O21-High temperature lead-free solder:Phase relations in...
Transcript of O21-High temperature lead-free solder:Phase relations in...
High temperature leadHigh temperature lead--free solder:free solder:
Phase relations in (Phase relations in (Cu,NiCu,Ni))--SnSn--ZnZn
R. Divakar, C. Schmetterer, H. Flandorfer, H. IpserR. Divakar, C. Schmetterer, H. Flandorfer, H. Ipser
University of Vienna
Department of Inorganic Chemistry / Materials Chemistry
TOFA 2010 Porto, Portuguese September 12-17, 2010
ContentContent
� Introduction and Bibliography
� The binary systems
• Cu-Sn
• Ni-Zn • Ni-Zn
� Our results on Ni-Sn-Zn
• Isothermal sections at 700, 800 and 900 °C
• Ternary phases
� Summary and Outlook
TOFA 2010 Porto, Portuguese September 12-17, 2010
°C
1000
800
600
Hard S
oldering
Silver Solders
Copper-Gold-AlloysTraditionalTraditional
SoldersSolders
°C
1000
800
600
Hard S
oldering
Silver Solders
Copper-Gold-AlloysTraditionalTraditional
SoldersSoldersH
ard Soldering
Silver Solders
Copper-Gold-AlloysTraditionalTraditional
SoldersSolders
400
200
Soft S
olderingH
ard Soldering
Tin-Lead Alloys
Bismuth Alloys
Cadmium-Zinc Solders
IndiumAlloys
Lead-Silver Alloys400
200
Soft S
olderingH
ard Soldering
Tin-Lead Alloys
Bismuth Alloys
Cadmium-Zinc Solders
IndiumAlloys
Lead-Silver Alloys
Soft S
olderingH
ard Soldering
Tin-Lead Alloys
Bismuth Alloys
Cadmium-Zinc Solders
IndiumAlloys
Lead-Silver Alloys
TOFA 2010 Porto, Portuguese September 12-17, 2010
Lead-free Solder materialsfor low temperature soft soldering are well establi shed:
� Ag-Sn (e.g., Sn-3.5Ag), Cu-Sn (e.g., Sn-0.7Cu)� Ag-Cu-Sn („SAC“, e.g.: Sn-3.7Ag-0.7Cu)� In-Sn (e.g., Sn-52In), Ag-In-Sn (e.g., Sn-2.8Ag-20In)� Bi-Sn(e.g.: Sn-58Bi)� Sn-Zn-X, where X = Cu, Ni, Ag, etc…
TOFA 2010 Porto, Portuguese September 12-17, 2010
Lead-free Solder materialswith T m ≥≥≥≥ 230°°°°C up to 350 °C are necessary for:
� power circuits with very high levels of conductivity required� automotive industry under bonnet applications - high
current and low voltage, high temperatures within the engine area
� step soldering approach ⇒ soldering of various levels of the package with different solders of different melting points
COST Action MP0602
Advanced Solder Materials for High Temperature Application (HISOLD)
Their nature, design, process and control in a mult i-scale domain
TOFA 2010 Porto, Portuguese September 12-17, 2010
Project leaders: Ales Kroupa and Andy Watson
~ 50 Scientist of 17 countries, 2007 - 2011
The constituent binariesThe constituent binaries
Also PD’s of well established binary systems of high technological importance can be improved!
We should not trust blindly in compilations and ass essments!
• Cu-Sn ⇒ very well established, but almost no experimental investigation since 1950ties! Unclear situation at the Cu-rich side concerningsince 1950ties! Unclear situation at the Cu-rich side concerning
ββββ (W-type) ↔↔↔↔ γγγγ (BiF 3-type) transformation
• Ni-Sn ⇒ new investigation by Schmetterer et al., published 2007
• Cu-Zn ⇒ new investigation ⇒ first results
• Ni-Zn ⇒ new investigation ⇒ preliminary results
• Sn-Zn ⇒ simple eutectic systems
TOFA 2010 Porto, Portuguese September 12-17, 2010
Literature informationLiterature information
Some information to the phase relations in the ternary Cu-Sn-Zn is available, literature data to Ni-Sn-Zn are very scarce:
Cu-Sn-Zn
• Several vertical sections, 2 isotherms, liquidus projection mainly based on early investigations from 1913-1937.
• Thermodynamic assessment: T. Jantzen and P.J. Spencer, 1998• Further information to the Cu/Zn corner: C. Vilarinho et al., 2004• Phase equilibria: C.-Y. Chou et al., 2006• Liquidus projection and modeling: Y.-C. Huang et al., 2009
Ni-Sn-Zn
• Little information to the Sn-Zn rich side: A. Mayer et al., 1968• Phase equilibria (isotherms at 200, 500, 800 °C): J. Chang et al; 2010
TOFA 2010 Porto, Portuguese September 12-17, 2010
The The binarybinary CuCu--ZnZn phasephase diagramdiagram
Cu-Zn PD from Massalski‘s compilation based on the assessment of experimental data byG.V. Raynor, 1944
• Extended solid solubility of Zn in Cu, small amount of Cu in Zn.• 5 IMC’s: β, δ (W-type), β’ (CsCl-type), γ (γ-brass type) and ε (Mg-type).• Ordering phases in the (Cu) solid solution (S. Müller and A. Zunger, 2001).
