A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th...

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A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek

Transcript of A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th...

Page 1: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

A Survey on Dual Interface and

Multi Technology Cards

ICMA – EXPO 2004

Prague, 17th – 20th October

Presented by: Thies Janczek

Page 2: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

COCASO 2October, 19th 2004 ICMA Expo, Prague

Content

Introduction DIC Dual Interface Cards

Application, Technology, Challenges Multi Technology Cards

Status on Components and Applications Technology and Development

Driving factors Summary

Page 3: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

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Introduction

Early 60s Plastic Cards started Early 80s Chip Cards with Memory Chip Mid 80s Processor Cards Early 90s GSM SIM Cards Late 90s Open Platform OS Today Rapidly increasing Memory

Various Open Platform OSCryptographic MeansDual Interface Cards

Increa

sing co

mple

xity

Page 4: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

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Introduction

Increasing Employment of Dual Interface Cards Dedicated Contactless and Contact Usage

Integration of Electrical Functional Components Battery, Display, Solar Power Unit, Switch,

Sensors (e.g. Biometric) etc. Project driven Customizing, Non Standard Low Volume and High Costs

Increa

sing co

mple

xity

Page 5: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

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Dual Interface Card- Application

Wireless Interface for Identification Access Low security ID

Contact Interface for Security/Signature PKI for Transaction Data Exchange with High Rates/Volume High Security ID (e.g. Biometric)

Local and National ID Documents Banking, Internet, E-commerce

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Dual Interface Card- Technology

Module – Contacts – Antenna Electrical Connection by

Isotropic conductive adhesive (ICA) Welding Technologies (Solder) Mechanical Connection (Crimping) Anisotropic conductive adhesive (ACA)

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adhesive matrix connection particals

adhesive matrix

microconnections micro contacts

Dual Interface Card- Technology

*Anisotropic Conductive Adhesive

ACA* Technique Adhesive conducting the electricity

just in one direction Module adhesion and contact to the

antenna in one step

Page 8: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

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Dual Interface Card- Challenges

Connection Module – Antenna Mechanical and Environmental stress Lifetime up to 10 years

Bridging technology from contact to contactless

Page 9: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

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Multi Technology Cards- Status of Components

DISPLAY KEYPAD SWITCH BATTERY RELOADABLE B. ANTENNA DIODES

SENSORS BIOMETRIC SENSOR SOLAR POWER UNIT DATA STORAGE COMPUTING

Page 10: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

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Multi Technology Cards- Status of Applications

Display Cards Sensor Cards

Fingerprint means Analog sensor

Page 11: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

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External interface (ISO)

Button MCM-Module

Internal interface

ExternalPower source

Sensor Array

Microcontroller

Internal power source

Sensorcard – presented by ORGA at Cartes 2000

Multi Technology Cards- Status of Applications

Page 12: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

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Multi Technology Cards- Status of Applications

Display Cards Sensor Cards

Fingerprint means Analog sensor

Audio Cards Active RFID Label Combinations

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Multi Technology Cards- Technology Challenges

Communication and Network Protocol Systems and Software Smart Card Accepting Devices, Interfaces Embedded Peripherals, Subsystems and

Microsystems High-End Cryptography, Tamper-Proof

and Security Technologies Micro-Electronics

RESET - Roadmap for European Research on Smartcard rElated Technologies

Page 14: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

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Multi Technology Cards- Development

Few development activities specific to smart cards

High development activity for certain components Driving factor are electronic devices (e.g.

PDA, Mobile, electronic paper)DISPLAY - BIOMETRIC SENSOR - KEYPAD - SWITCH -

DIODES - BATTERY - ANTENNA - SENSORS - AKKUMULATOR - SOLAR POWER UNIT -

DATA STORAGE - COMPUTING

Page 15: A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

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Multi Technology Cards- Driving factors

Business opportunities and market requirements E-Business Services Protection and Management of Digital Content Contactless Access

Consumer requirements Direct Interactivity Fraud Reduction Multi Application

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Summary

Increasing DIC demand will lead to a reliable Module/Antenna connection

Products with Complex Electronic Circuits have been Proposed

High R&D Activity will Lead to New Components and Technologies for Smart Cards

Industrial High Volume Production not until 2006 High Potential for Lucrative Business Cases

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THANK YOU

FOR YOUR ATTENTION

A Survey on Dual Interface and Multi Technology Cards

More Information:COCASO – Thies Janczek – Moewenstrasse 5a – 24113 Molfsee – Germany

Phone: +49-(0)4347-703526 – Email : [email protected]

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