Self Sys 2010

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SELFSYS - Fluidic-mediated self-assembly for hybrid functional micro/nanosystems

Fluidicmediated

self

assembly

for

complex,

hybridmicro/nanosystems

J.Brugger,A.Martinoli,N.Spencer,B.Nelson,

H.Wolf,

H.

Knapp,

L.

Sciboz

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Assembly challenge of N/MEMS

Today

Many different kinds of

micro/nano devices, MEMS,

S&A, CMOS, OLED, etc

The challenge of tomorrow

Finding a way to assemble the

bricks into functional

micro/nano-systems

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State of art for multifunctional N/MEMS

Co-integration (if possible)

Separate fabrication followed by joining

Wafer Bonding; Tape automatic bonding Pick & Place; Robotic assembly

Challenge for highly miniaturized systems Challenge for very large numbers of components

SELFSYS:

Contribute with enabling manufacturing forfuture micro-assembly applications

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Fluidic mediated self-assembly

Known concept in R&D

Using surface tension forces to align components

First industrial examples emerging RFID on antenna assembly

Solder bumps

Srinivasan, Boehringer

LubricantHydrophobic area

Mastrangeli, van Hof, Lambert

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SELFSYS concept goes further

Fabricate different parts withconventional techniques

Immerse parts in liquid for mobility andrandom motion

Use templates and forces to steermotion (surfaces, fields, channels,flow, etc)

Main goals: High assembly rate by self-organization

Liquid inside the N/MEMS

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SELFYS synapsis

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SELFSYS team

N/MEMS: J. Brugger(EPFL)

Distributed systems: A.

Martinoli (EPFL)

Surface chemistry: N.

Spencer (ETHZ)

Nano-Robotics: B. Nelson

(ETHZ) Microfluidics: H. Knapp

(CSEM)

Self assembly: H. Wolf

(IBM)

RFID: L. Sciboz (icare Sion)

MaurizioGullo(EPFL) Venkataraman Nagaiyanallur (ETHZ)

DidiXu(ETHZ) JonasWienen (CSEM)

GregoryMermoud(EPFL) Loic JacotDescombes(EPFL)

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Progress within Selfsys

MEMS part fabrication

Surface functionalization

In-liquid self-assembly experiments

Field induced assembly

Template induced assembly

Modeling+++

V

~

RFIDchip

Goldbump

antenna

8

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Investigated shapes

Shape: Main

material:

Expected

advantages:

Expected

disadvantages: Scheme: Picture:

1Disc

slices SU8

notrestricted

topairs

lowSAyield

2Flat

cylinders SU8

easy

fabrication

andhandling

assembly

possible on

oppositeside

3Rounded

cylinders SU8

higher

pairingyield

4Half

spheres

SU8or

Ormocomp

evenhigher

yieldinSA

smallervolume

(cavity)

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Surface Modification of SU8

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Plasma treatment:

CA7080deg

CA

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Covalent Immobilization of Polymers

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PolymerlinkerlayerPolymerlinkerlayer

SU8SU8

SiliconSilicon

SurfacepolymerlayerSurfacepolymerlayer

Polymer backbone

Photo-cleavable linker

Polymer backbone: Polyethylene imine (PEI) or

Polyallylamine (PAAm)

Photo-cleavable linker: Perfluorophenyl azide (PFPA)

Yan,M.;Ren,J.CovalentImmobilizationofUltrathinPolymerFilmsby

ThermalActivationofPerfluorophenylAzide,Chem.Mater.2004,16,

16271632.

Graft co-polymer consisting of a polyelectrolyte backbone and a photo-cleavable

linker

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AuAu

PR

UVUV

Ink Jetted Capsules

PDMS SiSi

PR

SiSi

Ethanol+Thiols

Thiols

Au

hydrophobic

hydrophilic

Printing UVcuring Releasing

Functionalizing Self assembly Zoomed

view:

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Force measurements by AFM methods

HalfspheregluedonAFMcantilever

Opticalmicroscope

image.

DIwaterDIwater

Au+Thiols

Attraction10nNat50nm

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+++

Dielectrophoretic assembly of

RFID chips

Antenna as electrodes to exert a non-uniform electric field

Induce dipole on micro-part (e.g. RFID chip)

V

~

RFIDchipGoldbump

antenna

DEP force to push it towards the electric field maximum

DEP torque to align it along the field

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DEP assembly of RFID chips on the antenna

RotationalmotionofRFIDchip

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Monza2diesandantenna

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Fluidic system for micro-part assembly

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Fluidic system for micro-part assembly

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Video

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Second generation geometry

Usingbeadstoclosecapsule

Improvedsealingexpected

Fabricationprocess

in

preparation

IBMZRL

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Capillary assembly for placing the beads

Fcapillary

Flow

Assemblyof500nmPSparticlesonPDMSIBMZRL

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Self-assembling swarm robots

EPFL/DISAL

A.Martinolietal.

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Power

to

move

Simpleonboard

intelligence

Collectivebehavior

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Technologies

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Liquid release from micro-capsule

Selfassembled Blue

ink

encapsulated Ink

released

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Conclusions & Outlook

Shape and geometry optimization (round vs flat)

Surface functionalization (photocleavable linker on SU-8)

Interaction force measurement (AFM in liquid)

In-liquid assembly studies as function of activation (feeding

through channels)

Field-induced assembly (DEF)

Distributed robotics modeling

microparts with functionalized surface to study assembly yield

encapsulate liquid inside a micro-part release mechanism of liquid upon trigger input

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Self Sys 2010

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