Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University
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Transcript of Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University
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Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale UniversityHucheng Chen, James Kierstead, David Lynn, Sergio Rescia, BNL
Marc Weber, RALChris Musso, Allen Mincer NYU
Plug In Cardwith Commercial Buck Converters
ATLAS Tracker Upgrade Workshop, Amsterdam 03 - 07 November, 2008
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Load0.25 µm Technology Test ASIC 2.5 V @ ~ 3 amps0.13 µm Technology ASIC 1.3 V @
Monolithic Commercial ConvertersST 1S10 18V 3 ampsMax8654 12V 8 amps
Following To be available early in 2009
ST L5988 18V 4 ampsTI TPS54620 17V 6 amps 0.35 µm BCDAD21xx 20V 3 amps 0.35 µm CMOSNational 20V 3 amps 0.25 µm CMOSEnpirion 12V 6 amps 0.25 µm CMOS
Vin = 2.5 – 17 VVout = 2.5 / 1.3 V
Enable
29 October, 08 Plug in Card – Power
GNDGND
Power Good
RequirementsVoltage Ratio > 8For Good Efficiency Iout >3 ampsAir Coil / MagneticsRadiation Hardness
Small Plug-in Card
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3 Sizes of Spiral Coils Coil with Ferrite
Silicon Chip Size 0.3x 0.3 cm
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17 V
5 V
Enable
Power Good
PWM Controller
Buck Converter
Controller : Low VoltageHigh Voltage: On Switches- LDMOS, Drain Extension, Deep Diffusion etc
30 mΩ Switch
20 mΩ Switch
Noise Pick-up with Vin / Vout > 8 Previously studies done with Vin ~ 5.5 V
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Coil Spacing 100kHzFar – 1.5” L 0.976 μH
R 0.183 ΩNear – 0.006” L 1.751 μH
R 0.184 ΩTouching – <0.001” L 2.150 μH
R 0.185 Ω
Medium Coils
Large Coils
2 oz copper for coils,
6 mill spacing with Kapton
Proximity Effect
For Larger Inductanceconnect coils in series
LCR Meter of Teaching LabCalibrator disappeared !!!
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A proximity effect is seen in the spiral coils
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0 0.5 2.51.51.0 2.0Output Current (amps)
3.0
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Not Enough Inductance
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MAX8654: Ser. #1
Vout=3.3 V
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MAX8654 #1, Vin = 14.1 V
MAX8654 #1, Vin = 12.0 V
MAX8654 #1, Vin = 10.0 V
MAX8654 #1, Vin = 8.0 V
MAX8654 #1, Vin = 5.8 V
Vin / Vout = 4.3
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Pin Comment33,35,37,39 Digital Power In34,36,38,40 Digital Return (Hybrid Ground)41,43 Auxiliary Analogue Power In42,44 Auxiliary Analogue Return45 HVRet52 HV (Sensor Bias)
Size= 10 x 10 mm or Smaller
Version of Plug in Cards1. Coil: magnetic / Air2. Heat Removal3. High Voltage Ratio4. Al Power Conductors
GoalA Component that can be wire bonded
To Hybrid ( Like ABCD Chips)
SILICON
CoilCoil
ConnectorPlug-in Card
Shirking of Power Packages by 3D
SOC Package
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Efficiency versus Output Current Vout = 1.8V
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EN5360 #2, Vin = 5.4 V
EN5360 #1, Vin = 5.4 V
EN5365 #1, Vin = 5.5 V
EN5360IHP Foundry
EN5365Korean Foundry
Both are can be used for Space Applications IHP Foundry for HEP
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Visit IHP Microelectronics, Frankfurt (Oder)03 November 2008
Aachen (Lutz Feld +3) + Yale (Satish Dhawan)
IHP Prof Bernd Tillack- Deputy Scientific Director Dieter Knoll – Technology Head Roland Sorge – Device Engineer Ulrich Jagdhold Systems Engineer
85 % Public Funds 250 people. 50 Wafers / week. Capacity 150 Wafers Up to 80 GHz Circuits Try to understand why Hard IHP made devices are Radiation LDMOS Lateral Diffused MOS Transistor Switches. Use N & P Channel Sending above Devices for Radiation Testing Developing New Device Structure for 12 Volts 0.25 m Technology Test New LDMOS Devices with Buck Controller
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The End Lonely @ Top of the World