MVP Brochure 2020 DWMS DRAFT P1 September16-2016ai€¦ · - Pitch 2.54, 5.08mm 8.4mm MVP provides...
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SMT SPI Packaging Microelectronics The Full Spectrum of AOI Solutions Lead-Frame, Die, Epoxy and Wire Inspection - MVP 2020 DWMS The 2020 DWMS (Die Wire Metrology System) utilizes high-resolution imaging, quad color lighting and 3D to produce maximum defect, and measurement capabilities for Thin Board, Lead-Frame, Die and Wire Bond inspection.The MVP 2020 DWMS is configured as a compact unit with MVP’s own integrated leadframe magazine loaders and unloaders. A range of inline defect identification options are also available including Ink Marking, Punching and Wire Ripping. The MVP 2020 DWMS can deliver UPH in excess of 150,000 for leadframe Key features and inspection capabilities: Foreign Objects and Scratches Highest UPH in the Industry Lead Frame Gripper Transport Multiple Defect Handling Options including Ink Marking, Wire Ripping, Punch, XML Map Au, Al, Ag, and Cu Wires Wedge, Ball, and Stitch Bonds Crescent, and Tape Bonds Die Placement, Die Surface and Edge Damage Epoxy Flow and Spread Class 100 Clean Room Option Machine Vision Products, Inc., 3270D Corporate View, Vista, CA 92081 phone (760) 438-1138 . fax (760) 438-0660 . [email protected] . www.machinevisionproducts.com Discuss your SMT and microelectronics inspection application with Machine Vision Products, Inc and discover your solution applications.
Transcript of MVP Brochure 2020 DWMS DRAFT P1 September16-2016ai€¦ · - Pitch 2.54, 5.08mm 8.4mm MVP provides...
SMT
SPI
Packaging
Micro
electro
nics
The Full Spectrumof AOI Solutions
Lead-Frame, Die, Epoxy and Wire Inspection - MVP 2020 DWMS
The 2020 DWMS (Die Wire Metrology System) utilizes high-resolution imaging, quad color lighting and 3D to produce maximum defect, and measurement capabilities for Thin Board, Lead-Frame, Die and Wire Bondinspection.The MVP 2020 DWMS is configured as a compact unit with MVP’s own integrated leadframe magazine loaders and unloaders. A range of inline defect identification options are also available including Ink Marking, Punching and Wire Ripping. The MVP 2020 DWMS can deliver UPH in excess of 150,000 for leadframe
Key features and inspection capabilities:
Foreign Objects and Scratches
Highest UPH in the Industry
Lead Frame Gripper Transport
Multiple Defect Handling Options including
Ink Marking, Wire Ripping, Punch, XML Map
Au, Al, Ag, and Cu Wires
Wedge, Ball, and Stitch Bonds
Crescent, and Tape Bonds
Die Placement, Die Surface and Edge Damage
Epoxy Flow and Spread
Class 100 Clean Room Option
Machine Vision Products, Inc., 3270D Corporate View, Vista, CA 92081 phone (760) 438-1138 . fax (760) 438-0660 . [email protected] . www.machinevisionproducts.com
Discuss your SMT and microelectronics inspection application with Machine Vision Products, Inc and discover your solution
SMT AOI 3D Paste AOI BGA AOI Wire Bond AOI Die and Epoxy AOI Die Surface AOI
applications.
The Full Spectrumof AOI Solutions
Lead-Frame, Die, Epoxy and Wire Inspection - 850 DWMS
Worldwide Headquarters
Vista, California USA
+1 (760) 438-1138
European Headquarters
Fife, Scotland UK
+44 (0) 1383 629960
Asia-Paci c Headquarters
Shanghai, P.R.C.
+86 21 5046 2330
Key Capabilities
Inspection CapabilitiesThe MVP 2020 DWMS, when configured for Die, Wire-Bondand Lead-Frame inspection provides capabilitiesfor:
Using three standard options (between 1 and 6um resolution)
- Al, Ag, Cu and Au Wires down to 16 µm
- Wedge, Ball, and Stitch Bonds
- Crescent, and Tape Bonds
- Bond Layer
- Epoxy Flow and Spread
- Die Placement
- Die Surface
- Edge Damage
- SMT Components
Measurement ApproachThe MVP 2020 Microelectronics Inspection System provides both 2D and 3D measurements through the use of its proprietary Optics and 3D Laser or Projector based measurement system.
Software Features
All algorithms and measurement techniques provide for full Wire-bond, Die, Surface and packaginginspection, Software Packages Include:
Defect Marking OptionsMVP provide multiple options for defect identification, which include:
- SECS/GEM eMapping E142 format- Wire Removal/Cutting- Ink Marking- Punching- Laser Marking
Manufacturing DeploymentPost Die Bonder
- Die Surface Inspection
- Die Position (DPMS)
- Bond Layer Thickness (BLT)
- Lead Frame Inspection
- Epoxy Inspection
Post Wire Bonder- Wire Inspection (Au, Al, Cu and Ag)
- Lead Frame Inspection
- Die Surface Inspection
- Die Position (DPMS)
- Coating
Handling Options
Lot Solutions
- Magazine Lifters/Indexers
In-Line Solutions
- Single Lane
- Substrate/Lead Frame Handling
- Gripper Transport
Thin Board/Lead Frame Support
- Width 35mm to 130mm
- Length 140mm to 300mm
- Thickness 0.1mm to 1.5mm
Magazine Support
- Width 35mm to 135mm
- Length 145mm to 306mm
- Height 50mm to 200mm
- Pitch 2.54, 5.08mm 8.4mm
MVP provides complete handling solutions, whichinclude:
- ePro - Easy Program set-up with Wire Bond Import- iRepair - Defect Map and review software- Integrated Review for Increased Throughput- Full Microelectronics algorithm suite- Full AutoNetworker Support
Physical Specification- Footprint 2000mm x 1288- Height 1648mm- Weight 910KGs- Power 208-240VAX 50/60Hz, 10A- Air 60 PSI ,1CFM
- Die Tilt Inspection (3D)
