Reliability Testing and Product Qualification Mark A. Burns
Transcript of Reliability Testing and Product Qualification Mark A. Burns
© 2002 IBM Corporation
IBM Technology Group: Microelectronics Division
Reliability Testing and Product QualificationMark A. Burns
Reliability Testing & Product Qualification
2003 IBM Corporation
Mark A. Burns, [email protected] Reliability & QualificationMicroelectronics DivisionIBM Technology Group
Mr. Burns has worked as an engineer in Product Reliability and Qualification in the Microelectronics Division of IBM Technology Group since 1989. He joined IBM in its Federal Systems Division in 1987 with an M.S. in Mechanical Engineering from Standford University and B.S. in Mechanical Engineering from the University of Notre Dame. While at IBM Federal Systems, Mr. Burns worked on avionics installation, on simulation development, and in human factors engineering. Since joining IBM Technology Group, he has worked on reliability and qualification of semiconductor products and packaging technologies. Mr. Burns is an IBM representative to JEDEC on reliability testing, qualification methods, and quality systems since 2002. He achieved Certified Reliability Engineer designation by the American Society for Quality in 1994.
Presenter
Reliability Testing & Product Qualification
2003 IBM Corporation
IBM Microelectronics Quality SystemDevelopment ProcessQualification
Technology FeasibilityTechnology QualificationProduct Qualification
Quality and Customer SatisfactionSummary
Contents
Reliability Testing & Product Qualification
2003 IBM Corporation
- Customer Surveys- Returns Support- PCN Notification
Technology Qualification Product Qualification Manufacturing Quality
Market Research
Development Manufacturing
Customer
Total Team Effort
Sales Support
- Qualify technology structures - Verify wearout performance- Qualify Design Rules- Identify Critical Controls
- Set/verify product requirements- Functionality verification- Reliability assessment
- Supplier Quality Management- Change Control Management- Nonconforming Product Control- Reliability Monitoring- ISO Compliance Assurance- Customer Returns Support
- Technology Developmentprocess & design rules
- Product DevelopmentdesignprototypeRamp to Production
-Tool/Process/Equipment Controls- Electronic Routings- SPC- Product Traceability- Inspections- Voltage Screens & Burn-in
Continuous Improvement- Corrective and Preventative Actions- Adhere to the Quality Policy
Quality System
Reliability Testing & Product Qualification
2003 IBM CorporationIntegration of Technology Process
Structured Decision Making Process (Go/No-Go funding decisions)
Cross-functionalProjectTeams
Cross-Project Management Process
Functional Organizations
Supporting Measurements and Systems
ConceptDCP
PlanDCP
ResultsDCP
PDT LMT
IPMT
Structured Development ProcessLaunch
ReadinessDCP
TECHNOLOGY DEVELOPMENT
PRODUCT REV. TO RELEASE TO MFGCONCEPT SPEC&PLAN
DESIGN TO FIRSTSAMPLE EVAL.
LAUNCH THROUGHSTABLE MFG
LIFE-CYCLEMGMT
Tech /ProductDevelopment
Product Development
Reliability Testing & Product Qualification
2003 IBM Corporation
TECHNOLOGY DEVELOPMENT
PRODUCT REV. TO RELEASE TO MFGCONCEPT SPEC&PLAN
DESIGN TO FIRSTSAMPLE EVAL.
