Multicomponent Cards - Actual Status and Upcoming Technologies ICMA – Spring Workshop 2007 Rome,...

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Multicomponent Cards - Actual Status and Upcoming Technologies ICMA – Spring Workshop 2007 Rome, 18th – 19th April Presented by: Thies Janczek

Transcript of Multicomponent Cards - Actual Status and Upcoming Technologies ICMA – Spring Workshop 2007 Rome,...

Page 1: Multicomponent Cards - Actual Status and Upcoming Technologies ICMA – Spring Workshop 2007 Rome, 18th – 19th April Presented by: Thies Janczek.

Multicomponent Cards -

Actual Status and Upcoming

Technologies

ICMA – Spring Workshop 2007

Rome, 18th – 19th April

Presented by: Thies Janczek

Page 2: Multicomponent Cards - Actual Status and Upcoming Technologies ICMA – Spring Workshop 2007 Rome, 18th – 19th April Presented by: Thies Janczek.

COCASO 2April, 18th 2007 ICMA Workshop, Rome

Content

Introduction Markets and Application Component status Card Production Considerations Summary

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Introduction

Early 60s Plastic Cards started Early 80s Chip Cards with Memory Chip Mid 80s Processor Cards Early 90s GSM SIM Cards Late 90s Open Platform OS Today Rapidly increasing Memory

Various Open Platform OSCryptographic MeansDual Interface Cards

Increa

sing co

mple

xity

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Introduction

Increasing number form factors due to contactless technologies

E.g. token, minicards

Integration of Electrical Functional Components Battery, Display, Solar Power Unit, Switch,

Sensors (e.g. Biometric) etc. Project driven Customizing Standard products are being defined Low Volume and High Costs (decreasing)

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Markets and ApplicationFields of

MULTICOMPONENT CARD

MULTI MEDIA(huge memory, sound…)

AUTHENTICATION(RFID long range, sensors…)

ACTIVESECURITY (Tamper proof )

Physical (Radiation,°C…)

TRACABILITY, Medicine

DEFENSE

ACCESSCONTROL

(Biometric, password)

LOYALTY, E-purse

(Balance, prepaid ) Cosmetic/Packaging (Sound, Physical measurement…)

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Markets and Applications

Higher level of trust User friendly interface Make the card a full-fledged secure,

autonomous computer

+=

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Markets and ApplicationGovernmental projects

Federal Financial Institutions Examination Council (FFIEC) requires dual factor authentication for electronic financial transactions

Government Homeland Security Presidential Directive

(HSPD) 12

FFIEC, “Authentication in an Internet Banking Environment,” Oct 12, 2005

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Markets and ApplicationEnd user considerations

Smart cards do not yet meet all users’ expectations efficiently enough to break barriers related to end user perception. The demand trends towards for:

Multi-application cards

Higher levels of TRUST (security and

control over data privacy)

And more user friendly interfaces

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Markets and ApplicationEnd user considerations

« SEE WHAT I DO» whenever / wherever I want:

the balance of the e-purse, to select an option e.g. ticket from the

transport ticketing application, or to verify the personal data stored in owners

health card, loyalty card or ID card application.

Off-line and contactless personal information to receive.

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Status of Components

88888888

GEMPLUS

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DISPLAY KEYPAD SWITCH BATTERY RELOADABLE B. ANTENNA DIODES

SENSORS BIOMETRIC SENSOR SOLAR POWER UNIT DATA STORAGE COMPUTING

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Status of ComponentsDisplay

DISPLAY: Various manufacturer are promoting their finished,

available products: CITALA, SMARTDISPLAYER, SiPix, PHILIPS,

ALIEN, MICROD, AVESO, SOFTPIXEL, E-ink, Gyricon, Kent Displays etc.

Display batches are varying in incoming control. Very low capability to produce in volume, planning,

quality Risk level is very high

© AVESO

© AVESO

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Status of ComponentsKeypad / Switch

Technology is widely available Various solutions employed

Metal domes Silicone pad with conductive element Anisotropic switch materials (e.g. piezzo

effect) Card material is part of the switching

element

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Status of ComponentsBattery primary/secondary

BATTERY Supplier 2 reliable volume supplier in the world. 1

In Europe (VARTA) In US (SOLICORE).

