PrimePACK™with IGBT5 - Mesago€¦ · Infineon‘s Power Module Innovation PrimePACK™withIGBT5...

Infineon‘s Power Module Innovation

PrimePACK™with IGBT5 & .XT

Zhao ZhenboInfineon Technologies China Co., Ltd.

Agenda

Motivation

Module Concept

Electrical Performance

Summary

2015-05-19 Copyright © Infineon Technologies AG 2015. All rights reserved.

Summary

Motivation by Application Requirements


Long lifetime- high reliability and robustness

Increased power density

System efficiency

State of the art Joining Technology


Chip

DCB

Base Plate

System Solder

Chip soldering

Al bond wire

Aluminum bond wires Chip soldering System soldering


Lifetime limits of Packaging Technologies


How can we expand the life time?

Standard vs. .XT Joining Technology


Copper bond wires Sintered chips HiRel system soldering

Si chip

DCB

Base Plate

System soldering

Chip soldering

Al bond wire

State of the art Technology

.XT Technology

Aluminum bond wires Chip soldering System soldering

Agenda

Motivation

Module Concept


Summary


Summary

PrimePACK™ Power Module Platform


PrimePACK™ 2 PrimePACK™ 3+

New PrimePACK™ Modules


PrimePACK™ FF1800R17IP5

IGBT5 –

P5

+28%

PrimePACK™ 3+

PrimePACK™ FF1200R12IE5

PrimePACK™ 2

IGBT5 –

E5

+33%

Nominal current capability

1800A

1400A

IGBT4 –

P4

PrimePACK™ 3+

1200A

900A

IGBT4 –

E4

IGBT4 –

P4

Nominal current capability

PrimePACK™ 2

PrimePACK™ with IGBT5 and .XT Technology


Increasing power density up to 25%

Or

10 times longer lifetime

PrimePACK™ IGBT5 – Portfolio


PrimePACK™ 3+

PrimePACK™ 2

PrimePACK™ 3

PrimePACK™ 2

halfbridge IC[A]

450A/600A/900AIGBT4

1400AIGBT4

1200AIGBT5

1500A*/1800A*IGBT5

PrimePACK™ 3+

PrimePACK™ 2

PrimePACK™ 3

PrimePACK™ 2

halfbridge IC[A]

450A/650AIGBT4

1000A/1400AIGBT4

1200A*IGBT5

1500A*/1800AIGBT5

1700V PrimePACK™

1200V PrimePACK™

NEW

NEW

NEW

NEW

Agenda

Motivation

Module Concept


Summary


Summary

IGBT5 with .XT Technology


Reduced Die thickness Turn-off and On-state Voltage Trade-off is shifted to lower values

IGBT 5 with improved softness compared to IGBT 4

Copper Metallization increase the Thermal Capacity: Short Circuit Capability up to 10µs

1200V

P4

E4

E5

Saturation Voltage [V]

Turn

-off E

nerg

y/A

1 2 3 4

1700V

P4

P5

E4

Saturation Voltage [V]

Turn

-off E

nerg

y/A

2 2,2 2,4

Inverter output current calculation33% improved inverter output current


1200V IGBT5 provides:

+33% inverter current compared to IGBT4 HiPo

+23% inverter current compared to IGBT4 MePo

300

400

500

600

700

800

900

2000 3000 4000 5000 6000 7000 8000

Max

. RM

S cu

rren

t [A

]

Switching frequency [Hz]

Achievable output current vs. Swichting frequency

IGBT5 @175°C

IGBT4 HiPo

IGBT4 MePo

Calculation conditions: A forced air cooler Rth h-a of 0.098 per arm, cosine phi=0.8,

modulation factor= 0.8, DC link voltage 600V, same silicon placement

PrimePACK FF1800R17IP5 Example: IGBT softness @ turn-off


PrimePACK™ 3+ Ic=Inom=1800A

VDC=900V

Tvj=RT

Ic=Inom=1800A

VDC=900V

Tvj=175°C

IGBT 5 with optimized trade-of between reduced losses and turn-off softness

Inverter output current calculation33% improved inverter output current


1700V IGBT5 provides:

+33% inverter current compared to IGBT4

Calculation conditions: Rth h-a of 0.015 per arm, Ta=55°C, cosine phi=0.82,

modulation factor= 1, DC link voltage 1080V, f=15Hz, same silicon placement

FF1400R17IP4

FF1800R17IP5

Demonstrator with ModSTACK™ HD30% Increase in AC output current (rms)


Increase in output current by 30%

Agenda

Motivation

Module Concept


Summary


Summary

Summary

set date Copyright © Infineon Technologies AG 2015. All rights reserved.

Reduced overall losses by IGBT5

System efficiency

Increased Power Density Longer Lifetime

10 times longer lifetime by .XT Higher operation temperature (TvjOP=175°C) enables higher output power

IGBT5 expanding the power range on established PrimePACK™ footprint

PrimePACK™ 3+ enables 1800A

PrimePACK™ 2 enables 1200A

Further Information available


PCIM Conference

Thuesday May, 19 - Room: Brüssel 1

11:30 End of Life Investigation on the .XT interconnect TechnologyKarsten Guth, Nicolas Heuck, Christian Stahlhut, Daniel Bolowski, Christian Krasel, Sandra Krasel, Guido Strotmann, Roland Speckels, Alexander Ciliox, Niels Oelschler, Lars Böwer & Stefan Tophinke, Infineon Technologies AG

Thuresday May, 19 - Room: Brüssel 1

14:30 New PrimePACK™ Package to lever IGBT5Andre Stegner, Thomas Auer & Wilhelm Rusche, Infineon Technologies AG

Poster Session

Thuesday May, 19

15:30 Aspects of increased power Density with the new 5th Generation IGBT demonstrated with Application relevant Measurements

Raghavan Nagarajan & Dirk Brieke, Infineon Technologies AG

PrimePACK™with IGBT5 - Mesago€¦ · Infineon‘s Power Module Innovation PrimePACK™withIGBT5...

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