OmniFlex™ Reflow Oven SeriesReflow Soldering System

The OmniFlex series

delivers exceptional

heating and cooling

capabilities to meet today’s

demanding production

requirements. Designed

to maximize efficiency,

the system delivers the

industry’s lowest possible

power and nitrogen

consumption and simplifies

the conversion to lead-free

processing.

Electrovert®

Knowledge in process

OmniFlex

Electrovert’s reflow oven

technology expands with

the OmniFlex 7 and 10 zone

high-performance reflow

ovens.

Exceptional heating &

cooling technology

Full application

capability

Lead-free process ready

Low power consumption

by design

Low nitrogen

consumption by design

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High-Performance Reflow TechnologyThe OmniFlex provides exceptional performance for today’s high-volume manufacturer at a highly competitive price. Available in both air and nitrogen configurations, the OmniFlex is designed to meet a wide variety of process requirements, including traditional high-volume reflow, curing, and hybrid applications for both lead and lead-free alloys. All this while ensur-ing the lowest possible cost of ownership by maximizing efficiency and minimizing system downtime.

Lead-Free Process ReadyWith higher peak temperature requirements and smaller process windows for lead-free soldering, a reflow system must minimize ∆Ts and have the ability to control time above liquidus (TAL). With temperature process capability to 350ºC, high-efficiency heat transfer, and exceptional zone-to-zone segregation, the OmniFlex is ready to make the lead-free conversion simple.

Low Cost of OwnershipThe OmniFlex is designed to optimize operating efficiencies, reduce maintenance intervals, and lower life-cycle costs. It often uses up to 50% less poser and up to 35% less nitrogen than comparable platforms available today. This is possible with features such as standard variable-speed, closed-loop blower control; power-limiting, balanced gas flow; and an innova-tive dual-chamber heating design.

Flux ManagementDuring the processing of assemblies with the reflow system, flux volatiles are continuously released from the solder paste. The patented Flux Extraction System™ (FES) works to con-tain these flux volatiles in an effort to reduce overall maintenance requirements. The strate-gically placed Flux Extraction Systems trap and filter particles throughout the entire heated chamber. Each individual FES unit is specifically configured to maximize its efficiency. The FES units feature filtering technology in the form of a micromesh screen for collection of large particles and/or packed stainless steel balls designed to create a wet filter for solvent collection. The filtered flux is collected in system-monitored containment jars that are quickly and easily removed. The FES units also feature advanced software controlled self-cleaning capability designed to extend required maintenance intervals, maximize overall system ef-ficiency, and minimize overall system maintenance requirements. The combination of these advanced features make the Flux Extraction System the most comprehensive flux filtration system available today.

Electrovert

OmniFlex Features

Heating TechnologyThe OmniFlex “heat-on-intake” chamber design introduces a bal-anced air stream into the heating chamber. This method offers ex-ceptional zone-to-zone segregation plus minimal peak temperature delta performance.

Closed-Loop Blower ControlStandard closed-loop blower control balances airflow with minimal turbulence to improve heat transfer and substantially reduce power and nitrogen consumption.

Patented Rail HeatersRail heaters can reduce peak temperature deltas to within ±1.5ºC for products with large thermal mass. This is beneficial for products with mass on the edges of electrical assemblies.

Air Cooling TechnologyThe air cooling module offers inde-pendent, four-speed blower control through the software plus standard closed-loop blower control with blower failure detection.

Quick-Change Atmosphere SealsThis two-seal system consists of an internal rope seal to absorb flux and heat, and an external silicone seal that is mounted into a channel for quick change. Benefits include ex-tended seal life, reduction in main-tenance time, and the ability to maintain process atmosphere while reducing nitrogen consumption.

VariCool™ Cooling TechnologyThe nitrogen cooling module consists of vertical cooling chambers that offer independent, closed-loop variable blower control for precise control of cooling slopes and assembly exit temperatures.

WORLD HEADQUARTERS16 Forge Park, Franklin, MA 02038Tel: (508) 520-0083Fax: (508) 520-2288

www.speedlinetech.com

MANUFACTURING FACILITIESACCEL/ELECTROVERTHighway 5 South, Camdenton, MO 65020Tel: (573) 346-3341Fax: (573) 346-5554

CAMALOT/MPM16 Forge Park, Franklin, MA 02038Tel: (508) 520-0083Fax: (508) 520-2288

SALES AND CUSTOMER SUPPORT OFFICESU.S.A.2541 Technology Drive Ste. 401 Elgin IL 60124Tel: (847)426-4787Fax: (847) 426-7383

MEXICOCarretera Base Aerea #5850 Km. 5, Edificio 11Zapopan, Jalisco, MexicoTel: +52 (3) 818-9017Fax: +52 (3) 818-9816

EUROPESpeedline Technologies GmbHIm Gefierth 14 D-63303 Dreieich, GermanyTel: +49 (0) 6103-8320Fax: +49 (0) 6103-832-299

ASIA/PACIFICSpeedline Technologies Asia Pte Ltd150 Kampong Ampat, #05-08 KA CentreSingapore 368324Tel: +65-6286-6635Fax: +65-6289-9411

© 2007 Speedline Technologies

Speedline, Accel, Camalot, Electrovert, MPM, Protect, OmniFlex, VariCool and Flux Extraction System are trademarks of Speedline Technolo-gies or its subsidiaries and affiliated companies. Windows is a registered trademark of Microsoft Corporation. All other brands may be trademarks of their respective holders.

8/07

ABOUT SPEEDLINE TECHNOLOGIESSpeedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor indus-tries. Based in Franklin, Massachusetts, U.S.A., the company mar-kets five best-in-class brands — Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave solder-ing, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. For more information, visit us at www.speedli-netech.com.

Speedline Technologies maintains an ongoing program of product improvement that may affect design and/or price. We reserve the right to make these changes without prior notice or liability.

Process Knowledge and SupportAt Speedline Technologies, we deliver world-class products, performance, and unparalleled service and support programs. With the OmniFlex comes the proficiency of our Electrovert process experts that allows us to solve real-world applications issues. Knowledge in Process for superior performance.

OMNIFLEX SPECIFICATIONS

OmniFlex 7 OmniFlex 10Machine Length 199.2” (5060.7 mm) 259” (6573.8 mm)Machine Width 56.3” (1430.4 mm) 56.3” (1430.4 mm)Machine Height 49.8” (1265.4 mm) 49.8” (1265.4 mm)Process Width 20” (508 mm) 20” (508 mm)Heated Length 104.5” (2654 mm) 148” (3759 mm)Cooling Length 32” (813 mm) 50.5” (1282 mm)Operating Temperature 350°C with rails

400°C with mesh belt350°C with rails400°C with mesh belt

Compliance Requirement CE CE