LAUNCH THROUGHSTABLE MFG
LIFE-CYCLEMGMT
Tech /ProductDevelopment
PQ Level
Qualification Complete
Qual.Activities
CustomerActivities
ProductQualityLevels
TechnologyFeasibility (TO)
Mfg Ramp
Q Level
Product Qualification (T2/SQ)- Reliability- Functionality- Application- Manufacturability
Early Product Evaluation (EPE)
Tech Mfg Readiness (TMR)
SupplementalQualifications- Process EC's- Additional Fabs (LQ)
MFG KeyActivities
P Level
Application Partnering
Samples CustomerShip
FirstDesign
T2Qual
Read.QA/EC
Line
EUHHardware
T1QualRead.QA/EC
Line
TechnologyEvaluation (T1)
Qualification & Sustaining Quality
Reliability Testing & Product Qualification
2003 IBM Corporation
Qualification: Reliability ManagementQualification Phases cover all reliability characteristics & driver types
Use Hours
Failure
Rate
Useful Life
InfantMortality Wearout
Reliability Testing & Product Qualification
2003 IBM Corporation
Reliability Components
Component Source Management Strategy
Wearout Technology robustnessDesign groundrules & simulation to remove from useful life regime
SystematicsProcess control issuesMaterial changes
Layout groundrule robustnessProcess controls
Random Defects Cleanliness Defect reductionScreening
Reliability Testing & Product Qualification
2003 IBM Corporation
Qualification & Sustaining Quality
PRODUCT REV. TO RELEASE TO MFG LAUNCH THROUGH
TECHNOLOGY DEVELOPMENT
STABLE MFG
PQ
Qualification Complete
Qual.Activities
ProductQualityLevels
Technology Feasibility (TO)
Q
Product Qualification (T2)- Reliability- Functionality- Application- Manufacturability
Early Product Evaluation (EPE)
Tech Mfg Readiness (TMR)
SupplementalQualifications
- Process EC's- Additional Fabs (LQ)
P
P Level assigned to first pre-T1 lot and any RTAT Processed that skips QA Checks/screens
Technology Evaluation (T1)
Wearout control focus.............Defect control focus
Reliability Testing & Product Qualification
2003 IBM Corporation
Major Qualification Phases
T0
T1
T2
Technology Feasibility Materials & device viability
Technology Qualification Robust integrated process for designing
Product Qualification Qualification of component in manufacturing
Reliability Testing & Product Qualification
2003 IBM Corporation
Technology Feasibility (T0)
ProposedTechnology,
Application Space,Product(s)
Test sites: wafer, chip, package Possible material sets Device definitions
to select viable technology definition
Goal:Single Integrated
Process for Validation
Reliability Testing & Product Qualification
2003 IBM Corporation
Identifies process and design limits of technologyDeviceNew materialsDimensional/lithographic viability
Typically includesDozens of wafersHundreds or thousands of test sitesHundreds of packaged test vehicles
Can include evaluations for Chip device
Hot carriers, NBTI, gate dielectric breakdownChip wiring
Electromigration, stress migration, cycling, moisture resistancePackage compatibility
Flip chip electromigration, cycling, moisture resistance, bondability
Technology Feasibility (T0)
Reliability Testing & Product Qualification
2003 IBM Corporation
Technology Qualification(T1)
T1
Integrated process robustness, reliability, & manufacturing feasibility
Test site reliability, yield, & parametric performance on pilot manufacturing line
For product designsDevice models & groundrulesReliability models to control wearout & other robustness guidelines
Business commitment to
invest in manufacturing
capacity
Product committed to revenue plan
Reliability Testing & Product Qualification
2003 IBM Corporation
Technology Qualification (T1)Reliability testing emphasizes
Fully integrated test structuresVerifying design groundrules for reliability
Reliability testing may includeDevices (FEOL)
HCI, NBTI, gate dielectric TDDB, Radiation-Induced Soft Error Rate, ring oscillator characterization
Chip Interconnect (BEOL)EM, Stress Migration, TC, TDDB, THB
Early product life testingPackage
TC, THB, HAST, PCT, EM (C4), Wirebond evaluationsATC at card level
New materialsDimensional/lithographic viability
Typically includesHundreds of wafersThousands of test sitesHundreds of packaged test vehiclesMultiple fabrication lots
Reliability Testing & Product Qualification
2003 IBM Corporation
Environmental Stress
Robustness
HTS
Component qualificationBased on manufacturing line with full in-line quality control and a qualified tool setConsiderations can include
Product Qualification (T2)
Component Qualification
ApplicationDefinition
Functional Verification
Customer Verification
Manufacturability
I/O Robustness
Defect-Based Reliablity
Assembly Compatibility
Radiation-Induced Soft Error Rate
Characterization
SPQLHTOL
EFR
ESDLatch
Up
T/C THBHAST
StressFunction
Reliability Testing & Product Qualification
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Typically includes Accelerated testing on
