PACS – IHDR PhFPU Design
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Transcript of PACS – IHDR PhFPU Design
PACS - IHDR - MPE – Nov. 12 – 13, 2003 1DSM/DAPNIA/SAp – J. Martignac
PACS – IHDRPACS – IHDRPhFPU DesignPhFPU Design
J. MartignacCEA/DSM/DAPNIA
Service d’Astrophysique
PACS - IHDR - MPE – Nov. 12 – 13, 2003 2DSM/DAPNIA/SAp – J. Martignac
PhFPU DesignINTRODUCTION
•PhFPU Requirements•BFP & PhFPU :
- Design-Thermal & Grounding Scheme- Validation & Qualification
•Critical Items
PACS - IHDR - MPE – Nov. 12 – 13, 2003 3DSM/DAPNIA/SAp – J. Martignac
PhFPU DesignPhFPU Requirements
• Mass around 7 kg.• External Envelope & Mechanical I/F according to the Doc. : PACS-KT-ID-005-iss.4• Admissible Load according to the Doc : PACS-KT-AN-005-iss.2•Thermal Consumption :
- to 12µW at 300mK- to 4,3mW at 2K without the Cooler
PACS - IHDR - MPE – Nov. 12 – 13, 2003 4DSM/DAPNIA/SAp – J. Martignac
PhFPU DesignBFP : Design
The BFP is mainly composed by 5 Sub-assemblies:• the mechanical structure,• the focal plane at 300 mK,• the 300mK thermal strap• the 2K circuit buffer,• the envelope.
PACS - IHDR - MPE – Nov. 12 – 13, 2003 5DSM/DAPNIA/SAp – J. Martignac
PhFPU DesignBFP : Design Review
BFP Specifications BFP Design
Dimensions
Mass
90x90x80
500g / BFP
86x86x70 (without 2K shield Cone)
B-BFP : 630g included 2K shield Cone
R-BFP : 550g included 2K shield Cone
Thermal Load on 300mk Mech. Structure < 1µW
Elect. Connections < 1µW
Mechanical Structure : 0,6 µW
Elec. Connect. : 0,66 µW
Eigenfrequencies
Admissible Loads
Transv. mode : > 150Hz
Axial mode : > 150Hz
Transverse mode : 200 Hz
Axial mode : 500 Hz
Thermal Load on 2K
(through 2K/4K Rib. Cabl.)
<5.10-4W Power ON: 4.10-4 W (calculated)
Power OFF: 2,4.10-4 W (calculated)
Spectral Bands B-BFP:
60-90 µm
90-130 µm
R-BFP:
130-210 µm
HP filter : High Pass 60 µm + AG filter : Low Pass 130 µm
Two Band Pass HP filters on a 2K filter wheel (not SAp delivery) : 60-90µm / 90-130 µm
HP filter : High Pass 130 µm + AG filter : Low Pass 210 µm
One Band Pass HP filter at the end of the 2K shield Cone located at the pupil
Stray Light FIR Black Coating on critical areas
PACS - IHDR - MPE – Nov. 12 – 13, 2003 6DSM/DAPNIA/SAp – J. Martignac
PhFPU Design
4K Structure
Connector Panel
Cooler Harness Holder
PhFPU : Design
The PhFPU is mainly composed of 8 Sub-assemblies:• the 4K Structure,
PACS - IHDR - MPE – Nov. 12 – 13, 2003 7DSM/DAPNIA/SAp – J. Martignac
PhFPU Design
R & B BFPs Holder
Stainless SteelInsulating Tubes
VoltalefInsulating Spacers
PhFPU : Design
• the 2K Structure,
PACS - IHDR - MPE – Nov. 12 – 13, 2003 8DSM/DAPNIA/SAp – J. Martignac
PhFPU Design
R BFP
B BFP
R&B BFPFilters Boxes
R&B 2K/4K Ribbon Cables
PhFPU : Design
• the two BFPs Red & Blue ,
PACS - IHDR - MPE – Nov. 12 – 13, 2003 9DSM/DAPNIA/SAp – J. Martignac
PhFPU Design
3He Cooler
3He Cooler Harness
L0 Straps BafflingShield Covers
PhFPU : Design
• the 3He sorption Cooler
PACS - IHDR - MPE – Nov. 12 – 13, 2003 10DSM/DAPNIA/SAp – J. Martignac
PhFPU Design
300mK Thermal Strap
Kevlar wires suspension to the 4K
3He Cooler Thermal Interface
R&B BFPsThermall I/F
R&B CopperBraid
Kevlar wires suspension to the 2K
Copper Braid
Stray light Baffling
PhFPU : Design
• the PhFPU 300mK Thermal Strap from the cooler to the BFPs
PACS - IHDR - MPE – Nov. 12 – 13, 2003 11DSM/DAPNIA/SAp – J. Martignac
PhFPU Design
2K Feedthrough (by KT)
R&B BFP L0 I/F
L0 Strap I/F
Copper BraidsStray Light Baffle
PhFPU : Design
• the 2K Thermal Strap,
PACS - IHDR - MPE – Nov. 12 – 13, 2003 12DSM/DAPNIA/SAp – J. Martignac
PhFPU Design
2K Baffle
4K Baffle
PhFPU : Design
• & the Baffles.
