscope Images
1912 Parallax Panoramagrams
Array of cylindrical microlenses for 3D displays
Working as a doctor (Ophthalmologist)
Nobel prize for Physiology
Source: www.google.com/patents
Microlens Arrays for Color Photography
1925 “Gaffered film” Paul Fournier
Microlens arrays on film to separate the color
US Patent 1,746,584,
Source: www.google.com/patents
Köhler Integrator – Fly‘s Eye Illumination
Source: www.wikipedia.org, www.google.com/patents
Many Innovative Ideas for Micro-Optical Systems
US Patent 1762932, Mihalyi, Fly‘s Eye Condensor for Projector, 1927
US Patent 2018592, Arnulf, 1932 US 2351034 Garbor „Superlens“, 1940
Source: www.wikipedia.org, www.google.com/patents
How to
manufacture
Micro-Optics?
Source: www.google.com/patents
Maurice Bonnet (1907 – 1994)
Maurice Bonnet and the lathe used to
engrave lenticular screens for integral
photography*
*Photo: Coll. Michèle Bonnet from Michel Frizot, “Lenticular screen systems and Maurice Bonnet’s process”, from catalog
of exhibition “Paris in 3D” at Musée Carnavalet, ISBN: 1861541627 (2000)
ww2.cnam.fr
Source: www.wikipedia.org
Jean Hoerni (1924 – 1997): “Planar Process”
1959 Fairchild
Semiconductor
1963 First Karl Süss
Mask Aligner
Jean Hoerni at Fairchild
Source: www.wikipedia.org, www.google.com/patents
Computer Generated Holograms
Digital Optics
Planar Optics
Source: www.wikipedia.org
Micro-Optics Technology 1971 Josef Hanak, dry etching of holograms
1977 Mike Gale, multi-level diffractive optics
1982 Kenichi, stacked planar optics
1985 Zoran Popovich, melting resist microlenses
Multi-Level DOE Dry-etching of holograms in glass
Melting resist microlenses
Stacked planar micro-optics
Source: www.google.com/patents
Ideas and micro-structuring
technology developed in
Semiconductor industry enabled
Micro-Optics manufacturing.
Wafer-Level Micro-Optics!
Wafer: SEMI Standards 3-inch (76 mm)
4-inch (100 mm)
150 mm (referred to as "6 inch")
200 mm (referred to as "8 inch")
300 mm (referred to as "12 inch") 8’’ Wafer-Technology
Coater Mask Aligner Wafer Bonder Plasma Etch
PHOTORESIST PROCESSING
A thick resist layer
Photolithography
Resist cylinders
Melting at 150°C.
REACTIVE ION ETCHING
Reactive Ion Etching (RIE)
Profile shaping by changing etch ratio
Aspherical profiles with high precision
Metrology for Micro-Optics
Manufacturing
Phase profile of a densely packed array of 16-level DOEs
measured in white light profilometer Wyko NT3300
Aspherical Microlenses in Fused Silica
Comparison of measured lens profile (blue line) to ideal lens profile (dotted line) for
a microlens of 1.08mm lens diameter and 93µm sag height etched in Fused Silica.
Asphere, conic constant k = -1
Deviation of measured lens profile, expressed by a 12th degree polynomial fit, versus
the ideal lens profile. A deviation of 154.8nm (rms) from ideal lens profile is obtained.
Aspherical Microlenses in Fused Silica
Uniformity of Photoresist ±0.61% (p-v)
High-Quality Diffractive Optical Elements (DOE)
8‘‘ wafer scale
190nm to 10µm wavelength range
0.5 μm min feature size
< 50nm overlay accuracy
Binary, 8-level, 16-level
Upto 98% diffraction efficiency
Hybrid Micro-Optics on Wafer-Level
Refractive Microlens Arrays
Diffractive Optical Elements (DOE)
Trenches, posts, grooves, holes
Full wafer-level integration
Hybrid Micro-Optics for Fiber Communication
Micro-Optical Fiber Coupler for communication industry
(ROADM, WSS, Transceiver...)
