PHYchip Corporation, San Jose, CA 95110. 1

PHYchip CorporationSCU Nanotechnology Course presentation

DhavalDhaval BrahmbhattBrahmbhattPresident & CEO

April 2005

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SYLLABUS for ENGR 260

Overview of key areas of physics, chemistry, biology and engineering underlying this inter/multi disciplinary field: • Nano & Nano Imprint lithography• Bulk versus surface properties of materials• Self assembly and bottoms up molecular manufacturing• Nanoscale materials characterization & Metrology• Carbon nanotubes• Organic molecules for electronics• Biological and bio-inspired materials• Nanotechnology and Homeland Security

Key applications of nanoscale devices

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MY VISION for ENGR 260

Prepare students by identifying key areas they need to focus, so they can participate in this coming wave of opportunity – Nanotechnology!For working and/or displaced professionals, offer an alternative to going back to an industry that has for most parts migrated overseasIncrease awareness within educational institutions to this new and very exciting fieldMake the Silicon Valley more noticeable to powers in Washington DC so we can attract more funding for research and industry

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Dhaval J. Brahmbhatt– President & CEO of PHYchip Corp. 25 years of executive and engineering experience – Chairman, IEEE SF Bay Area Nanotechnology Council (www.ieee.org/nano)– Member education sub-committee, Blue Ribbon Task Force on Nanotechnology – Vice-Chair, Berryessa School District Advisory Board– Chairman, Economic Development Commission, City of Milpitas– Member of Review Committee of NSF for Nanotechnology SBIR/STTR projects– Member of Review Committee for Cancer Research at NIH– Proven ability to lead in small, medium, large company environments– Established and managed alliances with large multinational firms– In charge of $150 million business and supervised over 100 people at National Semi– Experience with networking ICs, modules and cards – Listed on the Silicon Valley Genealogy Tree for starting ICT in 1983 & taking it public– Ten patents, two publications. M. S. E. E. (Ohio), M S. (India)– Continuing education at Stanford, University of London (Ontario)

The Teacher

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My Class Strategy

This course will be an OVERVIEW and NOT REVIEW Bring experts from the field couple times to address the classFocus more on real world applications Student participationVisit to research, fabrication, and learning centersAssumes students have understanding of classical and quantum mechanicsOne mid-term, one term project, and presentation

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Course Books

(1) Primary Book: Introduction to Nanoscale Science and TechnologyEdited by Massimiliano Di Ventra, Stephane Evoy and James R. Heflin, Jr.Kulver Academic Publishers

(2) Other Books: Nanosystems. Molecular Machinery, Manufacturing and ComputationAuthor: K. Eric DrexlerWiley Interscience Publication

(3) NANOTECHNOLOGY & HOMELAND SECURITY. New weapons for new wars.Authors: Daniel Ratner & Mark A. Ratner. Forwarded by James Murday, Office of Naval ResearchADDISON-WESLEY PROFESSIONAL PRENTICE HALL PTR

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Richard Feynman, Nobel aureate California 1959

I would like to describe a field in which little has been done, but in which an enormous amount can be done in principle. This field is not quite the same as the others in that it will not tell us much of fundamental physics (in the sense “What are the strange particles?”) but it is more like solid-state physics in the sense that is might tell us much of great interest about the strange phenomena that occur in complex situations. Furthermore, a point that is most important is that it would have an enormous number of technical applications. What I want to talk about is the problem of manipulating and controlling things on a small scale.

As soon as I mention this, people tell me about miniaturization, and how far it has progressed today. They tell me about electric motors that are the size of the nail on your small finger. And there is a device on the market, they tell me, by which you can write the Lord’s Prayer on the head of a pin. But that’s nothing; that’s the most primitive, halting step in the direction I intend to discuss. It is a staggeringly small world that is below. In the year 2000, when they look back at this age, they will wonder why it was not until the year 1960 that anyone began seriously to move in this direction.

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STM & AFM – big catalyst

Emergence of instruments in the 1980s; STM (above), AFM providing the “eyes”, “fingers” for nanoscale manipulation, measurement…

Image of very regular pyrolitic graphite

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WHAT IS NANOTECHNOLOGY?

