A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th...
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Transcript of A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th...
A Survey on Dual Interface and
Multi Technology Cards
ICMA – EXPO 2004
Prague, 17th – 20th October
Presented by: Thies Janczek
COCASO 2October, 19th 2004 ICMA Expo, Prague
Content
Introduction DIC Dual Interface Cards
Application, Technology, Challenges Multi Technology Cards
Status on Components and Applications Technology and Development
Driving factors Summary
COCASO 3October, 19th 2004 ICMA Expo, Prague
Introduction
Early 60s Plastic Cards started Early 80s Chip Cards with Memory Chip Mid 80s Processor Cards Early 90s GSM SIM Cards Late 90s Open Platform OS Today Rapidly increasing Memory
Various Open Platform OSCryptographic MeansDual Interface Cards
Increa
sing co
mple
xity
COCASO 4October, 19th 2004 ICMA Expo, Prague
Introduction
Increasing Employment of Dual Interface Cards Dedicated Contactless and Contact Usage
Integration of Electrical Functional Components Battery, Display, Solar Power Unit, Switch,
Sensors (e.g. Biometric) etc. Project driven Customizing, Non Standard Low Volume and High Costs
Increa
sing co
mple
xity
COCASO 5October, 19th 2004 ICMA Expo, Prague
Dual Interface Card- Application
Wireless Interface for Identification Access Low security ID
Contact Interface for Security/Signature PKI for Transaction Data Exchange with High Rates/Volume High Security ID (e.g. Biometric)
Local and National ID Documents Banking, Internet, E-commerce
COCASO 6October, 19th 2004 ICMA Expo, Prague
Dual Interface Card- Technology
Module – Contacts – Antenna Electrical Connection by
Isotropic conductive adhesive (ICA) Welding Technologies (Solder) Mechanical Connection (Crimping) Anisotropic conductive adhesive (ACA)
COCASO 7October, 19th 2004 ICMA Expo, Prague
adhesive matrix connection particals
adhesive matrix
microconnections micro contacts
Dual Interface Card- Technology
*Anisotropic Conductive Adhesive
ACA* Technique Adhesive conducting the electricity
just in one direction Module adhesion and contact to the
antenna in one step
COCASO 8October, 19th 2004 ICMA Expo, Prague
Dual Interface Card- Challenges
Connection Module – Antenna Mechanical and Environmental stress Lifetime up to 10 years
Bridging technology from contact to contactless
COCASO 9October, 19th 2004 ICMA Expo, Prague
Multi Technology Cards- Status of Components
DISPLAY KEYPAD SWITCH BATTERY RELOADABLE B. ANTENNA DIODES
SENSORS BIOMETRIC SENSOR SOLAR POWER UNIT DATA STORAGE COMPUTING
COCASO 10October, 19th 2004 ICMA Expo, Prague
Multi Technology Cards- Status of Applications
Display Cards Sensor Cards
Fingerprint means Analog sensor
COCASO 11October, 19th 2004 ICMA Expo, Prague
External interface (ISO)
Button MCM-Module
Internal interface
ExternalPower source
Sensor Array
Microcontroller
Internal power source
Sensorcard – presented by ORGA at Cartes 2000
Multi Technology Cards- Status of Applications
COCASO 12October, 19th 2004 ICMA Expo, Prague
Multi Technology Cards- Status of Applications
Display Cards Sensor Cards
Fingerprint means Analog sensor
Audio Cards Active RFID Label Combinations
COCASO 13October, 19th 2004 ICMA Expo, Prague
Multi Technology Cards- Technology Challenges
Communication and Network Protocol Systems and Software Smart Card Accepting Devices, Interfaces Embedded Peripherals, Subsystems and
Microsystems High-End Cryptography, Tamper-Proof
and Security Technologies Micro-Electronics
RESET - Roadmap for European Research on Smartcard rElated Technologies
COCASO 14October, 19th 2004 ICMA Expo, Prague
Multi Technology Cards- Development
Few development activities specific to smart cards
High development activity for certain components Driving factor are electronic devices (e.g.
PDA, Mobile, electronic paper)DISPLAY - BIOMETRIC SENSOR - KEYPAD - SWITCH -
DIODES - BATTERY - ANTENNA - SENSORS - AKKUMULATOR - SOLAR POWER UNIT -
DATA STORAGE - COMPUTING
COCASO 15October, 19th 2004 ICMA Expo, Prague
Multi Technology Cards- Driving factors
Business opportunities and market requirements E-Business Services Protection and Management of Digital Content Contactless Access
Consumer requirements Direct Interactivity Fraud Reduction Multi Application
COCASO 16October, 19th 2004 ICMA Expo, Prague
Summary
Increasing DIC demand will lead to a reliable Module/Antenna connection
Products with Complex Electronic Circuits have been Proposed
High R&D Activity will Lead to New Components and Technologies for Smart Cards
Industrial High Volume Production not until 2006 High Potential for Lucrative Business Cases
COCASO 17October, 19th 2004 ICMA Expo, Prague
THANK YOU
FOR YOUR ATTENTION
A Survey on Dual Interface and Multi Technology Cards
More Information:COCASO – Thies Janczek – Moewenstrasse 5a – 24113 Molfsee – Germany
Phone: +49-(0)4347-703526 – Email : [email protected]
COCASO 18October, 19th 2004 ICMA Expo, Prague