Pump Sources and Related Devices for High-Power Fiber ... · PDF filePump Sources and Related...

41
Pump Sources and Related Devices for High-Power Fiber Laser Systems Christoph S. Harder ETH Zürich, SWITZERLAND [email protected]; +41 79 219 9051 OAA, Whistler Mountain, June 25, 2006

Transcript of Pump Sources and Related Devices for High-Power Fiber ... · PDF filePump Sources and Related...

Page 1: Pump Sources and Related Devices for High-Power Fiber ... · PDF filePump Sources and Related Devices for High-Power Fiber Laser ... OAA, Whistler Mountain, June 25, 2006. 2 O A A

Pump Sources and Related Devices forHigh-Power Fiber Laser Systems

Christoph S. Harder

ETH Zürich, SWITZERLAND

[email protected]; +41 79 219 9051

OAA, Whistler Mountain, June 25, 2006

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Overview

Fiber Laser

MOPA: Seed laser and amplifier

Seed Lasers

Switching speed

Pump Diode

Yb fiber wavelength bands

Diode heat removal

Pump power injection

Cost

Reliability

Diode reliability

Fiber reliability

System robustness

Acknowledgement: B. Schmidt (Bookham), T. Strite (JDSU), K. Eberl (Lumics)

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Fiber Laser: MOPA

Seed laser Fiber laser: Good spectral control

Need external modulators (Lithium Niobate waveguide, etc)

Diode laser: Excellent dynamic control FP laser have poor spectral control, of no concern

DFB have excellent spectral and dynamic control

Pumplaser Single broad area MM diode Barstack

Seed laserPump Diode

Pump Diode

Dual Clad Yb

MMPMFPMF

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www.bookham.com

1060nm seed laser

• Pump laser diodes have excellent dynamic characteristics in standardpump butterfly package

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1W 1064nm SEED-laser module

Damped RO

2.2mm Laser Ex1947 / Puls Reponse @ 100mA Bias

0.000

0.002

0.004

0.006

0.008

0.010

0.012

0.014

0.016

0.018

0.00E+00 2.00E-09 4.00E-09 6.00E-09 8.00E-09 1.00E-08

Time (s)

Po

wer

(a.u

.)

Data

Simulation:fg (3dB): ~400MHzMeasured data

Damped RO

2.2mm Laser Ex1947 / Puls Reponse @ 100mA Bias

0.000

0.002

0.004

0.006

0.008

0.010

0.012

0.014

0.016

0.018

0.00E+00 2.00E-09 4.00E-09 6.00E-09 8.00E-09 1.00E-08

Time (s)

Po

wer

(a.u

.)

Data

Simulation:fg (3dB): ~400MHzMeasured data

5ns

Also available with externalstabilization and kHz bandwidth

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4Seed Lasers1060nm DFB

DFB has stable, narrow spectrum and can be switched on and off at high speeds

2005, C. E. Zah et al, Corning

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Yb fiber wavelength bands

Yb: Glass fiber absorption and emission spectrum

Wide pump band: 870nm to 980nm

Red band (976nm): Highest absorption, narrow width Preferred for high gain amplifiers and q-switched lasers with short fiber (SBS) Pump diode challenge: Diode wavelength control (+/-2nm) necessary

Blue band (915nm): Good absorption, wideband Preferred for lower power stage Pump diode requirement: Good reliability at 920nm. Possible

Green band (940nm..960nm): Lowest absorption, wideband, high optical conversion Preferred for very high power stage Easiest for pump diode

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4Yb fiber wavelength bands976nm band Single mode pump diode external grating stabilization

Established acceptance (reliability) through tremendous effort

2001, Bookham S. Mohrdiek et al.

Pump diode wavelength temperature shift Free running FP diode: 0.3nm/K DFB: 0.1nm/K

-> External grating for +/- 2nm stability MM external stabilization: Very active field and good progress

Nevertheless: Very challenging locking range, efficiency, noise and reliability

Cost

->976nm band: Most likely limited for very special applications

960 970 980 990 1000 1010 1020-50

-40

-30

-20

-10

0

35 nm

0 20 40 60 80 100980.0

980.2

980.4

980.6

980.8

wa

ve

len

gth

(nm

)

tem perature (oC)

T=80oCT=-10

oC

op

tic

al

po

we

r(d

B)

wavelength (nm)

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SES8-9xx-01: Reliability assessment

COD level versus time @ 915nm wavelength

Stable COD level at around 22A injection current (in average) equivalent to 17.5Wout of a ~90um aperture (over 2000h test time at 9A, 25 °C)

Pump Diode Challenge: Reliability at 920nm Feared: COMD degradation at high operating power

2006, Bookham, B. Schmidt et al.