High-quality Micro-Optics for most competitive prices due to
8’’ wafer manufacturing
Packaging concepts for systems! Wafer-Level Packaging (WLP)
Wafer-Level Camera (WLC)
Scheme: Patent WO 2007 030226
Source: Fraunhofer IOF (Jena), www.wikipedia.org, www.google.com/patents
Thin wafer handling
Lens Imprint Litho (SMILE)
Wafer-Level Packaging (WLP)
Wafer-Level Camera (WLC)
Reinhard Voelkel, Martin Eisner, SUSS
MicroOptics SA, www.suss.ch
Lens Master Thin Wafer Handling Imprint Lithography Wafer-Level Packaging Wafer Dicing
SUSS MicroTec Mask Aligner: MA/BA8 Gen3
© Awaiba
© IOF
Micro-Camera for CMOS imagers
Wafer-Level Packaging (WLC)
NanEye WLC Camera (Awaiba)
for disponible endoscopes
German Research Project COMIKA (2008-2011)
Source: COMIKA, www.awaiba.com
Ultra-Flat Cluster Cameras
WALORI (2002 – 2005)
?
Jacques W. Duparre, Peter Schreiber, Peter Dannberg, Toralf Scharf, Petri Pelli, Reinhard Voelkel, Hans-Peter Herzig and
Andreas Braeuer, "Artificial compound eyes: different concepts and their application for ultraflat image acquisition sensors",
Proc. SPIE 5346, 89 (2004); doi:10.1117/12.530208
Source: Fraunhofer IOF (Jena), www.wikipedia.org
Micro-Optics in Front-End Lithography
Source: ASML, Nikon, Canon; www.google.com/patents
Key Enabling Technology
Diffractive Optical Elements (DOE)
MEMS Mirror Arrays (FlexRay™)
Customized Illumination
Excimer Laser (193nm)
Laser Beam Shaping
Laser Beam Homogenizing
Customized Illumination
Pupil Shaping (DOE)
Now: FlexRay™
programmable illumination
technology from ASML
Microlens Köhler Homogenizer
Advanced Mask Aligner Lithography (AMALITH)
Microlens Array
Optical System MA 200
Library of
Illumination
Filter
Plates (IFP)
Microlens Optical Integrators
MO Exposure Optics (patent pending)
AMALITH: Pinhole Talbot Lithography
Simple pattern change with pixelated
Illumination Filter Plate (IFP)
Pinhole Lithography Multiple „Camera Obscura“
Full-wafer proximity
lithography suitable for
periodic structures.
IFP
SUSS Mask Aligner MA6
+ MO Exposure Optics
+ Customized Illumination
+ Pinhole Mask
+ Proximity Gap 66µm
33
AMALITH: Pinhole-Talbot Lithography
Flowers 4 µm
Pitch 5 µm
Resist 2 µm thick
Etching RIE (Bosch) Silicon
Proximity Gap 102 µm
Mask Aligner MA8/BA6
34
0.8 µm
SUSS Mask Aligner MA6
+ MO Exposure Optics
+ Customized Illumination
+ Half-tone photomask*
+ Proximity Litho, Gap 10µm *Half-tone photomask (dot-size 450nm), E-Beam written
AMALITH: Half-Tone Lithography
T. Harzendorf, L. Stuerzebecher, U. Vogler, U.D. Zeitner, R. Voelkel,
“Half-tone proximity lithography”, Photonics Europe, Conf. on Micro-
optics Fabrication Technologies, 7716-34, April 12-16, 2010
AMALITH: Blazed Gratings on Wafer-Level
T. Harzendorf, L. Stuerzebecher, U. Vogler, U.D. Zeitner, R. Voelkel,
“Half-tone proximity lithography”, Photonics Europe, Conf. on Micro-
optics Fabrication Technologies, 7716-34, April 12-16, 2010
Solutions for Semiconductor Technology
Industrial Optics & Vision
Healthcare & Life Science
Metrology
Laser & Material Processing
Optical Communication
Packaging 8’’ Wafer Technology Wafer-Level Packaging Pin-Holes, Crosses, Marks
Diffractive (DOE) Beam-Shaping Elements Mode Scrambler
Refractive (ROE) Microlens Arrays Fiber Coupler
Communication Telecom, Datacom, Fiber Optics, Transceiver, Switches, Camera, MEMS
Equipment Semiconductor, Photolithography, Illumination Systems
Optics, Life Science Optical Instruments, Confocal Microscopy, Healthcare, Laser Systems, Sensors, Metrology
Key Enabling Technology
High-Quality MicroOptics in Wafer-Technology
SUSS.
Our Solutions
Set Standards
SUSS MicroOptics SA Rue Jaquet-Droz 7
CH-2000 Neuchâtel
Switzerland
Tel +41-32-720-5104
Fax +41-32-720-5713