Nanotechnology deals with the creation of USEFUL materials, devices and systems through control of matter on the nanometer length scale and exploitation of NOVEL phenomena and properties (physical, chemical, biological) at that length scale

Nanometer• One billionth (10-9) of a meter• Hydrogen atom 0.04 nm• Proteins ~ 1-20 nm• Feature size of computer chips 95 nm• Diameter of human hair ~ 10 µm

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NANOSTRUCTURE EXAMPLES

Examples- Carbon Nanotubes- Proteins, DNA- Single electron transistors

• Not just size reduction but phenomena intrinsic to nanoscale

- Size confinement- Dominance of interfacial phenomena- Quantum mechanics

• New behavior at nanoscale is not necessarily predictable from what we know at macroscales.

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NANOSCALE NUANCES

• Atoms and molecules are generally less than a nm and we study them in chemistry. Condensed matter physics deals with solidswith infinite array of bound atoms. Nanoscience deals with thein-between meso-world

• Quantum chemistry does not apply (although fundamental lawshold) and the systems are not large enough for classical laws ofphysics

• Size-dependent properties• Surface to volume ratio

- A 3 nm iron particle has 50% atoms on the surface- A 10 nm particle 20% on the surface- A 30 nm particle only 5% on the surface

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National NanotechnologyInitiative (NNI)

For information, www.nano.gov• Multiagency Initiative in nanotechnology starting in FY01 “National Nanotechnology

Initiative (NNI) – local US Congressman Mike Honda was the initiator- Leading to the Next Industrial Revolution”

• FY05 Nano budget is close to $950 M

• Biggest portion of the funding goes to NSF- Followed by DoD, NASA, DOE, NIH- All these agencies spend most of their nano funding on university programs

• Very strong activities in Japan, Europe, China, Singapore, fueled by Government Initiatives

• Nano activities in U.S. companies: IBM, Motorola, HP, Lucent, Hitachi USA, Corning, DOW, 3M…

- In-house R & D- Funding ventures

• Lawrence Berkeley National Labs (LBNL) is a designated Center of Excellence established in conjunction with University of California, Berkeley

• Emerging small companies- VC funding on the increase

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Some CA Nanotech Web Sites

Stanford Nanofabrication Facility: http://snf.stanford.edu/UCSB Nanofabrication Facility: http://www.nanotech.ucsb.edu/Stanford Multiscale Simulation Laboratory: http://msl.stanford.edu/index.htmlLawrence Berkeley National Laboratory's Molecular Foundry: http://foundry.lbl.gov/UCSB Center for Nanoscience Innovation for Defense:http://www.engineering.ucsb.edu/Announce/cnid.htmlUCLA Institute for Cell Mimetic Space Exploration: http://www.cmise.ucla.edu/Northern California Nano Initiative: http://www.ncnano.orgCalifornia NanoSystem Institute: http://www.cnsi.ucla.edu/

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Nano Coalition in USA

• Academia will play key role in development of nanoscience and technology- Promote interdisciplinary work involving multiple departments- Develop new educational programs- Technology transfer to industry

• Government Labs will conduct mission oriented nanotechnology research- Provide large scale facilities and infrastructure for nanotechnology research - Technology transfer to industry

• Government Funding Agencies will provide research funding to academia, small business, and industry through the NNI and other programs (SBIR, STIR, ATP…)

• Industry will invest only when products are within 3-5 years- Maintain in-house research, sponsor precompetitive research- Sponsor technology start-ups and spin-offs

• Venture Capital Community will identify ideas with market potential and help to launch start-ups

• Professional societies should establish interdisciplinary forum for exchange of information; reach out to international community; offer continuing education courses

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Agency Specific Nano Web Sites

National Science Foundation: http://www.nsf.gov/home/crssprgm/nano/solicitations.htmDepartment of Defense: http://www.nanosra.nrl.navy.mil/Department of Energy: http://www.science.doe.gov/bes/NNI.htmNational Institutes of Health: http://www.becon.nih.gov/nano_contacts.htmNational Institute of Standards & Technology: http://www.nist.gov/public_affairs/nanotech.htmEnvironmental Protection Agency: http://es.epa.gov/ncer/rfa/index.html#epaNational Aeronautics and Space Administration:http://www.nas.nasa.gov/Groups/SciTech/nano/index.html