Hundreds of fully functional componentsHundred of packaging test vehicles3-5 lots to evaluate consistency
Product Qualification (T2)
Reliability Testing & Product Qualification
2003 IBM Corporation
Most commercial suppliers use JEDEC methodologies or variations for standard (COTS) productsJEDEC sanctions two principal component qualification methodologies:
Product Qualification (T2)
Acceptance TestingApplication-Specific
Reliability Assessment
JEDEC-STD-47 JEDEC-STD-94(in approval)
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2003 IBM Corporation
Component qualification at IBM Microelectronics Utilizes some acceptance testingEmphasizes personalized
Stress designResults interpretation
Based on application and lifetime requirementsDepends heavily on developing models to translate accelerated data to application terms
Defect-based component reliability is a prime focus of modeling efforts
Product Qualification (T2)
Reliability Testing & Product Qualification
2003 IBM Corporation
Defect-based component reliability is a prime focus for modeling effortsTime distributionAccelerationScreening effectiveness
IBM generally utilizes a Weibull distribution for defectsIBM generally develops a single model to represent the composite of reliability detractors in the absence of a dominant, novel mechanism
Modeling for Components
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Typical defect acceleration parameters includeTemperature ~ Arrhenius:
ln AF(T) ~ Delta H / kB ((1/Tuse) - (1/Tstress)), whereDelta H is empircally derived (in eV)kB = the Boltzmann constantT = temperature (in deg K)
Voltage ln AF(V) ~ GammaV(Vstress-Vuse), where
GammaV is empirically derived
Others
Acceleration Modeling
t
Cu
mu
lati
ve F
allo
ut
Condition 2
Condition 1
Condition 3Acceleration
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Electron MicroscopyScanning Electron MicroscopeTransmission Electron MicroscopyElectron microprobe analysisDual beam Focused Ion Beam
Surface analysisAuger Electron SpectroscopyLow energy X-ray analysis: XPS and ESCASecondary ionic mass spectroscopy: SIMS and TOF SIMSAtomic Force Microscopy
Chemical analysisFTIRLaser RamanSpectrometryDefraction / X-ray analysis
Full metallography labs
Diagnosis of Fallout
Reliability Testing & Product Qualification
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FIB SRAM Electrical Characterization: " Wagon Wheel"
Failure Analysis: Electrical Isolation
Reliability Testing & Product Qualification
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Failure Analysis: Cross-Sectional Analysis
Reliability Testing & Product Qualification
2003 IBM Corporation
Development cycle compression pressuresOpportunities for learning feedbackTest vehicle adequacyChange management
Application definitionsUntapped leverage in definition qualityEmphasis on application distributions (vs. extreme corners only)
New application spacesContinued autonomy of component reliability
Untapped leverage in system reliability partnershipNew supplier models beyond traditional models for Integrated Device Manufacturer (IDM) for finished components
Qualification Challenges
Reliability Testing & Product Qualification
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Qualification and Reliability Evaluation are one step in producing a Quality ProductAlso required
Manufacturing Quality ManagementSupplier Quality ManagementOngoing MonitoringContinuous ImprovementClosed Loop Customer Feedback
Net --- A Total Quality Management SystemThese are critical in providing consistent Quality to your customer for achieving Customer Satisfaction
Sustaining Customer Satisfaction
Reliability Testing & Product Qualification
2003 IBM Corporation
In-line screens and monitors Test site structures, discrete componentsProduct burn-inAccelerated stress on product samples
Next-level assembly feedbackChip-to-carrierComponent-to-cardCard in system test
Field installation feedbackDOA'sEarly life failsExtended life fails
Failure analysis to root cause drives corrective actionImmediately implement screens (a "picket fence")Drive to problem solution (a "brick wall")
Sustained Reliability Learning
Reliability Testing & Product Qualification
2003 IBM Corporation
Qualification phases synchronized to development phases Accelerated reliability testing is vital to cost-efficient qualifications
Necessitates understanding Materials properties and limitsApplication conditionsCustomer lifetime
Sustained high quality products and customer satisfaction require a complete Quality Management System, not just Qualification
In conclusion
Reliability Testing & Product Qualification
2003 IBM Corporation
(c) Copyright International Business Machines Corporation 2003
All Rights Reserved
Printed in the United States of America 2004
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