The others are still under development.(Panasonic, Stone, SAFT, NTK, Excelatron etc.)

Qualifications are launched. Batch variations must be solved.

Risk level is moderate to high

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Status of ComponentsAntenna / Conductive path

Various technologies are employed Printing of conductive paste Etching of Aluminium or Copper Wire embedding technologies

Interconnection to the components has to be reliable

Welding Gluing Elastic conductive materials

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Status of ComponentsLED - Light Emitting Diodes

Available commercial product Mini-flashlight with customizable LED colours also into shaped cards and mini cards Battery long-lasting (> lifetime) Environmentally safe to throw away

Diodes have low power consumption and are available in many colours

Small chips easy to be connected on board

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Status of ComponentsSensors - Biometric Sensor

Various sensor cards have been developed and are employed in the field.

UV, humidity, temperature, chemical OFET’s Main market is pharma for consumer

products No/low activities to incorporate biometric (e.g.

fingerprint) sensor into cards

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Status of ComponentsSolar Power Unit

Inverse technology to the display technology

No development activities for the application on

cards

Lack of application

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Zur Anzeige wird der QuickTime™ Dekompressor „TIFF (Unkomprimiert)“

benötigt.

Status of ComponentsData Storage / Computing

Up to 1 Gigabyte realised on card SIM cards are the driver for the

development of high memory modules Cards with high memory and USB

interface introduced

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Status of ApplicationsS-P-S - Display Card Technology

ID-1 display card production set up for volume

Bistable display Lack of component availability

in industrial scale (i.e. not just for sampling)

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Status of ApplicationsBundesdruckerei - Display on ID

Contactless ID-1 display card samples on CeBit 2007

Bistable display No internal battery Standard contactless

smartcard reader supplies power for the card (ISO 14443)

New fields of application

Dis

pla

y D

em

o C

ard

200

7

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ISO7810/11 certified, ISO banking card format, NagraID’s DisplayCard can be carried in a wallet and is readily available at all time.

Its operation is very easy : one push on a button situated on the card leads to the generation of a new dynamic password sequence. The user types this password on its terminal (computer, phone, PDA) as well as his PIN code.

Status of ApplicationsNagra ID - Display Card OTP

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Status of ApplicationsSPS - Sensor Card

Display Cards Sensor Cards

Fingerprint means Analog sensor

Audio Cards Active RFID Label Combinations

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Multi Component Cards- Summary of Applications

Display Cards Sensor Cards Audio Cards Active RFID Label Data Storage Light Cards Combinations

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Multi Component CardsProduction

Cold to Warm (<70°C) lamination technologies have been developed

Inlay and complete card set up’s

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Multi Technology Cards- Technology Challenges

Communication and Network Protocol Systems and Software Smart Card Accepting Devices, Interfaces Embedded Peripherals, Subsystems and

Microsystems High-End Cryptography, Tamper-Proof

and Security Technologies Micro-Electronics

RESET - Roadmap for European Research on Smartcard rElated Technologies

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Multi Component Cards- Development

Various activities specific to smart cards High development activity for certain

components Driving factor are electronic devices (e.g.

PDA, military, mobile, electronic paper)

DISPLAY - BIOMETRIC SENSOR - KEYPAD - SWITCH - DIODES - BATTERY - ANTENNA - SENSORS -

ACCUMULATOR - SOLAR POWER UNIT - DATA STORAGE - COMPUTING

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Multi Component Cards- Driving factors

Business opportunities and market requirements E-Business Services Protection and Management of Digital Content Contactless Access

Consumer requirements Direct Interactivity Fraud Reduction Multi Application

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Summary

Industrial volume production is started (> 60k display cards in the market)

Lack of component availability in industrial scale Products with complex electronic circuits are

developed High R&D activity will lead to new components

and technologies for smart cards High potential for lucrative business cases

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THANK YOU

FOR YOUR ATTENTION

Multicomponent Cards - Actual Status and Upcoming Technologies

More Information:COCASO – Thies Janczek – Moewenstrasse 5a – 24113 Molfsee – Germany

Phone: +49-(0)4347-701433 – Email : [email protected]

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