PCB Depaneling Laser System LPKF MicroLine 350Ci

■ Depaneling without mechanical stress

■ Dust free environment

■ Cut intricate shapes

■ More usable space for component placement

■ Superior throughput

Lase

r cut

Depaneling of modern HD circuit boards can be frustrating. Avoiding damaging small, sensitive components, maintaining the close tolerances required by densely packed boards and avoiding the pollution caused by mechanical routers are all part of the challenge. The LPKF MicroLine 350Ci meets these challenges by using laser technology for depaneling and routing. Non-contact

Stress-free cutting and improved productivity:Introducing laser technology for depaneling

Produce more challenging designs

The MicroLine 350Ci will cut intricate shapes without any mechanical impact on the circuit. PCB designers will enjoy the liberty to place components closer to the edge of the board or to utilize more intricate shapes to better fi t the form factor of the fi nal product.

Superior quality and instant turnaround

Laser cutting is signifi cantly more precise than other depanel-ing methods. It doesn’t generate any debris or dust that could affect sensitive electronic components. The system works straight from CAD data and does not require specifi c tooling, so even small quantities can be produced instantly.

High productivity

The superior cutting speed of the MicroLine 350Ci provides better overall productivity than traditional depaneling methods, especially with thinner materials.

cutting with a laser means no mechanical stress on the boards or components, no debris, and no extra cost for tooling. The high positioning accuracy of the 350Ci allows for component placement closer to the edge of a board. The laser beam is able to cut intricate shapes and also increases the net usable area on the panels.

Cutting arbitrary shapes with

smallest tool diameters

Maximum Cutting Speed FR4

400

350

300

250

200

150

100

50

0.5 1 1.5

Feed

Rat

e (m

illim

eter

per

sec

.)

Material Thickness (millimeter)

The integrated dust and fume extraction provides a clean work-ing environment for guaranteed superior production quality.

The cartridge loading system accommodates custom holding fixtures for maximum efficiency.

The dual camera system pro-vides instant fiducial recogni-tion on the entire working area for optimal productivity.

The intuitive CAM software is easy to use and compatible with all industry standards including Gerber, ODB++, DXF, Excellon, HP-GL, and others.

Compact and easy to integrate

With its small footprint the LPKF MicroLine 350Ci can be easily integrated into an existing PCB assembly line or used as a stand-alone system. The software features extensive laser control functions combined with an easy-to-use GUI for day-to-day operation. LPKF has been providing prototyping and production equip-ment to the electronic industry for almost 30 years. Our sys-tems are designed with superior precision, minimum main-tenance requirements and maximum uptime in mind. LPKF provides a directly employed worldwide service staff supporting you every step of the way.

LPKF MicroLine 350Ci – Integrate Tomorrow’s Technology in Today’s Production Line

LPKF-DistributorLPKF Laser & Electronics28220 SW Boberg Rd.Wilsonville, OR 97070USA

Phone (503) 454-4200Toll-free 1-800-345-LPKF (5753)

info@lpkfusa.comwww.lpkfusa.com

Working area

Overall accuracy

Laser source

Laser safety

Machine Dimensions (W/H/D)

Weight

Facility connections

Power

Chiller

Fume extraction

Air

Applications

Semiautomatic depanelization of populated

circuit boards.

Materials

Maximum material thickness

Maximum component height

Automated material handling

17.3" x 12.2" (440 mm x 310 mm); z-axis: 1.2" (30 mm)

±20 µm

CO2 laser

Class 1

W 50" (1,264 mm) x H 66" (1,670 mm) x D 80" (2,023 mm)

approx. 3527 lbs. (1,600 kg)

3 phase 400 V + N + PE, 50/60 Hz, 32 A, power consumption 8 kVA

DI water, 2.5 kVA, min. 7 l/min, 23 °C ±1 °C

150 CFM (250 m3/h)@80” w.c. (20,000 pa), 3 psi (0.2 bar), carbon filtration required

90 psi (6 bar)

FR4 (G10), FR3, FR2, Polyester, Polyimid, PMMA, Polyamid, Prepreg

0.8” (2 mm)

top side 1.2” (30 mm)

bottom side 0.6” (15 mm)

custom designed loading station available

Specifications LPKF MicroLine 350Ci

LPK

F A

G,

1175

62-1

00

5-E

N