“920nm Reliability Challenge” solved through facet passivation techniques

-> 920nm Band: Preferred for high absorption cross section applications

Yb fiber wavelength bands920nm band

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4Diode heat removalDiode power conversion

Material limits: Even after optimized mirror losses (Sf , Rf , Rb ) and low threshold current. Due to limited mobility and carrier mass there are always trade-offs in

doping levels (series resistance Rs vs free carrier absorption) and

Bandgap discontinuities (leakage losses vs injection barriers)

Today’s approach: InGaAlAs material system

Asymmetric (thin p-region), low aluminum, low confinement LOC, low doping levels Holes have poor conductivity and high free carrier losses.

Relatively low barriers for high mobility and good injection (some thermal and vertical leakage)

PVIout

VI

P

)ln(2

)ln(

)ln(1

1

ff

bf

P

R

L

R

RS

seshFeFhfV RRV

IEE

eVhE

eV

111

I

I

I

I leakthI 1

Doping levels1. Series resistance2. Mainly free carrier absorption

Bandgap discontinuities1. Thermal and vertical leakage2. Injection barriers

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www.bookham.com

CW-operation= 920 nm

Bookham: SES8-9xx-01 Product

>12 W @ 12 A in CW-operation @ 20°C

~67% maximum wall-plug efficiency (~65% @ 9 W)

which results in 50-57% overall wall plug efficiency out of the module

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

0 1 2 3 4 5 6 7 8 9 10 11 12

injection current (A)

ligh

to

utp

ut

po

we

r(W

)

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

Eff

icie

ncy

Light output power

Wall-plug Efficiency

Differential Quantum Efficiency

Diode power conversion

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© 2006 JDSU. All rights reserved.12

Diode power conversion

Research funded by DARPA SHEDS program promises powerconversion efficiency improvements in future fiber laser pumps

Device Efficiency of Similar Structures at 25C, 940nm

Dashed = Commecially Available Solid Red = SHEDS Design

0

2

4

6

8

10

0 2 4 6 8 10

Drive Current (A)

Ou

tpu

tP

ow

er

(W)

30%

40%

50%

60%

70%

80%P

ow

er

Co

nv

.Eff.

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4Diode heat removalSingle Emitter: Heat spreading

Ball

Wedge

Golddraht

Submount

Chip

AuSnSoldered toexpansion matchedmaterials forheat spreading

Water

Cu

CuW

AlN CT

Em

atc

hC

TE

mis

matc

hMechanicalpressure thermalcontact to copperheatsink

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www.bookham.com

Telecom technology

• Technology: Monolithic optical platform (AlN) with

– Laser diode, soldered with AuSn

– Fiber tip attached to monlolithic optical platform

– Monitor diode and thermistor

• Performance

– Very stable laser facet/fiber tip fixture

– Small size and low cost

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www.bookham.com

MM Uncooled Module with >14W

• Record Performance:

– >14W @ 18A and 10°C Ths

– Standard MU package

• Module fully qualified

• MSA with EM4

• For 100um pigtail with NA=0.22 or NA=0.15 (same performance)

0

2

4

6

8

10

12

14

16

0 2 4 6 8 10 12 14 16 18 20

injection current (A)

Ex

-Fib

reP

ow

er

(W)

10°C

25°C

45°C

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4Pump power injectionCoaxial dual cladding

Coaxial cladding

400um, NA=0.46: 150’000 modes

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4Pump power injectionMM Beam divergence

Stable beam Vertical: 0.3mm mrad: Single lateral Mode

Lateral: 7.5mm mrad: 25 lateral modes

Overall Beamquality: 25 modes

Coupled in 100um NA=0.2 fiber: 2000modes (10mm mrad)

-70 -50 -30 -10 10 30 50 70

vertical far field angle (°)

Intensity (a.u.)

