ZelFlow

Bench Top Reflow Oven

LPKF ZelFlow

Convection SMT Reflow Oven For Rapid Prototyping

General DescriptionLPKF ZelFlow R04 combined hot air/quartz reflow oven is an ideal tool for rapid SMT prototyping and short-run production. The most sensitive and lead-free soldering can be done with the inert gas option. This compact, versatile oven with a large working area and microprocessor controlled temperature/time profiles is perfect for SMT reflow soldering, curing adhesives, hardening through-plating conductive paste and other thermal processes in your lab.

User friendly interfaceTemperature and process duration are freely programmable for the separate preheating and reflow phases. The temperature is shown during the process. The timer can be set to display a counter or time to end of process. The beginning and conclusion of a process are indicated both visually and acoustically. Boards are automatically cooled down after the drawer is opened. Air flow as well as the time of integrated fan are programmed for each reflow profile separately. All parameters can be stored in battery backup memory for further recall.

Main SpecificationLarge working areaBoard coolingEasy operationProcess parameter memoryInert gas connection (as option)

Flexible board clampingSingle- or double-sided boards are simply laid over adjustable bar holders. This system allows the treatment of multiplied boards at the same time. A cooling fan is integrated into the bottom of the drawer.

Nitrogen atmosphereA combination of hot-air with additional quartz heaters provides dynamic profile changes and optimum temperature all over the PCB, suitable for most complex reflow tasks. An inert gas connection is available as an option at the purchase.

Additional benefitsLong processes can be set. Additionally to regular reflow soldering curing of adhesives, hardening of conductive paste for through-plating such as LPKF AutoContac® process and thermal stabilisation of mechanical and electronic components or boards can be done. A wide-angle opening enables larger parts to be inserted such as LPKF EasySolder®. Time for long thermal treatments, up to 24 hours can be programmed. After the process the oven automatically cools down and turns off.

Technical data

Maximum circuit board size:

Preheating temperature, time:

Reflow temperature, time:

Long thermal treatment temperature, time

Temperature stabilization time

PCB cooling

Power connection:

Power consumption, max.

Nitrogen gas consumption (N2 model only)

Dimensions ( W x L x H )

Weight

Ambient conditions

* Standard Cubic Feet per Hour

No special accessories available.

280 x 350mm (11.02" x 13.77")

50-230˚C, 1-1800s

75-270˚C, 0-600s

50-220˚C, 1-1440min

5min

speed adjustable bottom-mounted fan

220-230V / 50-60Hz single phase

3500W

0,28m3/h (10SCFH)*

500mm x 450mm x 370mm; ( 19,7" x 17,7" x 14,6" )

24kg (48 lbs)

Temperature: 20 - 25˚C

Humidity: 30-95%

Altitude: below 1000m above mean sea level

ProtoMat ZelPrint ZelPlace ZelFlow

Inhouse Rapid PCB & SMT Prototyping

LPKF d.o.o.Planina 34000 KranjSLOVENIATelefon +386-4-201-38-00Telefax +386-4-201-38-20e-mail info@lpkf.siweb www.lpkf.si

ISO 9001 certifiedNo. 12 100 15161 TMS

LPKF Laser & Electronics AGOsteriede 730827 GarbsenGERMANYTelefon +49-5131-70- 95-0Telefax +49-5131-70-95-90e-mail lpkf@lpkf.deweb www.lpkf.de

Contact your LPKF Representative for Details

www.lpkf.si

The first and very important step in the SMT assembly process is the applying of solder paste. With the LPKF ZelPrint fine-pitch boards are printed. The utilization of vertical separation and slow snap-off enable extraordinary printing results. Double-sided boards with one side already assembled can also be printed. Milled polymer stencils are stretched into ZelFlex frame. Many different frames are easily clamped onto the LPKF ZelPrint.

A fast and environment friendly printed circuit board production is realized with the LPKF ProtoMat. A standard CAD design is transferred into machine data. Insulation tracks and areas are milled while holes with various dimensions are drilled. Also different shapes can be cut out. Multilayer PCB production is supported. Polymer SMT stencils can be made using the LPKF ProtoMat.

The next step is the placing of various SMD components onto already paste-printed PCB. LPKF ZelPlace Pick & Place device with a precise manipulator assists the operator in placing different SMT components, from small chips to large QFPs. For additional help axes can be blocked and fine tuning can be utilized. SMT solder pastes and other media are dispensed with LPKF ZelPlace.

For a successful conclusion of the SMT assembly process the components should be soldered. The LPKF ZelFlow oven with a large working area and processor controlled temperature/time profiles is perfect for SMT reflow soldering, curing adhesives and hardening of the through-plating conductive paste. ZelFlow oven is also available with an inert gas connection.

Inhouse rapid prototyping will increase your flexibility, strengthen independence from suppliers, and shorten your time to market. LPKF is the only company with a complete process solution: from a single-sided board to the multilayer PCB, assembled with the most complex SMT components. All products are designed and manufactured by LPKF.

Specifications are subject to change without notice due to improvements in design. Printed in August 2003.