TOFA 2010 Porto, Portuguese September 12-17, 2010
• 5 samples have been prepared!• Annealed at various temperatures
650, 580, 490, and 400 °C• XRD, EPMA, DTA
The binary NiThe binary Ni--Zn phase diagramZn phase diagram
Ni-Zn PD from Massalski‘scompilation based on the assessmentof experimental data byP. Nash and Y.Y. Pan, 1987
• Extended solid solubility of Zn in Ni, no significant amount of Ni in Zn.• 4 IMC’s: β (CsCl-type), β1 (AuCu-type), γ (γ-brass type) and δ (CoZn13-type).• Metastable phase formation at Ni-rich side (e.g. Murakami et al., 1984).
TOFA 2010 Porto, Portuguese September 12-17, 2010
• First 4, finally 17 samples at all!• Annealed at various temperatures
900, 800, 700, 600, and 400 °C• XRD, EPMA, DTA
The The binarybinary NiNi--ZnZn phasephase diagramdiagram
• Ni-rich samples quenched from 900 and 800 °C ⇒ β1, (Ni) and up to 3 further phases: bcc Ph. (a=5.0431), “Ni3Zn” (AuCu3-type), trig. Ph. at. ~ 37 at.% Zn (LaF3-type?).
• long period shear structures Q at the Ni-rich part of the homogeneous range of γ-phase (γ-brass type) described by A.J. Morton (1974) and Nover and Schuster (1980) have been confirmed!
TOFA 2010 Porto, Portuguese September 12-17, 2010
IsothermalIsothermal sectionsection
ofof NiNi--SnSn--ZnZn
700 700 °° CC700 700 °° CC
• Extended ternary solid solubility of β and β1 towards Ni-Sn.• Pronounced ternary solid solubilities of Ni3Zn14, Ni3Sn2-HT and Ni3Sn-LT.• Two ternary compounds, T2 and T3.
TOFA 2010 Porto, Portuguese September 12-17, 2010
IsothermalIsothermal sectionsection
ofof NiNi--SnSn--ZnZn
800 800 °° CC
• Extended ternary solid solubility of β and β1 towards Ni-Sn.• Pronounced ternary solid solubilities of Ni3Zn14, Ni3Sn2-HT and Ni3Sn-LT.• Stabilization of Ni3Sn-HT (BiF3-type) by additions of Zn.• At least one ternary compound, T2.
TOFA 2010 Porto, Portuguese September 12-17, 2010
800 800 °° CC
IsothermalIsothermal sectionsection
ofof NiNi--SnSn--ZnZn
900 900 °° CC
• Extended ternary solid solubility of β towards Ni-Sn.• Pronounced ternary solid solubilities in Ni3Sn2-HT and Ni3Sn-LT.• Stabilization of Ni3Sn-HT (BiF3-type) by additions of Zn.
TOFA 2010 Porto, Portuguese September 12-17, 2010
900 900 °° CC
ττττ2 Ni5Sn4Zn
• Single Crystal XRD
• oC40, a = 4.147 Å, b = 12.582 Å,c = 11.642 Å, SG = Cmcm
• Results sent to ICSD,• Results sent to ICSD,CSD No. 421611
• Analogies to NiAs-type (Ni3Sn2), but not a direct superstructure!
• Isotypic structure Ni5Ga3Ge2 described by Bhargava and Schubert, 1974
TOFA 2010 Porto, Portuguese September 12-17, 2010
ττττ3 Ni2Sn2Zn
• Single Crystal XRD• cP40, a = 8.843 Å, SG = Pm-3m
• full occupation in the same cell not possible! Either Sn (40 %) or Zn (60 %), randomly distributed.
• Results sent to ICSD,CSD No. 422044
• Analogies to γ-brass type and Ru3Sn7-type structure
• Very similar structure described as Sn8.7(Ni0.5,Zn0.4,Cu0.1)10.4 by Larsson et al., 1994
TOFA 2010 Porto, Portuguese September 12-17, 2010
Summary and OutlookSummary and Outlook
• A new investigation of Ni-Zn applying various experimental techniques indicates ordering phases in α-(Ni) solid solution and the occurrence of an additional compound at ~ 37 at.% Zn with LaF3 –structure.
• Three isothermal sections of Ni-Sn-Zn at 700, 800, and 900 °C have been established based on available literature data and comprehensive experimental work.
• Two new ternary compounds could be found and their crystal structure • Two new ternary compounds could be found and their crystal structure solved.
• Isothermal sections at 1000 and 1100 °C are under construction.• A liquidus surface projection and various vertical sections will follow.• The binary systems Ni-Zn and Cu-Zn are under investigation. The new
experimental results promise a improved description of the phase relations.
• Cu-Sn-Zn is as well under investigation.
TOFA 2010 Porto, Portuguese September 12-17, 2010
AcknowledgementsAcknowledgements
Many thanks to:Many thanks to:
• All my colleagues of our department for the excellent collaboration
• The FWF for financing the projects No. P-21507-N19• The FWF for financing the projects No. P-21507-N19
• All the co-operation partner within our COST-Action MP0602
• The organizers of this meeting
TOFA 2010 Porto, Portuguese September 12-17, 2010
Thank You for Your attention!Thank You for Your attention!Thank You for Your attention!Thank You for Your attention!
TOFA 2010 Porto, Portuguese September 12-17, 2010