-30 -20 -10 0 10 20 30

lateral far field angle (°)

Intensity (a.u)

9A7A5A

NA=0.15

NA=0.2

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Brightness Power Diagram

1

10

100

1'000

10'000

100'000

1'000'000

1 10 100

Power [Watt]

Nu

mb

er

of

late

ralm

od

es

'

400um, NA=0.22200um, NA=0.22

100um, NA=0.22

BA100, NA=0.2, 8W

Pump power injectionBrightness-Power Diagram

Active fiber cladding

400um NA=0.46

Pump pigtail

100um, NA=0.2

Pump laser

BA100, NA=0.2

Fiber Laser Output

Assume:

90% Pump Diode to pigtail ce

90% Fiber combiner ce

75% Fiber laser ce

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4Fiber combiner (6+1)*1, (2+1)*1Free space combiner

Fiber combiner of pigtailed singleemitters Space multiplexer for signal/pump

separation

Free space combiner ofpump diode stack Wavelength multiplexer

for signal/pumpseparation

(6+1)*1: Fused (2+1)*1: Proximity

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4Pump power injectionFiber combiner

Fiber combiner modal window gets smaller with increased bundlesize

Brightness Power Diagram

1

10

100

1'000

10'000

100'000

1'000'000

1 10 100 1000

Power [Watt]

Nu

mb

er

of

late

ralm

od

es

'

BA100, NA=0.2, 8W

6 BA100, NA=0.2, 8W

21 BA100, NA=0.2, 8W

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4Pump power injectionPolarisation combiner, both side pumping

To inject 84 pump diodes through 21 fiber bundle: polarisation combining in pump diode package and

co and counter propagating scheme

Brightness Power Diagram

1

10

100

1'000

10'000

100'000

1'000'000

1 10 100 1000

Power [Watt]

Nu

mb

er

of

late

ralm

od

es

'

21 BA100, NA=0.2, 8W

21 BA100, NA=0.2, 8W, *2 Pol *Both sides

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4Pump power injectionSeries and parallel addition of fiber amplifiers

Single stage

Scaling:

Cost proportional topower

Serial

~

~

~

Parallel

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4Pump power injectionPump Diode: $/Watt Ultimately 10$/W as a goal for very large volume

Still need factor of approximately 5 from today (to be a good business by itself)

Learning experience from telecom pumps to reduce cost Large fully absorbed fabs, large sunk R&D cost Manufacturing experience:

Volume: One platform for all parts

Hybrid assembly: Automatic and manual

At 20% improvement per year: Need another 7 years

Pigtailed package: For 200 to 300$? Need 20W to 30W in pigtail

Increase pump power per chip Fundamental brightness limits? Not reached yet! Thermal limits can be streched, (longer laser chips)

Task for fiber community: Find best match between pump diode pigtails and fibercombiners Standard today: 100um, NA=0.22 Move to 100um, NA=0.15 > larger combiners Move to 200um or even 400um, NA=0.15: Higher pump power per package From fibers to waveguide tapes?

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© 2006 JDSU. All rights reserved.24

In search of fundamental limits

0

5

10

15

20

25

30

35

0 10 20 30 40

Current, A

Po

wer,

W

Th=15C pulsed

cw, 100um

cw, 50um

32 W pulsed power at 40A100um stripe

11.5 W CW roll-overpower 50um stripe

17.8 W CW roll-overpower 100um stripe

With thermal limit removed, broad-area heroes hit single-modetelecom 980nm pump rated power density

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www.bookham.com

Brightness limit: Not reached yet

• 0.5ms 40A pulse: 30Watt from 90um BA single emitter

• Improve CW power by better thermal performance

– Longer chip

– Higher efficiency

30

25

20

15

10

5

0

po

wer

(W)

3020100

current (A)

30

20

10

0

curr

ent(A

)

8x10-4

6420-2

t (s)

40x10-3

30

20

10

0

pow

er(a.u.)

currentpower

0.5ms

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4Pump power injectionLow NA, wide single emitters

Increase power of single BA emitter by increasing emission width (6+1)*1 combiners commercially available for 100 and 200um fibers 300 and 400um should be feasible

Brightness Power Diagram

1

10

100

1'000

10'000

100'000

1'000'000

1 10 100 1000

Power [Watt]

Nu

mb

er

of

late

ralm

od

es

'

6 BA100, NA=0.2, 8W

6 BA200, NA=0.15, 11W

6 BA300, NA=0.15, 13W

6 BA400, NA=0.15, 15W

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4Pump power injectionImprove match of pump diode and waveguide

Innovation needed: Improve match by going from round pigtail to high NA fiber tape pigtail

(e.g. 10*400um, NA=0.46)

Brightness Power Diagram

1

10

100

1'000

10'000

100'000

1'000'000

1 10 100 1000

Power [Watt]

Nu

mb

er

of

late

ralm

od

es

'

6 BA400, NA=0.15, 15W

6 BA400, NA=0.15, 15W, Fiber Tape 10*400um, NA=0.46

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4Pump power injectionBar stacks: Why?