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Local Nanotech Activities

Large firms include; Hewlett Packard, IBM, Intel, AMD, etc. who already have well established Nanotechnology groupsResearch Labs in the area include; NASA Ames, Lawrence Berkeley National Labs (LBNL), Lawrence Livermore National Labs (LLNL), Sandia Labs, etc.Fuel and Carbon Crystal research at Chevron and other oil refineries in the East Bay, Sacramento, etc. are hiring engineersNanotech Research already in progress in local universities such as Stanford, UC Berkeley, UC Santa Cruz, UC Davis, Santa Clara University, etc. needs engineering supportSmall companies are getting funded, examples include; Nanogram, Neophotonics, Nanostellar, Nanosys, Koila, Nanoconduction, Nano-tex, Nanoplex, etc.

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Stanford Nano-fabrication Facility

Show .pdf file of SNF

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Semiconductor Nano Memory

Semiconductor memories are expected to be one of the first major beneficiaries of nanotechnology advances in electronics. A new paradigm of performance beyond what could be forecasted by Moore's LawLSI Logic Corp. is developing an embedded memory for its ASICs using carbon nanotube-based technology from startup Nantero Inc. LSI Logic could use the technology to embed more than 30 Mbits of fast memory on an integrated cell phone processor, this is the current embedded memory limitSeveral companies will deliver nanotech-based nonvolatile memories with SRAM-like speeds and DRAM-like densities by 2007. The parts could offer dramatic new capabilities to wireless devices, microprocessors, ASICs and a range of fabless semiconductor makersAxon Technologies Corp. will deliver a low-power nonvolatile DRAM as a discrete chip by early 2007. Freescale (Motorola) is sampling a magnetic RAM, and STMicroelectronics is working on a variety of nanotech-based components.

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Nanotech benefits in Electronics and Computing

• Processors with declining energy use and cost per gate, thusincreasing efficiency of computer by 106

• Higher transmission frequencies and more efficient utilization ofoptical spectrum to provide at least 10 times the bandwidth now

• Small mass storage devices: multi-tera bit levels, e.g. IBM’s MILLIPEDE

• Integrated nanosensors: collecting, processing and communicating massive amounts of data with minimal size,

weight, and power consumption

• Quantum computing

• Display technologies

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Nanotech Self Healing Materials

‘Self-healing plastic’ by Prof. Scott White (U. of Illinois) Feb. 15, 2001, Issue of Nature

• Plastic components break because of mechanical or thermalfatigue. Small cracks large cracks catastrophic failure.‘Self-healing’ is a way of repairing these cracks without humanintervention.

• Self-healing plastics have small capsules that release a healingagent when a crack forms. The agent travels to the crack

through capillaries similar to blood flow to a wound.

• Polymerization is initiated when the agent comes into contactwith a catalyst embedded in the plastic. The chemical reactionforms a polymer to repair the broken edges of the plastic. New bond is complete in an hour at room temperature.

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Examples of Nanotech in Materials and Manufacturing

• Nanostructured metals, ceramics at exact shapes without machining

• Improved color printing through better inks and dyes with nanoparticles

• Membranes and filters

• Coatings and paints (nanoparticles)

• Abrasives (using nanoparticles)

• Lubricants

• Composites (high strength, light weight)

• Catalysts

• Insulators

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Energy & Environment

• Nanotechnology has the potential to impact energy efficiency, storage and production, give 1,000 X surface area to battery electrodes

• Materials of construction sensing changing conditions and in response altering their inner structure

• Monitoring and remediation of environmental problems; curbing emissions; – nano iron particles to clean up tough environmental mess