PACS - IHDR - MPE – Nov. 12 – 13, 2003 13DSM/DAPNIA/SAp – J. Martignac
PhFPU DesignPhFPU : Design
PhFPU assembly
Status:•Mechanical I/F: OK•Optical I/F: SOAM (KT) •Parts Manufacturing: OK•Integration Tools: OK•Black Paint: in progress•Full Assembly: First Time •Thermal: to be validated
PACS - IHDR - MPE – Nov. 12 – 13, 2003 14DSM/DAPNIA/SAp – J. Martignac
PhFPU DesignPhFPU Thermal Equivalent Scheme
R3
R1
Rc3
R6
Rc1
Rc4
PhFPU 2K I/F
PhFPU 4K Structure
PhFPU
élec=2,8mW (B&R BFP)
flex=0,5mWstruct=0,8mW
Feedth.=0,5mWTBC by KT
Evap. Switch I/FT 2K
R2
Rc2
Pump Switch I/F
h0,12W.K-1
Evap.
Pump.
h0,075W.K-1
Global Thermal budget on the L0 level:
- 4,1mW + 0,5mW*
*:(TBC by KT)
L0 Straps manufacturing is under responsibility of Astrium
PACS - IHDR - MPE – Nov. 12 – 13, 2003 15DSM/DAPNIA/SAp – J. Martignac
PhFPU DesignPhFPU Grounding scheme
PumpEvap.
Cooler Structure @ 4K
Space Scraft L0 Thermal Straps
He Tank
Optical Bench
PhFPU Structure @ 4K
BFP Housing @ 2KThe PhFPU grounding configuration is like represented:- one shield @ 2K close to the bolometers and signal- one shield @ 4K performed by the outer PhFPU and Cooler Structure- the electrical insulation between the two shields are performed by:
- Voltalef parts at the Structure level- 0,1mm layer of STYCAST 1266 between copper foils at the Thermal Strap level (300mK & 2K)
PACS - IHDR - MPE – Nov. 12 – 13, 2003 16DSM/DAPNIA/SAp – J. Martignac
PhFPU Design Validation & Qualification
Succesful Warm vibrations have been done :- on a BFP Structure alone- at the PhFPU level - & at the Instrument level
A new PhFPU SM has been build for the Cold vibration campaign at CSL.The BFP Kevlar suspensions only survived to the first two axis (Y & Z), and a breakage occured at the beginning of the third run (X).But higher input levels than specified in the IIDA was applied.
PACS - IHDR - MPE – Nov. 12 – 13, 2003 17DSM/DAPNIA/SAp – J. Martignac
PhFPU DesignBFP : Validation & Qualification – Future Tests
Cold vibrations are planed :- on a BFP Structure alone - on a BFP equiped with detectors and its complete readout circuit to validate all the interconnections from the detectors to the end of the 2K/4K Ribbon Cable.
New stiffness measurements at 4K will be done on a BFP Structure in two directions :
- axial (applied load to the focal plane)- transverse ( // to the focal plane)
These tests should be repeated 2 or 3 times on the same Structure to study the thermal cycling influence on the Kevlar wire suspensions.
PACS - IHDR - MPE – Nov. 12 – 13, 2003 18DSM/DAPNIA/SAp – J. Martignac
PhFPU DesignPhFPU : Validation & Qualification – Future Tests
•A complete PhFPU FEM is complete now with the Cooler & the BFP Kevlar suspensions
•Warm vibrations will be done at the PhFPU level to investigate potential coupling between the PhFPU 4K Structure and 3He Cooler:
Cooler SM refurbished with a Titanium core and a functionnal switch linked to a representative L0 Strap: TBC!).
•New cold vibrations campaign under negociation (ESA/Inst).
PACS - IHDR - MPE – Nov. 12 – 13, 2003 19DSM/DAPNIA/SAp – J. Martignac
PhFPU DesignPhFPU Critical Items
Critical:• Qualification at Cold temperature• BFP Kevlar wire suspension• Mechanical load on the Cooler thermal switches I/F
To be validated:• 0,3K Strap thermal behaviour (without & with electrical insulating parts.•Cooler behaviour mounted on the PhFPU (thermal environment)
PACS - IHDR - MPE – Nov. 12 – 13, 2003 20DSM/DAPNIA/SAp – J. Martignac
PhFPU DesignProgress since IBDR
• 3 models of the PhFPU have been built: SMKT, SMKT2 & SOAM
• Warm vibrations done succesfully passed at sub-assembly and at instrument level
• BFP assembly & integration is now completely stabilised• 2K/4K ribbon cables manufacturing is now under control • PhFPU design is complete, all the parts for the QM are
manufactured