Stacks to further reduce $/Watt!

Stacks Open package Free space optic combiner

Opto-mechanical precision

High heat density MCC coolers with high water flow velocity Bar needs to be solderred to MCC Water and bar at same voltage potential. Bars and MCC in series

Reliability MCC limits lifetime (degradation by flow-erosion, cavitation and electro-erosion) MCC has different cte than bar. Strain for hard solders or unstable joint for soft solders

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© 2006 JDSU. All rights reserved.29

Super-efficient 480W stack

Stack Serial #: A668

Current

(A)

Voltage

(V)

Corr.

Power

(W)

E-to-O

Eff.

6 0

10 8.310 27 32.5%

20 8.480 96 56.6%

30 8.630 167 64.5%

40 8.750 233 66.6%

50 8.870 297 67.0%

60 8.980 367 68.1%

70 9.080 431 67.8%

77 9.155 480 68.1%

80 9.170 498 67.9%

Water Temp ~20C

Ith (A) 6.0

Eff per Bar (W/A) 1.11

I at 480W 77

V at 480W 9.16

Peak PCE 68.1%

Peak Wav (nm) 937.2

0

100

200

300

400

500

0 20 40 60 80Current (A)

Ou

tpu

tP

ow

er

(W)

8.0

8.3

8.6

8.9

9.2

9.5

Vo

lta

ge

(V)

Spectra at 80A, 20C

925 930 935 940 945 950

Wavelength (nm)

Rela

tiv

eIn

ten

sit

y Peak 937.2nm

FWHM 4.7nm

Power conversion efficiency (PCE) of >68% with goodFWHM in 20°C water-cooled six bar stack

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www.bookham.com

9xxnm 120W Bar Performance

Condition 120W pulsed (1.33Hz, 0<->140A)

P-I curve at 25Cup to 200W:

• Electro-Optical

– Power: 120W @ 140A

– Threshold: 14A

– Slope Eff.: 1W/A

• Reliability

– 5’200h at 120W lifetest dataat 1.33Hz full on/off pulsedconditions available

– The extrapolated medianlifetime is above 80’000hrs or350 MShots, less than 1%fails after 120 MShots.

– No open fails

0

25

50

75

100

125

150

175

200

0 100 200

Current (A)

Po

wer

(W)

0.5

0.6

0.7

0.8

0.9

1

1.1

0 1000 2000 3000 4000 5000 6000

Time (h)

Rel.

po

wer

(a.u

.)

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4Pump power injectionBar stacks vs single emitters

Stacks Open package Free space optic combiner

Opto-mechanical precision

High heat density MCC coolers with high water flow

velocity Bar needs to be solderred to MCC Water and bar at same voltage

potential. Bars and MCC in series

Reliability MCC limits lifetime (degradation by

flow-erosion and electro-erosion) MCC has different cte than bar.

Strain

Need1. Ultra high efficient bar to reduce

heatload2. Macro Channel coolers which are

cte matched and galvanicallyisolated

3. Optomechanical precision at lowcost

Single pigtailed emitters Hermetically sealed package Fiber combiners

Fiber combiner: Cost and reliability

Distributed heat Robust water coolers Galvanic isolation

Built on telecom technology

Need1. Ultra high brightness chip to

increase power per pigtailedpackage

2. Ultra high efficient chip to reduceheatload

3. Fiberoptics and fiber combinerswhich are matched to pump diode

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Fiber Laser Reliability

Pump Diode reliability

Chip: Methodology known from telecom FMEA, Multi-cell testing

Apply to drive up power levels from single emitters

Package Single emitters: Known from telecom

Bar stacks: Opto-mechanics and cooling system:

Need to bring in FMEA and multi cell/damage limit testing methodology for stacks

Fiber

Passive fiber: Well understood from telecom

Active fiber: Photodarkening at high power operation. Understood by some manufacturers

Fiber combiners Need to increase power capability together with single emitters

Fiber Laser System

Need to control fiber laser system aspects

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© 2006 JDSU. All rights reserved.33

What is a multi-cell test?