• Some recent examples:- Crystalline materials as catalyst support, $300 b/year- Ordered mesoporous material by Mobil oil to remove ultrafine

contaminants- Nano-particle reinforced polymers to replace metals in

automobiles to reduce gasoline consumption

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Nanotech Potential

The US Govt. expects a Trillion dollar market over the next decade, bulk of this from electronic products California defined as #2 state by Lux Market Research for Nanotechnology to take roots in (first being Mass.)Nanotechnology will eventually employ millions, many of them in California, evolving from present high-tech jobsEarly start for California from Startups and established companies, best catalyst to get the new industry goingCollaboration between Nanotech industry, Government Labs, and academia will result in structured Nanotech offensive for our area, Center will act as a CatalystWorld wide evidence of Nanotechnology being the next wave, if we do not get started now to create trained work force, it could be too late

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NANOLITHIGRAPHY

MOORES LAW: In the last 40 years, the transistor count per chip has doubled about every 18 months. This observation has held from SSI – MSI – VLSI – ULSI, current integrated circuits have tens of millions of transistors giving rise to “SYSTEM ON A CHIP.”

The minimum feature size used to fabricate has been shrinking by 12% to 14% per year. Continued scaling at this pace eventually leads to devices at Molecular and Atomic scale that operate at very different principles.

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Intel ICs – on Moore’s Law Chart

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IC FEATURE SIZE

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Focus, Align, Print, Move

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DevelopingPositive Negative

Etching andStripping

Polymer Resist

Thin Film

Substrate

Resist Resist

ExposingRadiation

Figure 1.1. Schematic of positive and negative resists.

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Log Exposure Dose

Res

ist F

ilm T

hick

ness

Rem

aini

ng a

fterD

evel

opm

ent

0

1D0 –ThresholdDose

DC –ClearingDose

⎥⎦

⎤⎢⎣

⎡=

CDDLog 0

10γ

Figure 1.2.a. Characteristic curve of a hypothetical positive tone resist. b) optical projection lithography schematic.

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source

condenser

Cr on glassmask

reductionoptics

image inresist onwafer

Figure 1.2.b. Optical projection lithography schematic.

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PSM regular mask image

Original gate pattern

Figure 1.3.a. Dual-mask PSM technique. The original pattern for the gate is modified to create a phase shift mask and a “trim” mask. The phase shift mask creates a thin line exposure and the trim mask defines the remaining features.

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Figure 1.3.b. SEM micrograph of DSP chip with 120 nm gates printed with 248nm DUV lithography and dual-mask PSM technique. The original gate size was 250 nm.

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1974 1978 1990

Gaussian Shaped Beam Cell/Character

Increasing Throughput

SEM

Figure 1.4. Gaussian beam, shaped beam, and cell projection DWEBschematics.

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IMAGE IN RESIST

Figure 1.5. Schematic of Electron Projection Lithography employing scattering contrast.

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Figure 1.6. Schematic of a focused ion beam system.

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Figure 1.7. Atomic force microscope image of topography in PMMAfollowing FIB exposure at 1pA beam current and a total irradiation time of 20 µs per feature. (From Ref. 24 by permission of American Institute of Physics.)

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0.00

0.05

0.10

0.15

0.20

0.25

0 100 200 300 400

Depth of Focus (µm)

Feat

ure

Bro

aden

ing

( µm

)1.00 micronfeatures

0.25 micronfeatures

Figure 1.8.a. Variation of feature size with distance of sample from focus position in FIB. (From Ref. 23 by permission of American Institute of Physics.)

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Figure 1.8.b. FIB-induced Pt deposition onto the periphery of a 5 cm radius of curvature gold-coated glass lens, corresponding to height differences of order 30 µm. All images and patterns are recorded without refocusing of the ion beam. Sub 100 nm resolution is maintained over the entire field.

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a

d

b

c

e

Figure 1.9. Schematic illustration of the microcontact printing process. (From Ref. 31 by permission of Elsevier.)

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Figure 1.10. Schematic of nanoimprinting lithography process. (From Ref. 37 by permission of American Institute of Physics.)

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Example: Lithography Equipment

• At 157 nm level, need to use a special Calcium Fluoride glass that takes close to a year to grow in lab for one system

• Equipment sells for over $20 million per unit.

• A typical mask set costs $1 million now