Parallel lifetests varyingkey parameters:

– Temperature– Optical Power and/or– Drive Current

Reliable InAlGaAs lasers follow:

(Fop, EA, m, n) determined from

best fit of multi-cell data6

6.5 7

7.5 8

8.5 9

9.5 10

10

.5

50

70

90

0.0000

0.1000

0.2000

0.3000

0.4000

0.5000

0.6000

0.7000

0.8000

0.9000

1.0000

Normalized

Failure Rate

ex-facet Power (W)

Junction

Temperature (C)Multi-cell test conditions

Intended deployment condition

6

6.5 7

7.5 8

8.5 9

9.5 10

10

.5

50

70

90

0.0000

0.1000

0.2000

0.3000

0.4000

0.5000

0.6000

0.7000

0.8000

0.9000

1.0000

Normalized

Failure Rate

ex-facet Power (W)

Junction

Temperature (C)

Example for multicell test design

m

op

n

opopjB

Aopj

I

I

P

P

TTk

EFIPTF

11exp,,

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www.bookham.com

SES8-9xx-01: Reliability assessment

Multi-Cell test

• Iop: 9 A -13 A (Pout: 8 W- 11 W)

• Tjct: 100°C -140°C

Acceleration model:• FR ~ IxPy exp(-Ea/kbT), x = 0, y = 5, Ea = 0.45 eV

Reliability•< 3 kFIT @ 8.2 W, 25 °C (heat sink temperature)

Iop= 9 A,Pop~ 8.2 W,Tjct ~ 111°C

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35

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tler

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4Fiber Laser ReliabilitySystem

Damaged broad area pump chip by optical back-travelling pulse infiber amplifier (Er)

Add protection by isolators?

2005, A. Jakubowicz, Bookham

GaAs Chip facet

AuSn solder

CuW submount

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Outlook

MOPA arrangement Diode seed lasers are easily modulated Cascade of fiber power amplifiers for easy power scalability

940/960nm and 920nm bands have robust pump diodes 976nm is very challenging from wavelength stability requirement

Reliability has to include diodes, fiber and system for higher power chips: Methodology kown For higher power active fibers: Need methodology (and more manufacturers) Reliability trade-offs of system needed to optimize fiber laser costs

Pump diode cost reduction through Evolution (takes time) Inventions

Pigtailed single emitters optimally matched to fiber system

Stacks on galvanically isolated, expansion matched macro channel coolers

High volume by a few lead suppliers

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Addendum

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© 2006 JDSU. All rights reserved.38

Super–efficient 80W 940nm bar

Power conversion efficiency (PCE) of >75% in 80W, 20°Cwater-cooled 1cm 940nm bars

Performance of JDSU/SHEDS 80W Bars

0

25

50

75

100

125

150

0 20 40 60 80 100 120

Drive Current (A)

Ou

tpu

tP

ow

er

(W)

50%

55%

60%

65%

70%

75%

80%

Po

we

rC

on

ve

rsio

nE

fficie

nc

y

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www.bookham.com

MU7-9xx-01: NA 0.15 vs. NA 0.22

• Same performance for NA 0.15 and for NA 0.22 MM fiber.

0

1

2

3

4

5

6

7

8

9

10

0 2 4 6 8 10

injection current (A)

lig

ht

ou

tpu

tp

ow

er

(W)

NA 0.15 NA 0.22

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915nm pump laser

Optical output power (ex-fiber) versus current for the 915nm TO-220 moduleCurrently Lumics sells 4W versions of 808, 915 and 975nm7W is announced for Q3 2006

0.0

2.0

4.0

6.0

8.0

10.0

12.0

0.0 2.0 4.0 6.0 8.0 10.0 12.0

Laser Diode Current (A)

Pu

mp

Po

we

rto

10

mF

ibe

r(W

) Power out of 105µm fiber, NA=0.15

Power without thermal roll-over

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9xx Laser Diode Bars

915nm

940nm

980nm

Bar on

MCC

Bar on MCC

Base&Cover

Vertical Bar on

MCC Stack

MM Bar on

Cu Block

50%FF 80WBAC80C-9xx-01

80WBAC80C-9xx-02

50%FF 120WBAC120C-9xx-01

120WBAC120C-9xx-02

2400WVBA2400C-9xx-01

30%FF 50WBAC50C-9xx-01

50WBAC50C-9xx-02

50WBPC50C-9xx-01

20%FF 50WBAC50C-9xx-03

50WBAC50C-9xx-04

50WBPC50C-9xx-02